A semiconductor apparatus includes a semiconductor device configured to include a first pad, and a socket provided over a first pad side of the semiconductor device, and configured to include, a base configured to face the semiconductor device, a first terminal provided over a semiconductor device side of the base, configured to include flexibility against a load in a direction from the semiconductor device toward the base, and coupled to the first pad, a first tubular barrier provided over the semiconductor device side and configured to surround the first terminal, and a first elastic body provided over the semiconductor device side, and configured to support the first tubular barrier and energize the first tubular barrier in a direction from the base toward the semiconductor device.

Modular system of interfacing consumer electronics devices. The system includes a powered base hub and additional modular components with interface couplers providing electrical continuity between modules. Data transmission between modules may be through the interface couplers or wireless. The system includes a power cord for providing power to the base or wireless pad, but it need not include any additional power or data cords or cables.

The present application provides an SSD card adapter bracket and a circuit board assembly. The SSD card adapter bracket includes a bracket member, a first screw, a conductive bouncing sheet, and a second screw. The bracket member includes a card base part and an extension part, and one side of the card base part is provided with a screw base. One side of the extension part is connected to the card base part, and the other side of the extension part is provided with a connection part. The first screw is threadedly connected to the screw base, and can press the SSD card to the screw base. The conductive bouncing sheet has a first end part and a second end part, the first end part is sandwiched between the first screw and the screw base, and the second end part corresponds to the connection part.

According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.

Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.

According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.

Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.

A server includes a tray, a handle structure, a first hard disk assembly and a second hard disk assembly. The tray is removably disposed on a server cabinet. Two ends of the handle structure are respectively slidably pivoted to two inner walls of the tray. The first hard disk assembly is movably disposed in the tray. The second hard disk assembly is disposed in the tray. The first hard disk assembly and the second hard disk assembly are placed side by side. Two sides of the first hard disk assembly, which are opposite to each other, are pivoted to the handle structure. When the handle structure is pivoted and slide relative to the tray, the first hard disk assembly is pivotable between a stored position and an inclined position by the handle structure.

Various embodiments described herein provide a connector assembly with integrated data and backup energy connections, which can be used to electrically couple together two or more printed circuit boards and electrically couple at least one of those printed circuit boards to a backup energy source. For example, a connector assembly of an embodiment can be used to implement a memory sub-system by coupling together two or more printed circuit boards of the memory sub-system and coupling the memory sub-system to a backup energy source, such as a set of capacitors or a set of batteries, which can be used to power the memory sub-system in the event of a main power loss.

Modular system of interfacing consumer electronics devices. The system includes a powered base hub and additional modular components with interface couplers providing electrical continuity between modules. Data transmission between modules may be through the interface couplers or wireless. The system includes a power cord for providing power to the base or wireless pad, but it need not include any additional power or data cords or cables.