Disclosed is a system for recharging a selected power source wirelessly, such as through a power transmission. The power source may be positioned within a subject and be charged wirelessly through the subject, such as tissue of the subject. A thermal transfer system is provided to transfer or transport thermal energy from a first position to a second position, such as away from the subject.

Disclosed is a system for recharging a selected power source wirelessly, such as through a power transmission. The power source may be positioned within a subject and be charged wirelessly through the subject, such as tissue of the subject. A thermal transfer system is provided to transfer or transport thermal energy from a first position to a second position, such as away from the subject.

Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

An electrical power conversion unit is provided with: a circuit connecting part which includes a positive electrode conductor, a negative electrode conductor, and an alternating current conductor; a power semiconductor module connected to a specific side of the circuit connecting part; a fin that extends to the opposite side of the circuit connecting part with respect to the power semiconductor module; and a capacitor disposed at one end in the lengthwise direction of the circuit connecting part. A space in which a cooling fan is disposed is formed by an extending part and the fin, when the extending part is defined as a region, of the circuit connecting part, other than the portion at which the fin projects to the circuit connecting part, such region including one end that is opposite, via the fin, the one end where the capacitor is present.

This disclosure details a coolant distribution module as used in a thermal management systems for thermally managing electrified vehicle components. An exemplary coolant distribution module includes a module body including a plurality of inlet ports and a plurality of outlet ports, a first manifold valve encompassed within the module body, and a second manifold valve encompassed within the module body. The first manifold valve includes a plurality of first valve inputs wherein each first valve input is in communication with at least one inlet port of the plurality of inlet ports, and a plurality of first valve outputs wherein each first valve output is in communication with at least one outlet port of the plurality of outlet ports. The second manifold valve includes a plurality of second valve inputs wherein each second valve input is in communication with at least one inlet port of the plurality of inlet ports, and a plurality of second valve outputs wherein each second valve output is in communication with at least one outlet port of the plurality of outlet ports.

A charger including a housing including a front wall, a rear wall, a top wall, a bottom wall, a first side wall, and a second side wall, an interface configured to engage a battery pack, and an air conditioning assembly coupled within the housing adjacent the interface. The air conditioning system is operable to suck an ambient air flow into the housing from outside the housing, reduce a temperature of the air flow to create a cooling air flow, and guide the cooling air flow to the battery pack interface.

A refrigeration unit including a refrigeration circuit, a mounting plate, a power electronics device thermally coupled to the mounting plate, and a heat sink thermally coupled to the mounting plate and to a component of the refrigeration circuit. The heat sink is configured to transfer waste heat from the mounting plate to the component of the refrigeration circuit.

A heat sink device including: a cover module having a liquid inlet; a central flow channel for distributing coolant fluid introduced into the liquid inlet of the cover module; a plurality of inner fins; a plurality of inner radial flow channels; wherein coolant fluid from the central flow channel flows into the inner radial flow channels; a ring segment disposed around an outer perimeter of the plurality of inner fins, wherein the ring segment is configured to at least one of, mix and distribute coolant fluid received from the inner radial flow channels; a plurality of outer fins; a plurality of outer radial flow channels; wherein coolant fluid from the ring segment flows into the outer radial flow channels; and an outer flow channel, wherein coolant fluid flowing out of the radial flow channels outlet drains into the outer flow channel.

An HVAC system includes a refrigerant liquid-gas separator. The liquid-gas separator is thermally coupled to electronics to transfer heat away from the electronics, and assist in vaporizing liquid refrigerant. The liquid-gas separator device includes a refrigeration section configured to couple to a refrigeration loop, and electronics thermally coupled to the refrigeration section. The refrigeration section includes: (a) a refrigerant inlet configured to receive refrigerant from the refrigeration loop; (b) a refrigerant outlet configured to release vapor refrigerant to the refrigeration loop; and (c) a cavity coupled to the refrigerant inlet and the refrigerant outlet, the cavity configured to separate liquid refrigerant from vapor refrigerant. During use of the HVAC system, heat from the electronics board is transferred to the refrigerant. The liquid-gas separator includes a check valve configured to inhibit flow of refrigerant into the liquid-gas separator device via the refrigerant outlet.

A system includes a vessel, a cooling fluid in the vessel, and at least one power magnetics assembly in the vessel and immersed in the cooling fluid. The system further includes at least one heat sink having a surface in contact with the cooling fluid in the vessel and at least one power semiconductor device mounted on the at least one heat sink. The cooling fluid may be electrically insulating and the vessel may be sealed.