According to a certain embodiment, a pin plunger includes: a first contact member; a second contact member that faces the first contact member and is apart from the first contact member; a spring arranged between the first contact member and the second contact member; and a housing that houses the first contact member, the second contact member, and the spring. The housing comprises a bimetal inside or outside the housing. The bimetal comprises a first metal and a second metal, the first metal having a thermal expansion coefficient different from a thermal expansion coefficient of the second metal. The elastic force decreased or increased by contracting or expanding of the spring due to a temperature change is compensated with a warping force due to stretching of the first metal and the second metal.

An electrical connector includes an insulative rectangular housing with a planar base defining opposite upper surface and lower surface thereon. Four restriction parts are formed at four corners of the base to cooperate with the base for commonly forming a receiving cavity to receive the electronic package therein. A plurality of first contacts are disposed in the base with corresponding contacting sections upwardly extending into the receiving cavity to upwardly abut against the corresponding pads on the undersurface of the electronic package. A plurality of second contacts are disposed in the base with corresponding contacting sections sidewardly extending into the receiving cavity to sidewardly abut against the corresponding pads on the side faces of the electronic package.

In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.

The present invention relates to a chip-fixing device for a socket, which comprises a fixing base body and a movable stop. The socket is assembled in a socket-accommodating recess of the fixing base body. The movable stop is assembled in the fixing base body and controlled in such a manner that a stopper is moved between a first position and a second position, wherein the first position refers to a position where the stopper is located right above the socket, and the second position refers to a position where the stopper is not located right above the socket. Accordingly, the socket-accommodating recess can be used to install sockets of different sizes, and the movable stop can drive the stopper to restrict a chip from falling off the socket or drive the stopper to release the chip, depending on presence or absence of an external force.

An electrical connector includes multiple terminals formed by cutting from a metal plate and bending. The portion of the metal plate with the terminals being removed is defined as a base plate. Each terminal has a base portion and an elastic arm connected thereto. The base portion is at least partially horizontally provided to be coplanar to the base plate. A cutting slot is formed between the base plate and the base portion. A through slot is formed between the base plate and the elastic arm. An insulating body is provided with through holes running vertically therethrough. A portion of the cutting slot and the through slot are exposed in a corresponding through hole. The terminals include signal terminals and ground terminals. The base plate forms a connecting portion between the through slot and the cutting slot of each ground terminal to be connected to the ground terminal.

A user interface assembly for an appliance includes a user interface console having a first portion and a second portion. The first portion defines a first thickness, the second portion defines a second thickness, wherein the second thickness is greater than the first thickness. The user interface assembly also includes a user interface circuit board secured to the second portion of the user interface console. Further, the user interface assembly includes an edge connector electrically coupled to the user interface circuit board. As such, the second thickness of the second portion of the user interface console provides a clearance between the edge connector and the user interface console. The user interface assembly also includes a wired connection electrically coupled to the edge connector for electrically coupling the user interface circuit board to a controller of the appliance.

An electrical connector includes multiple terminals formed by cutting from a metal plate and bending. The portion of the metal plate with the terminals being removed is defined as a base plate. Each terminal has a base portion and an elastic arm connected thereto. The base portion is at least partially horizontally provided to be coplanar to the base plate. A cutting slot is formed between the base plate and the base portion. A through slot is formed between the base plate and the elastic arm. An insulating body is provided with through holes running vertically therethrough. A portion of the cutting slot and the through slot are exposed in a corresponding through hole. The terminals include signal terminals and ground terminals. The base plate forms a connecting portion between the through slot and the cutting slot of each ground terminal to be connected to the ground terminal.

A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. The first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias.

An information processing system includes a housing, a circuit board in the housing, a functional module in the housing, and a module fixing device in the housing. The functional module is inserted into the circuit board. The module fixing device is connected to the functional module and is connected to the circuit board. The module fixing device comprises a clamping member and an elastic member. The clamping member is movably connected to the circuit board in a first direction and a second direction opposite to the first direction, the clamping member comprises a first clamping portion to clamp the functional module. The elastic member is connected to the clamping member, the elastic member is deformable in the first direction to drive the clamping member to move in the first direction to clamp the functional module.

An land grid array (LGA) or hybrid land grid array (HLGA) includes a socket housing and a plurality of electrical contacts. The socket housing is made of a first material that defines a first dielectric constant. The plurality of electrical contacts extends through the socket housing to electrically couple a printed circuit board on a first side of the socket housing to a processor on a second side of the socket housing. A coating of a second material that defines a second dielectric constant that is higher than the first dielectric constant covers surfaces of a subset of the plurality of electrical contacts.