Method of programming memory device and related memory device

Abstract

A memory device includes memory cells in rows, word lines respectively coupled to the rows, and a control circuitry coupled to the memory cells via the word lines. The control circuitry is configured to apply a first program voltage to a first word line of the word lines. The first word line is coupled to a first row of the memory cells. The control circuitry is also configured to, after applying the first program voltage to the first word line, apply a second program voltage to a second word line of the word lines. The second word line is coupled to a second row of the memory cells. The control circuitry is also configured to, after applying the second program voltage to the second word line, apply a first pre-charge voltage to the first word line and a second pre-charge voltage to the second word line. The second pre-charge voltage is greater than the first pre-charge voltage.

Claims

1. A memory device, comprising: a plurality of memory cells in a plurality of rows; a plurality of word lines respectively coupled to the plurality of rows of the memory cells; and a control circuitry coupled to the plurality of memory cells via the plurality of word lines, and configured to: apply a first program voltage to a first word line of the plurality of word lines, the first word line being coupled to a first row of the plurality of rows of the memory cells; after applying the first program voltage to the first word line, apply a second program voltage to a second word line of the plurality of word lines, the second word line being coupled to a second row of the plurality of rows of the memory cells; and after applying the second program voltage to the second word line, perform a pre-charge operation comprising one of: retaining a first voltage in the first word line, applying a pre-pulse voltage having a first duration to a bit line coupled to, in a column, a memory cell of the plurality of memory cells corresponding to the second word line, and applying a second voltage having a second duration to the second word line, wherein the second voltage is greater than the first voltage, and the first duration is longer than the second duration; or applying a third voltage to the first word line for lowering a potential of the first word line and retaining a fourth voltage in the second word line, wherein the fourth voltage is greater than the third voltage.

2. The memory device of claim 1, wherein: the control circuitry is configured to, after applying the second program voltage to the second word line, retain the first voltage in the first word line and apply the second voltage to the second word line; and the first voltage is a ground voltage, and the second voltage is a positive bias voltage.

3. The memory device of claim 2, wherein a channel of the memory cell of the plurality of memory cells coupled to the second word line is turned on by the second voltage.

4. The memory device of claim 1, wherein: the control circuitry is configured to, after applying the second program voltage to the second word line, apply the third voltage to the first word line for lowering the potential of the first word line and retain the fourth voltage to the second word line; and the third voltage is a negative bias voltage, and the fourth voltage is a ground voltage.

5. The memory device of claim 1, wherein the control circuitry is further configured to, after the pre-charge operation, apply a third program voltage to the first word line and a pass voltage to the second word line, the third program voltage being greater than the pass voltage.

6. The memory device of claim 5, wherein the control circuitry is further configured to, after applying the third program voltage and the pass voltage, apply a fourth program voltage to the second word line, the fourth program voltage being greater than the second program voltage.

7. The memory device of claim 1, wherein the second word line is adjacent to the first word line.

8. A system, comprising: a memory device comprising: a plurality of memory cells in a plurality of rows; a plurality of word lines respectively coupled to the plurality of rows of the memory cells; and a control circuitry coupled to the plurality of memory cells via the plurality of word lines, and configured to: apply a first program voltage to a first word line of the plurality of word lines, the first word line being coupled to a first row of the plurality of rows of the memory cells; after applying the first program voltage to the first word line, apply a second program voltage to a second word line of the plurality of word lines, the second word line being coupled to a second row of the plurality of rows of the memory cells; and after applying the second program voltage to the second word line, perform a pre-charge operation comprising one of: retaining a first voltage in the first word line, applying a pre-pulse voltage having a first duration to a bit line coupled to, in a column, a memory cell of the plurality of memory cells corresponding to the second word line, and applying a second voltage having a second duration to the second word line, wherein the second voltage is greater than the first voltage, and the first duration is longer than the second duration; or applying a third voltage to the first word line for lowering a potential of the first word line and retaining a fourth voltage in the second word line, wherein the fourth voltage is greater than the third voltage; and a controller coupled to the memory device and configured to send commands to the memory device to cause the control circuitry to apply the first and second program voltages and the first, second, third, and fourth voltages to the word lines.

9. The system of claim 8, wherein: the control circuitry is configured to, after applying the second program voltage to the second word line, retain the first voltage in the first word line and apply the second voltage to the second word line; and the first voltage is a ground voltage, and the second pre charge voltage is a positive bias voltage.

10. The system of claim 9, wherein a channel of the memory cell of the plurality of memory cells coupled to the second word line is turned on by the second voltage.

11. The system of claim 8, wherein: the control circuitry is configured to, after applying the second program voltage to the second word line, apply the third voltage to the first word line for lowering the potential of the first word line and retain the fourth voltage to the second word line; and the third voltage is a negative bias voltage, and the fourth voltage is a ground voltage.

12. The system of claim 8, wherein the control circuitry is further configured to, after the pre-charge operation, simultaneously apply a third program voltage to the first word line and a pass voltage to the second word line, the third program voltage being greater than the pass voltage.

13. The system of claim 12, wherein the control circuitry is further configured to, after applying the third program voltage and the pass voltage, apply a fourth program voltage to the second word line, the fourth program voltage being greater than the second program voltage.

