Provided is a method of manufacturing an electrical connection structure which includes a female connection structure having an inner conductive material inside an insertion hole of a female connection member, and a male connection structure having a conductive column configured to be inserted into and fixed to the insertion hole to be in contact with the inner conductive material, and formed to protrude from a male connection member. The method includes preparing insulating members used for the female connection member and the male connection member, and forming the inner conductive material and the column by patterning a conductive material on each of the insulating member using a photolithography process.

A multi head flexible printed circuit (FPC) ultraviolet laser drilling device and a using method thereof are provided, the device includes a body frame; a support frame connected to the body frame; a first movement assembly disposed on the body frame and configured to move along a Y-axis direction of the body frame; a second movement assembly disposed on the support frame and configured to move along an X-axis direction of the body frame; a third movement assembly disposed on the second movement assembly and configured to move along a Z-axis direction of the body frame; a suction assembly slidably connected to the first movement assembly and configured to fix one or more FPC boards; and a drilling assembly including drilling parts. The device can realize the simultaneous processing of FPC board by adopting two or more processing modes, thereby improving the processing efficiency.

A component is disclosed. A component includes an elongated body, with a first end and a second end; and one or more tabs at the first end and the second end, the tabs configured to have a lower tensile strength than other regions of the component.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space

An interconnect for connecting a first electronic circuit to a second, external stretchable electronic circuit device comprises: conductive lines of the first electronic circuit arranged in a plane; connectors configured to define an overlap in the plane between each end of the conductive lines with a corresponding end of stretchable conductive lines providing an electrical connection between the conductive lines and the stretchable conductive lines over the entire overlap; and at least one anchoring structure for providing an anchoring of the first electronic circuit with the second, external stretchable electronic circuit device, wherein the at least one anchoring structure provides anchoring transverse to the plane in anchoring positions on opposite sides of the overlap.

A battery pack includes: a battery cell including first and second surfaces arranged at opposite sides and at which first and second electrodes are respectively located, and a side surface connecting the first and second surfaces to each other; a first circuit board arranged on the first surface and connected to the first electrode; a second circuit board arranged on the second surface; a first flexible line extending from a first side of the first circuit board to the second circuit board while surrounding a portion of the side surface of the battery cell; and a second flexible line extending from a second side of the first circuit board to the second surface of the battery cell while surrounding another portion of the side surface of the battery cell and connected to the second electrode.

Disclosed is an LED assembly having an omnidirectional light field. The LED assembly has a transparent substrate with first and second surfaces facing to opposite orientations respectively. LED chips are mounted on the first surface and are electrically interconnected by a circuit. A transparent capsule with a phosphor dispersed therein is formed on the first surface and substantially encloses the circuit and the LED chips. First and second electrode plates are formed on the first or second surface, and electrically connected to the LED chips.

A discrete electrical component is disclosed, including a component member having at least one lead; and a base member on which the component member is supported. The electrical component further includes at least one compliant pin member, each compliant pin member having a first end portion configured for press-fit engagement in a printed circuit board and a second end portion electrically connected to the at least one lead of the component member. The at least one compliant pin at least partly extends through or into the base member.

Systems for reducing leakage at a pressure barrier in a gas meter, are provided including first and second gaskets; a flexible circuit having variable thicknesses, such that a thicker portion of the flexible circuit is provided between the first and second gaskets; and a mounting plate on the flexible circuit, the mounting plate compressing the flexible circuit between the first and second gaskets on a non-pressurized side of the pressure barrier of the gas meter. Related flexible circuits and gas meters are also provided.

A circuit board structure includes a rigid circuit board, a flexible circuit board, a plurality of conductive bumps, and a plurality of spacers. The rigid and flexible circuit boards are stacked one above the other. The conductive bumps are formed between the rigid and flexible circuit boards. The spacers are formed between the rigid and flexible circuit boards and spaced apart from the conductive bumps.