A method for manufacturing a circuit board with a heat dissipation structure comprises: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board with a heat dissipation structure.

A disclosed apparatus may be a circuit board that includes (1) a first unique sublaminate that includes a plurality of ground layers and a plurality of signal layers, (2) a second unique sublaminate that includes a plurality of power layers and another plurality of signal layers, and (3) a symmetry axis that bisects the circuit board between the first unique sublaminate and the second unique sublaminate, wherein the first unique sublaminate and the second unique sublaminate are distinct from one another. Various other apparatuses, systems, and methods are also disclosed.

A disclosed apparatus may be a circuit board that includes (1) a first unique sublaminate that includes a plurality of ground layers and a plurality of signal layers, (2) a second unique sublaminate that includes a plurality of power layers and another plurality of signal layers, and (3) a symmetry axis that bisects the circuit board between the first unique sublaminate and the second unique sublaminate, wherein the first unique sublaminate and the second unique sublaminate are distinct from one another. Various other apparatuses, systems, and methods are also disclosed.

A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

A multilayer wiring substrate according to the present invention includes a dielectric base body, a signal line in or on the dielectric base body, a ground conductor in the dielectric base body, and a graphite sheet in the dielectric base body. The dielectric base body is a laminate including dielectric sheets stacked on top of each other. The ground conductor and the signal line face each other in a stacking direction of the dielectric sheets. The ground conductor overlaps the signal line when viewed in plan in the stacking direction. The graphite sheet and the signal line face each other in the stacking direction without the signal line being located between the graphite sheet and the ground conductor. An upper surface of the graphite sheet is coplanar with an upper surface of the ground conductor or is located below the upper surface of the ground conductor.

A multi-phase busbar for conducting electric energy includes: a base layer of an insulating material; a first conducting layer of a sheet metal; a first insulating layer of an insulating material arranged on the first conducting layer; a second conducting layer of a sheet metal arranged on the insulating layer; and a second layer of an electrically insulating material which is arranged on the second conducting layer. The first and/or second insulating layers include spacers, each spacer including a layer of a rigid insulating material. At least one of the spacers is glued to an electrically insulating coating of the first and/or second conducting layer, and/or at least one of the spacers is glued to an electrically conductive surface of an uncoated first and/or second conducting layer by an adhesive.

An electro-optical structure including at least one optical component and a plurality of electric components arranged on a common printed circuit board is disclosed herein. The printed circuit board includes a plate-shaped base body made of molybdenum or an Invar material. An optical bench including a printed circuit board with a plate-shaped base body of molybdenum or an Invar material is also disclosed herein.

A multi-phase busbar for conducting electric energy includes: an insulating base layer made of an insulating material; a first conducting layer made of a sheet metal arranged on and adhesively bonded to the base layer; a first connecting pin mounted to the first conducting layer which extends in a direction with respect to the first conducting layer; a first insulating layer arranged on and adhesively bonded to the first conducting layer; a second conducting layer made of a sheet metal arranged on and adhesively bonded to the first insulating layer, the second conducting layer including a second connecting pin which extends in a direction parallel to the first connecting pin; and a second insulating layer arranged on and adhesively bonded to the second conducting layer. The second conducting layer and the first and second insulating layer each include at least one pinhole through which the first connecting pin projects.

An electro-optical structure including at least one optical component and a plurality of electric components arranged on a common printed circuit board is disclosed herein. The printed circuit board includes a plate-shaped base body made of molybdenum or an Invar material. An optical bench including a printed circuit board with a plate-shaped base body of molybdenum or an Invar material is also disclosed herein.

A multi-phase busbar can include a first conducting layer, a first conducting pin, a first insulating layer, and a second conducting layer. The first conducting layer can include a sheet metal coated with an electrically insulating material. The first conducting pin can be mounted to the first conducting layer. The first conducting pin can extend in a direction perpendicular to the first conducting layer. The first insulating layer of a rigid insulating material can be arranged on the first conducting layer. The first insulating layer can define an opening through which the first conducting pin projects. The second conducting layer can include a sheet metal coated with an electrically insulating material, the second conducting layer comprising a first pinhole through which the first conducting pin projects and a second conducting pin which extends in a direction parallel to the first conducting pin.