A method for manufacturing a bonded substrate, the method includes: bonding a first mother substrate including a first substrate and a second mother substrate including a second substrate to form a bonded mother substrate; cutting off a part of the first mother substrate along a dividing line of the bonded mother substrate to form a cutoff portion; dividing the bonded mother substrate along the dividing line; separating a bonded substrate from the bonded mother substrate, the bonded substrate including the first substrate and the second substrate bonded to the first substrate; forming a contact terminal on an end portion of the first mother substrate, the contact terminal contactable with an external terminal; forming a communication path between the first mother substrate and the second mother substrate along the dividing line.

A liquid discharge head to discharge a liquid includes a piezoelectric body, a first electrode layer disposed at least partly on the piezoelectric body in a stacking direction, and a first wiring disposed on the first electrode layer in the stacking direction, the first wiring being more likely to cause ion migration than the first electrode layer, in which the piezoelectric body, the first electrode layer, and the first wiring are stacked in the stacking direction. When a predetermined area on the piezoelectric body is a first area, and a predetermined area adjacent to the first area on the piezoelectric body is a second area, both the first wiring and the first electrode layer are disposed in the first area, and the first wiring is not disposed while the first electrode layer is disposed in the second area.

The invention relates to a ceramic material, comprising lead zirconate titanate, which additionally contains K and optionally Cu. The ceramic material can be used in an electroceramic component, for example a piezoelectric actuator. The invention also relates to methods for producing the ceramic material and the electronic component.

The present invention relates to a method for producing piezoelectric multi-layered components (2), which comprises the following steps: applying an electrode material (5) to green sheets (3) containing a piezoelectric material, applying a layer of a first auxiliary material (9) to at least one green sheet (3) containing the piezoelectric material, forming a stack (1), in which the green sheets (3), to which electrode material (5) is applied, are arranged one on top of another, wherein at least one ply of the green sheet (3), to which the layer of the first auxiliary material (9) is applied, is arranged in the stack (1), sintering the stack (1), wherein the layer of the first auxiliary material (9) is thinned, and firing the stack (1), wherein the stack (1) is singulated along the at least one ply into at least two multi-layered components (2).

A piezoelectric film includes a plurality of laminated main baking unit PZT layers. A first seed layer is present at a lower surface side of a lowermost main baking unit PZT layer. A second seed layer is interposed between two adjacent main baking unit PZT layers at an intermediate position between the lowermost main baking unit PZT layer and an uppermost main baking unit PZT layer.

A transducer includes first and second piezoelectric layers made of corresponding different first and second piezoelectric materials and three or more electrodes, implemented in two or more conductive electrode layers. The first piezoelectric layer is sandwiched between a first pair of electrodes and the second piezoelectric layer is sandwiched between a second pair of electrodes. The first and second pairs of electrodes contain no more than one electrode that is common to both pairs.

The interface region may include a region in which first intensity is higher than second intensity and in which the first intensity is higher than third intensity, where a degree of orientation of the (−211) crystal face of the second layer is denoted as the first intensity, the degree of orientation of the (−111) crystal face of the second layer is denoted as the second intensity, and the degree of orientation of the (002) crystal face of the second layer is denoted as the third intensity. The surface-layer region may include a region in which the first intensity is higher than the third intensity and in which the second intensity is higher than the third intensity.

Improvements in ingestible electronics with the capacity to sense physiologic and pathophysiologic states have transformed the standard of care for patients. Yet despite advances in device development, significant risks associated with solid, non-flexible gastrointestinal transiting systems remain. Here, we disclose an ingestible, flexible piezoelectric device that senses mechanical deformation within the gastric cavity. We demonstrate the capabilities of the sensor in both in vitro and ex vivo simulated gastric models, quantified its key behaviors in the GI tract by using computational modeling, and validated its functionality in awake and ambulating swine. Our piezoelectric devices can safely sense mechanical variations and harvest mechanical energy inside the gastrointestinal tract for diagnosing and treating motility disorders and for monitoring ingestion in bariatric applications.

A sensor is disclosed which includes a piezoelectric layer, a piezoresistive layer, one or more electrode layers coupled to the piezoelectric layer and to the piezoresistive layer, the piezoelectric layer configured to provide an electrical signal in response to application of a dynamic disturbance, and the piezoresistive layer configured to provide a change in resistivity in response to application of a static disturbance.

Some embodiments of the invention relate to an applicator for applying ultrasound energy to a tissue volume, comprising: an array comprising a plurality of ultrasound transducers, the transducers arranged side by side, the transducers configured to emit unfocused ultrasound energy suitable to thermally damage at least a portion of the tissue volume, each of the transducers comprising a coating thin enough so as not to substantially affect heat transfer via the coating to the tissue; and a cooling module configured to apply cooling via the transducers to prevent overheating of a surface of the tissue volume being contacted by the transducers.