A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.

A die package structure and a method for fabricating the same are provided. The method includes: fixing a first die on a package base; aligning first hollow pads of a flexible printed circuit board with first pads of the first die, and fixing the flexible printed circuit board; soldering the first hollow pads to the first pads; fixing a second die on the flexible printed circuit board to overlap with the first die; folding the flexible printed circuit board, such that second hollow pads of the flexible printed circuit board are aligned with second pads of the second die, and signal test pads of the flexible printed circuit board are exposed; fixing the flexible printed circuit board on the second die; soldering the second hollow pads to the second pads; soldering metal wires to the signal test soldering pads; and soldering package pins to the metal wires.

A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a first main surface and a second main surface that face in a first direction, internal electrodes laminated in the first direction, and a penetrating hole that has a diameter decreasing from the first main surface toward the second main surface and includes a tapered surface, the internal electrodes being exposed on the tapered surface. The external electrode includes a first conductive layer disposed along the tapered surface, and a second conductive layer disposed along the first main surface and connected to the first conductive layer.

According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion (“CTE”). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

A composite wiring substrate includes a first wiring substrate including a first connection terminal, a second wiring substrate including a second connection terminal facing the first connection terminal, and a joint material joining the first connection terminal and the second connection terminal. The first outline of the first connection terminal is inside the second outline of the second connection terminal in a plan view. The joint material includes a first portion formed of an intermetallic alloy of copper and tin, and contacting each of the first connection terminal and the second connection terminal, and a second portion formed of an alloy of tin and bismuth, and including a portion between the first outline and the second outline in the plan view. The second portion contains the bismuth at a higher concentration than in the eutectic composition of a tin-bismuth alloy, and is separated from the second connection terminal.

A device includes a porous substrate that include a plurality of pores and a plurality of nanodevices dispersed in at least a portion of the plurality of pores. Each of the plurality of nanodevices includes a magnetic nanowire and a solder nanoparticle. The magnetic nanowires are configured to generate heat in response to an alternating magnetic field. The solder nanoparticles are configured to receive a portion of the heat and reflow to connect to one or more devices or surfaces.

A conductive solder pad for a ball grid array (BGA) includes a concave edge to accommodate a via that exits a substrate at a position at the surface of the substrate that is offset from the solder pad. The offset arrangement of the via and solder pad allow for differential thermal expansion of the substrate material and the via material with reduced risk of cracking or fracturing the solder joint. The concave edge of the solder pad provides a gap from the via to avoid unintended electrical connections while maintaining the solder-joint pitch of the BGA.

A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.

A wiring board includes a resin insulating layer having a component mounting surface, first connection pads formed on the component mounting surface of the resin insulating layer, second connection pads formed on the component mounting surface of the resin insulating layer such that the second connection pads are surrounding the first connection pads, and a protruding part including a metal material and formed on the component mounting surface of the resin insulating layer such that a portion of the protruding part is embedded in the resin insulating layer and that the protruding part is positioned between the first connection pads and the second connection pads and surrounding the first connection pads.

A surgical stapling device includes a handle assembly, an adapter assembly, and a reload assembly that is releasably secured to the adapter assembly to facilitate replacement of the reload assembly after each use of the stapling device. The reload assembly includes an authentication chip and printed circuit board assembly that is constructed to provide electrical contacts that are self-supporting to allow for automated assembly of the electrical contacts and provide a more reliable, robust electrical connection between the electrical contacts and the chip.