A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.

A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

Provided is a connector-mounted board manufacturing method for manufacturing a connector-mounted board, the connector-mounted board including a circuit board, on which a terminal and an electronic component are mounted, and a connector housing attached to the terminal. The connector-mounted board manufacturing method includes: executing a mounting process of mounting the terminal and the electronic component on the circuit board; and executing an attaching process of attaching the connector housing to the terminal after the mounting process has been executed.

A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.

Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

A secondary detection system for integrating automated optical inspection and neural network and a method thereof are disclosed. In the secondary detection system, an automated optical inspection apparatus performs automated optical inspection for pin solder joints on circuit board, and when a detection result indicates abnormal condition, the secondary detection device calculates a detection image probability value based on the component image feature and the template image feature, and calculate pin solder joint image probability values based on the component pin solder joint image feature and the template pin solder joint image feature through siamese neural network, to obtain a minimum probability value among the detection image probability value and pin solder joint image probability values. The minimum probability value is used to determine whether to change the detection result, thereby providing accurate detection result of automated optical inspection and increasing a first pass yield.

A high-frequency line substrate is mounted on a printed circuit board. The printed circuit board includes a first high-frequency line. The high-frequency line substrate includes a second high-frequency line and lead pins that connect the first high-frequency line and the second high-frequency line. At the contact portions between the signal lead pins and the second high-frequency line of the high-frequency line substrate, and at the contact portions between the ground lead pins and the second high-frequency line of the high-frequency line substrate, the height of the ground lead pins from an upper surface of the printed circuit board is greater than the height of the signal lead pins.

A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

A multilayer circuit board includes an upper surface and an opposing lower surface. An electrically insulating layer is disposed between the upper and lower surfaces. A plurality of electrically conductive upper and lower rear pads are disposed proximate a rear edge on the respective upper and lower surfaces for termination of a plurality of wires. The upper and lower rear pads include respective upper and lower rear ground pads substantially aligned with each other and configured for termination of ground wires. A plurality of electrically conductive front pads are disposed proximate a front edge for insertion into a connector and electrically connected to the upper and lower rear pads. An electrically conductive via extends from the upper rear ground pad to the lower rear ground pad and makes electrical and physical contact with each of the upper and lower rear ground pads.

Intraluminal ultrasound imaging device, systems and methods (e.g., method of fabricating the device) are provided. In some embodiments, the intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient, and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member and configured to obtain imaging data of the body lumen. The ultrasound scanner assembly includes a flexible substrate, a first under-bump metallization (UBM) layer over the flexible substrate, a first solder feature over the first UBM layer, and a first electronic component electrically connected to the first solder feature.