A touch-sensing module includes a sensing unit, an optical unit, a flexible circuit unit, and a transparent cover. The transparent cover is disposed on the optical unit. The sensing unit, the optical unit, and the transparent cover define an accommodating space. A connecting space is defined between the transparent cover and the flexible circuit unit. A fixing layer is disposed in the connecting space to connect the transparent cover and the flexible circuit unit.

A display device includes a display panel including panel pads adjacent to the side surface of a display panel; connection pads disposed on the side surface of the display panel and connected to the panel pads; and a circuit board disposed on the side surface of the display panel and including lead signal lines directly bonded to the connection pads, wherein the connection pads include a first connection pad, a second connection pad disposed on the first connection pad, and a third connection pad disposed on the second connection pad, and the first connection pad is in contact with corresponding one of the panel pads, and the third connection pad is directly bonded to corresponding one of the lead signal lines.

A mounting substrate manufacturing apparatus includes a first FPC-side pressing member 51 configured to press and heat a first mounting component group 31 including one edge side mounting component that is a flexible printed circuit board 13 arranged on one edge in an arrangement direction in which flexible printed circuit boards 13 arranged on an array substrate 11B and thermally press and bond the first mounting component group 31 on the array substrate 11B, and a second FPC-side pressing member 52 arranged next to the first FPC-side pressing member 51 in the arrangement direction and configured to press and heat a second mounting component group 32 including all the flexible printed circuit boards 13 except for the first mounting component group 31 and thermally press and bond the second mounting component group 32 on the array substrate 11B.

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a liquid crystal layer and a light source that emits light to the liquid crystal layer, and the first substrate includes a first portion opposing the second substrate and having a first thickness and a second portion not opposing the second substrate and having a second thickness which is less than the first thickness, and the light source is disposed on the second portion, and the light source includes a first surface opposing the second portion and a second surface opposing the first surface, and a wiring substrate is disposed on the second surface so that the wiring substrate does not protrude with respect to the second substrate in a thickness direction.

Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection includes a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component. A thickness of the first adhesive layer is 5 μm or less.

The present disclosure provides a flexible display module and a method for manufacturing the flexible display module. The flexible display module includes a flexible display panel, a driving chip and a circuit board. The flexible display panel includes a display region and a bonding region, and the driving chip and the circuit board are arranged at the bonding region. The circuit board includes a first flexible printed circuit and a first printed circuit board provided with an electronic element, the first printed circuit board is coupled to one end of the first flexible printed circuit, and the first flexible printed circuit includes a bonded portion coupled to the bonding region of the flexible display panel. The first flexible printed circuit is bent so that a first space is defined by the first flexible printed circuit, the first printed circuit board and the flexible display panel.

A hot-pressing device and process for an ACF bonding structure are provided. The hot-pressing device includes a transfer module and a first mounting plate connected to the transfer module. A negative-pressure adsorption module, at least one positioning module, and a lifting module are arranged on the first mounting plate. Pressing modules with hot-pressing assemblies are arranged at four corners close to the first mounting plate. Cleaning modules corresponding to the pressing modules are arranged in the transfer module below the first mounting plate. The present disclosure can quickly remove glue overflowing on a heat conduction element in the hot-pressing module by the cleaning module to ensure the surface flatness of a second part of the heat conduction element for hot-pressing and satisfactory resistance of an ACF connected to a substrate after hot-pressing.

Provided is a device configured to manufacture a conductive film including a rotating member, a first syringe, and a second syringe. The rotating member rotates about an axis extending in a first direction. The first syringe is disposed over a first portion of the rotating member, and is configured to discharge a first polymer and conductive balls. The second syringe is adjacent to the first syringe, and is configured to discharge a second polymer.