The invention relates to a device (2) for cooling a plurality of electronic elements (11) that are capable of releasing heat when supplying power to an appliance or vehicle, wherein the electronic elements are arranged in a housing (12), the device (2) comprises at least one element (22) for spraying a diphasic dielectric fluid (3) onto the electronic elements (11), as well as a condenser (26) with a cooling fluid circuit (23), the housing (12) comprises a receptacle (25) for collecting the dielectric fluid (3), the cooling device (2) comprises a dielectric fluid circuit (21) with a circulation pump (24), which is configured to draw the dielectric fluid (3) from the collection receptacle (25) and is directly connected to the spraying element (22), characterised in that the cooling device (2) comprises a system (4) for controlling the internal pressure of the housing (12), the control system (4) comprising a control module (41) configured to generate a control command to control the internal pressure depending on a state of the cooling device and/or a state of the appliance or vehicle.

There is described a spray chamber for cooling a computer processor on a circuit board. The spray chamber comprises: a wall assembly for sealable mounting on an exposed cooling surface of the computer processor defining an enclosure having a top opening and a bottom opening which opens on the top surface of the computer processor; and a lid for covering the top opening of the wall assembly in a sealable manner, the lid having a nozzle which sprays coolant that impinges on the exposed cooling surface of the computer processor.

An impingement cooling system includes a porous heat spreader and a nozzle configured to direct a fluid as a jet and/or as a spray impinging upon the porous heat spreader. The porous heat spreader is made of a thermally-conductive material such as a metal, metal alloy, carbon/graphite, or ceramic, and is in thermal contact with a heat source. The nozzle may be configured to direct the fluid as a jet comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The nozzle may be configured to direct the fluid as a spray comprising a single component liquid or gas (including air) or a liquid mixture such as water-glycol or other coolants. The cooling system may include one or more nozzles, which may direct the cooling fluid orthogonally or at an oblique angle to an impingement plate.

A system and method for cooling electronic equipment having a power supply unit separate from the equipment, sprayers that spray a dielectric liquid coolant on the top of the equipment lengthwise along one or more fins of one or more heat sinks on the equipment, a reservoir, connectors, and pumps for pumping the liquid coolant from the reservoir and through the sprayer, and an external housing.

Thermal regulation device intended for at least one electrical component whose temperature must be regulated, the thermal regulation device including at last a housing, a cover affixed to said housing and a first circuit, configured to allow circulation of a dielectric fluid. The housing includes at least a plurality of lateral walls delimiting an internal volume of the housing in which at least the electrical component extends. The first circuit includes at least one dielectric fluid supply duct formed between the housing and the lid, at least one of the lateral walls and/or the bottom wall having at least one orifice for spraying the dielectric fluid into the internal volume, which is fluidically connected at least to the supply duct.

The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed and then flow downward along wave-pattern flow paths having zigzag shapes, thereby providing an advantage of improving heat dissipation performance without increasing a size thereof.

A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

A computer system includes a mist cooling system. The mist cooling system suspended droplets of dielectric fluid in air to form a mist and conveys the mist to heat producing components of the computer system. The liquid droplets of the mist wet the heat producing components and remove waste heat as part of a phase change from a liquid phase to a vapor phase. Vaporized dielectric fluid is condensed via a heat exchanger in a chassis of the computer system and is returned to a reservoir for use in generating mist.

A system includes one or more modular hot aisle cooling units (MHACUs) disposed in a data hall, each MHACU configured to cool one or more servers in the data hall. The system also includes a fluid cooler configured to receive the heated fluid from the one or more MHACUs, cool the heated fluid into cooled fluid, and output the cooled fluid. The system also includes a fluid supply line configured to convey the cooled fluid to the one or more MHACUs in order to cool heated air inside the data hall. The system also includes a pump package configured to control a flow of the heated fluid and the cooled fluid. The fluid cooler, the one or more MHACUs, and the pump package form a single fluid loop.

Provided is a cooling apparatus for an electronic element having improved heat dissipation performance while minimizing the size. To this end, the cooling apparatus for an electronic element according to the present invention includes a first chamber in a non-vacuum state, the first chamber being configured such that a printed circuit board equipped with a heat-generating element is disposed in the first chamber, a second chamber in a vacuum state, the second chamber being configured such that a spray unit configured to spray a refrigerant and a refrigerant supply unit configured to supply the refrigerant to the spray unit are disposed in the second chamber, and an evaporation unit disposed between the first chamber and the second chamber, in which the spray unit sprays the refrigerant, which is supplied by the refrigerant supply unit and condensed in the second chamber, into the second chamber, and in which the evaporation unit evaporates the refrigerant, which is sprayed into the second chamber by the spray unit, by using sensible heat transferred from the first chamber to the evaporation unit and latent heat transferred from the evaporation unit to the second chamber.