A labeling device, comprising a scale control assembly (11) and a stripping assembly (12), the scale control assembly (11) being configured to obtain a material strip (10) and to lead out a predetermined length of the material strip (10); the stripping assembly (12) being configured to grasp a target label (101) on the material strip (10) led out by the scale control assembly (11) and to affix the target label (101) to a product (D) to be labeled at a pre-set position so as to obtain a labeled product. Said device controls, by means of the scale control assembly, the length of the material strip that is led out at each time when labeling the product to be labeled, so as to improve the precision of the stripping assembly grasping the label and affixing the label to the product to be labeled.

A method for attaching a fingerprint module which includes providing an adhesive tape which includes a base film, a protective film which is oppositely arranged to the base film, and a number of adhesive layers positioned between the base film and the protective film and are arranged at intervals, and each of the base film and the protective film is an integral piece of film which is continuous in an entire layer. The method further includes partially peeling off the protective film to expose a first adhesive surface of one of the plurality of adhesive layers; attaching the fingerprint module to the exposed first adhesive surface of the adhesive layer; and peeling off the attached fingerprint module and adhesive layer together from the base film to expose a second adhesive surface of the adhesive layer.

A method of dispersing semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip is disclosed. The method includes dispersing the wafer into sequential columns of semiconductor chips with a first pitch between columns while preserving the neighboring relationship and sequentially dispersing the columns of semiconductor chips into rows of individual chips with a second pitch between rows onto a substrate while preserving the neighboring relationship.

A method for attaching a fingerprint module which includes providing an adhesive tape which includes a base film, a protective film which is oppositely arranged to the base film, and a number of adhesive layers positioned between the base film and the protective film and are arranged at intervals, and each of the base film and the protective film is an integral piece of film which is continuous in an entire layer. The method further includes partially peeling off the protective film to expose a first adhesive surface of one of the plurality of adhesive layers; attaching the fingerprint module to the exposed first adhesive surface of the adhesive layer; and peeling off the attached fingerprint module and adhesive layer together from the base film to expose a second adhesive surface of the adhesive layer.

Embodiments of the invention are directed to a transfer lamination process and apparatus that reduces substrate warpage. In some embodiments, the transfer lamination process is performed using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon having a carrier layer and a transfer layer attached to the carrier layer. In some embodiments of the transfer lamination process, a transfer section of the transfer layer is transferred from the carrier layer to a first surface of a substrate using the transfer unit. In some embodiments of this transferring step, the transfer section is heated and pressed against the first surface of the substrate using the transfer unit, and the carrier layer is detached from the transfer section. The substrate is then inverted using the substrate rotator. At least a portion of a second surface of the substrate that is opposite the first surface is then heated using the transfer unit without transferring the transfer layer to the portion of the second surface.

A labeling device, comprising a scale control assembly (11) and a stripping assembly (12), the scale control assembly (11) being configured to obtain a material strip (10) and to lead out a predetermined length of the material strip (10); the stripping assembly (12) being configured to grasp a target label (101) on the material strip (10) led out by the scale control assembly (11) and to affix the target label (101) to a product (D) to be labeled at a pre-set position so as to obtain a labeled product. Said device controls, by means of the scale control assembly, the length of the material strip that is led out at each time when labeling the product to be labeled, so as to improve the precision of the stripping assembly grasping the label and affixing the label to the product to be labeled.

Embodiments of the invention are directed to a transfer lamination process and apparatus that reduces substrate warpage. In some embodiments, the transfer lamination process is performed using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon having a carrier layer and a transfer layer attached to the carrier layer. In some embodiments of the transfer lamination process, a transfer section of the transfer layer is transferred from the carrier layer to a first surface of a substrate using the transfer unit. In some embodiments of this transferring step, the transfer section is heated and pressed against the first surface of the substrate using the transfer unit, and the carrier layer is detached from the transfer section. The substrate is then inverted using the substrate rotator. At least a portion of a second surface of the substrate that is opposite the first surface is then heated using the transfer unit without transferring the transfer layer to the portion of the second surface.

Various embodiments of the apparatus and methods are configured to make containers such as disposable reinforced cups using reinforcing members configured to be respectively attached to cups. The apparatus and method of various embodiments of the present disclosure sequentially heat different or selective portions of the heat activated adhesive on the reinforcing member at multiple sequential stages, steps or times to attach the reinforcing member to the container.

The use of a heat idler moveable along a path provides speed and flexibility in the heat labeling of containers.