A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 μm and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H.sub.1, and a height of the solder particle is designated as H.sub.2, H.sub.1<H.sub.2 is established.

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

A solder cutting device includes a first holding part, a first drive part that feeds a tape-like solder material held by the first holding part in a first direction, a cutting part for cutting the tape-like solder material, and a second drive part that actuates the cutting part. The first drive part is a first actuator that is electrically-driven and that converts a rotational motion of a rotating body, the axis of which extends in the first direction, into a motion in the first direction. The second drive part includes a second actuator that moves a moving body in the first direction, and a connection portion that converts the motion of the moving body into a motion in a second direction and transmits the motion to the cutting part.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

An electronic component module includes a plurality of components having terminals and arranged along a plane, a sealing resin portion that covers and seals these components and has a plane as one plane of an outer surface, and a shield layer that covers the outer surface of the sealing resin portion. Terminals of the plurality of components are exposed in a state of protruding from the plane of the sealing resin portion, and the terminals of these components protruding from the plane of the sealing resin portion are used as mounting terminals of the electronic component module.

A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.

Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.

A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

An apparatus and method for manufacturing a semiconductor package structure are provided. The method includes: providing a process line comprising a first semiconductor manufacturing portion configured to provide a first operation including a first process step, and a second semiconductor manufacturing portion configured to provide a second operation including a second process step; passing a packaging structure through the second semiconductor manufacturing portion, wherein the second semiconductor manufacturing portion applies the second process step to the packaging structure; passing the packaging structure through the first semiconductor manufacturing portion, wherein the first semiconductor manufacturing portion applies the first process step to the packaging structure; and passing the packaging structure through the second semiconductor manufacturing portion again without applying the second process step thereon.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.