Patent classifications
Y10T428/24521
Anisotropic conductive film and method of producing the same
An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.
Etching for bonding polymer material to anodized metal
This application relates to a multi-piece enclosure for a portable electronic device. The enclosure includes a metal part including a metal substrate and a metal oxide layer overlaying the metal substrate, the metal oxide layer having an external surface that includes openings that lead into undercut regions. The openings are characterized as having a first width, and the undercut regions are characterized as having a second width that is greater than the first width. The enclosure further includes a non-metallic bulk layer including protruding portions that extend into the undercut regions such that the non-metallic bulk layer is interlocked with the metal part.
SKIN MATERIAL AND METHOD FOR PRODUCING THE SAME
The method for producing a skin material is a method for producing a skin material having a concave part formed on the front surface side, comprising heat-pressing a raw material between an embossing die and an elastic sheet to form the concave part and, at the same time, forming a convex part on a bottom surface of the concave part.
Profiled films
The present disclosure relates to films having at least a first profiled layer and a second layer having an inverse profile of the first layer. Those films can be used as protection tapes for various surfaces. Exemplary uses of the films of the present disclosure include leading edge protection tapes for rotor blades.
Nanovided spacer materials and corresponding systems and methods
A nanovoided spacer material that is used as a mechanical buffer between at least two optical components. The optical components may include gratings (e.g., Bragg gratings, moth-eye surfaces, etc.) having sensitive and fragile surfaces (e.g., patterned surfaces). The nanovoided spacers may have a predetermined thickness and concentration of nanovoids to provide a given optical property (e.g., a reflection coefficient at an interface between two optical elements). The nanovoided spacer may include a multilayer structure (e.g., two or more layers) of varying refractive index (e.g., to reduce reflections between surfaces of the optical elements). The nanovoided spacer may include from about 10% to 90% nanovoids by volume and may have an average index of refraction of about 1.15. Various other methods, systems, apparatuses, and materials are also disclosed.
Roll-to-roll fabrication of ordered three-dimensional nanostructure array, related techniques, materials and products
Roll-to-roll fabrication of predetermined or ordered three-dimensional nanostructure arrays is described. Provided methods can comprise imprinting a substrate with a two-dimensional (2-D) pattern by rolling a cylindrical pattern comprising a 2-D array of structures against a substrate. In addition, control or determination of nanostructure parameters via control of process parameters is provided.
Light extraction substrate for OLED and method of fabricating the same
A light extraction substrate for an organic light-emitting device (OLED) which can improve the brightness of a display or an illumination system to which an OLED is applied by improving light extraction efficiency and a method of manufacturing the same. The light extraction substrate for an OLED includes an oxide or nitride thin film formed on a substrate body. The oxide or nitride thin film includes a base layer formed on the substrate body, a first texture formed on the base layer, the first texture having a plurality of first protrusions which protrude continuously or discontinuously from the base layer, and a second texture having a plurality of second protrusions which protrude continuously or discontinuously from each outer surface of the first protrusions.
METHOD OF PRODUCING A VENEERED ELEMENT
A method of producing a veneered element, including providing a substrate, applying a sub-layer on a surface of the substrate, applying a veneer layer on the sub-layer, and applying pressure to the veneer layer and/or the substrate, such that at least a portion of the sub-layer permeates through the veneer layer. Also, such a veneered element.
Method to fabricate pre-patterned surfaces during manufacture of complex wrinkled structures
The pattern complexity and functional value of wrinkled structures can be substantially increased by fabricating the wrinkles on pre-patterned quasi-planar substrates instead of flat substrates. This disclosure presents the methods for fabricating pre-patterned polymeric surfaces that can be subsequently used as the substrates during manufacture of complex wrinkled structures. Pre-patterned substrates are generated by imprinting the pre-patterns onto the substrates during the curing process. Suitability for post-curing use in fabrication of wrinkles is ensured by (i) delayed imprinting that occurs close to but before the gelation point and (ii) gradual alignment of pre-patterns to the direction of stretch that is applied later during manufacture of wrinkled structures.
Laser welding of transparent and opaque materials
Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.