A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.

A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.

A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.

A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an insertion groove extending from an end portion thereof toward the base portion, and a first fin portion and a second fin portion which are separated by the insertion move; and a connector included in the base portion, the connector being above the insertion groove in plan view, and the connector being configured to electrically connect a first heat generating component to be inserted into the insertion groove from a side of the first surface and a second heat generating component to be disposed on a side of the second surface.

A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material.

A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.

An electrical connector assembly includes an electrical connector and the pick-up cap assembled upon the housing of the electrical connector. A plurality of contacts are disposed in the housing and covered by the pick-up cap. The pick-up cap includes a pair of first side walls, and the housing includes a pair of first side faces corresponding to the pair of corresponding first side walls. Each first side face forms a pair of locking recesses. Each first side wall includes an operation section and a pair of latches. The operation section includes a cavity in the first side wall and a raised section above the cavity. Each latch includes a spring arm, and a hook located at the end of the spring arm and engaged within the corresponding locking recess. The latch is located within the boundary of the housing without extending beyond the corresponding side face.

An electronic device module includes: a first board having first surface and a second surface facing opposite directions; electronic devices mounted on the first and second surfaces, respectively; a second board bonded to the second surface and including a device receiving part in which a device, among the electronic devices, is received, wherein the device receiving part is formed by a central opening of the second board; a first flexible printed circuit board including a first end part and a second end part disposed on opposite ends of the first flexible printed circuit board, wherein the first flexible printed circuit board is more flexible than the first and second boards, and wherein the first end part is formed integrally with the second board, is electrically connected to one end of the second board, and extends outside the second board; and a connector mounted on the second end part.

A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.

An electronic device module includes: a first board having first surface and a second surface facing opposite directions; electronic devices mounted on the first and second surfaces, respectively; a second board bonded to the second surface and including a device receiving part in which a device, among the electronic devices, is received, wherein the device receiving part is formed by a central opening of the second board; a first flexible printed circuit board including a first end part and a second end part disposed on opposite ends of the first flexible printed circuit board, wherein the first flexible printed circuit board is more flexible than the first and second boards, and wherein the first end part is formed integrally with the second board, is electrically connected to one end of the second board, and extends outside the second board; and a connector mounted on the second end part.