An integrated circuit (IC) socket comprising a housing with a land side, an opposing die side, and sidewalls around a perimeter of the housing. The housing comprises a first dielectric. A plurality of socket pins extends from the land side of the housing through socket pin holes in the housing over the die side of the housing. A second dielectric is within the interstitial regions between the socket pins and sidewalls of the socket pin holes. A frame structure extends around at least a portion of the perimeter of the housing, and a mesh structure is embedded within the first dielectric. The mesh structure has plurality of mesh filaments extending between the plurality of socket pin holes and coupled to the frame structure.

Methods, apparatus, systems, and articles of manufacture to improve pin contact are disclosed. An apparatus disclosed herein includes a back plate, a circuit board disposed between the back plate and a socket, and a spring sheet disposed between the back plate and the circuit board.

An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members, each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members, each contact member extends away from a second end of a corresponding pitch transformation routing member. A first subset of the pitch transformation routing members each includes a first routing section extending in a first direction and a second routing section extending in a second direction. A pitch of the first set of contact members associated with the first subset of the pitch transformation routing members is different from a pitch of the second set of contact members associated with the first subset of the pitch transformation routing members.

A socket actuation mechanism for package insertion and package-socket alignment, including: a socket frame comprising a plurality of first hinge portions; a carrier frame comprising: a center portion comprising one or more package interlocks; and a tab extending from a first end of the carrier frame, the tab comprising a second hinge portion couplable with the plurality of first hinge portions to form a hinge coupling the carrier frame to the socket frame.

An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members where each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members where each contact member extends away from a second end of a corresponding pitch transformation routing member. Each pitch transformation routing member includes multiple routing sections, where each routing section extends in the first direction or the second direction. In a first subset of the pitch transformation routing members, the pitch transformation routing members have routing sections with different dimensions in the first direction and the second direction.

An electrical connector used for connecting an chip module to a printed circuit board includes an insulating housing, a number of terminals and a cover. The insulating housing includes a body portion. The terminals are insert molded in the body portion. The body portion includes an upper face and a lower face. Each of the terminals includes a first soldering portion extending upwardly beyond the upper face and a second soldering portion extending downwardly beyond the lower face. The cover covers the insulating housing. The electrical connector has a simple structure and a simple manufacturing process.

A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.

An electrical connector assembly includes a carrier having an upper surface and a lower surface. The carrier includes a plurality of contact openings therethrough. The electrical connector assembly includes contacts coupled to the carrier and passing through the corresponding contact openings. Each contact has a conductive polymer column extending between an upper mating interface and a lower mating interface. The conductive polymer column includes an inner core manufactured from a first material and an outer shell manufactured from a second material. The second material has a higher electrical conductivity than the first material. The first material has a lower compression set than the second material.