14. The system of claim 8, wherein the second word line is adjacent to the first word line.

15. A method for programming a memory device, the memory device comprising a plurality of memory cells in a plurality of rows, and a plurality of word lines respectively coupled to the plurality of rows of the memory cells, the method comprising: applying a first program voltage to a first word line of the plurality of word lines, the first word line being coupled to a first row of the plurality of rows of the memory cells; after applying the first program voltage to the first word line, applying a second program voltage to a second word line of the plurality of word lines, the second word line being coupled to a second row of the plurality of rows of the memory cells; and after applying the second program voltage to the second word line, performing a pre-charge operation comprising one of: retaining a first voltage in the first word line, applying a pre-pulse voltage having a first duration to a bit line coupled to, in a column, a memory cell of the plurality of memory cells corresponding to the second word line, and applying a second voltage having a second duration to the second word line, wherein the second voltage is greater than the first voltage, and the first duration is longer than the second duration; or applying a third voltage to the first word line for lowering a potential of the first word line and retaining a fourth voltage in the second word line, wherein the fourth voltage is greater than the third voltage.

16. The method of claim 15, wherein: performing the pre-charge operation comprises after applying the second program voltage to the second word line, retaining the first voltage in the first word line and applying the second voltage to the second word line; and the first voltage is a ground voltage, and the second voltage is a positive bias voltage.

17. The method of claim 16, wherein a channel of the memory cell of the plurality of memory cells coupled to the second word line is turned on by the second voltage.

18. The method of claim 15, wherein: performing the pre-charge operation comprises after applying the second program voltage to the second word line, applying the third voltage to the first word line for lowering the potential of the first word line and retaining the fourth voltage to the second word line; and the third voltage is a negative bias voltage, and the fourth voltage is a ground voltage.

19. The method of claim 15, further comprising, after performing the pre-charge operation, simultaneously applying a third program voltage to the first word line and a pass voltage to the second word line, wherein the third program voltage is greater than the pass voltage.

20. The method of claim 19, further comprising, after applying the third program voltage and the pass voltage, applying a fourth program voltage to the second word line, wherein the fourth program voltage is greater than the second program voltage.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a top-view diagram illustrating a NAND string according to an embodiment of the present disclosure.

(2) FIG. 2 is a diagram illustrating an equivalent circuit of a NAND string according to an embodiment of the present disclosure.

(3) FIG. 3 is a diagram illustrating a memory device 100 having read/write circuits for reading and programming memory cells according to an embodiment of the present disclosure.

(4) FIG. 4 is a diagram illustrating an exemplary structure of an array of memory cells according to an embodiment of the present disclosure.

(5) FIG. 5 is a flowchart illustrating a method of programming an array of memory cells in a memory device according to an embodiment of the present disclosure.

(6) FIG. 6 is a diagram illustrating an embodiment of executing the method depicted in FIG. 5.

(7) FIG. 7 is a flowchart illustrating a method of programming an array of memory cells in a memory device according to another embodiment of the present disclosure.

(8) FIG. 8 is a diagram illustrating an embodiment of executing the method depicted in FIG. 7.

DETAILED DESCRIPTION

(9) FIG. 1 is a top-view diagram illustrating a NAND string according to an embodiment of the present disclosure. FIG. 2 is a diagram illustrating an equivalent circuit thereof. In a flash memory system using the NAND structure, multiple transistors are arranged in series and sandwiched between two select gates, which are referred to as a NAND string. The NAND string depicted in FIGS. 1 and 2 includes four transistors 101˜104 coupled in series and sandwiched between a top select gate SG_T (on the drain side) and a bottom select gate SG_BS (on the source side). The top select gate SG_T is arranged for connecting the NAND string to a bit line via a bit line contact and may be controlled by applying appropriate voltages to a select gate line SGTL. The bottom select gate SG_B is arranged for connecting the NAND string to a source line and may be controlled by applying appropriate voltages to a select gate line SGBL. Each of the transistors 101˜104 includes a control gate and a floating gate. For example, the transistor 101 includes a control gate CG1 and a floating gate FG1, the transistor 102 includes a control gate CG2 and a floating gate FG2, the transistor 103 includes a control gate CG3 and a floating gate FG3, and the transistor 104 includes a control gate CG4 and a floating gate FG4. The control gate CG1 is connected to a word line WL1, the control gate CG2 is connected to a word line WL2, the control gate CG3 is connected to a word line WL3, and the control gate CG4 is connected to a word line WL4.

(10) For illustrative purpose, FIGS. 1 and 2 show four memory cells in the NAND string. In other embodiments, a NAND string may include 8 memory cells, 16 memory cells, 32 memory cells, 64 memory cells, 128 memory cells, etc. However, the number of memory cells in a NAND string does not limit the scope of the present disclosure.

(11) A typical architecture for a flash memory system using a NAND structure includes several NAND strings. Each NAND string is connected to the source line by its bottom select gate SGB controlled by the select line SGBL and connected to its associated bit line by its top select gate SG_T controlled by the select line SGTL. Each bit line and the respective NAND string(s) that are connected to that bit line via a bit line contact comprise the columns of the array of memory cells. Bit lines are shared with multiple NAND strings. Typically, the bit line runs on top of the NAND strings in a direction perpendicular to the word lines and is connected to one or more sense amplifiers.

(12) FIG. 3 is a diagram illustrating a memory device 100 having read/write circuits for reading and programming a page (or other unit) of memory cells in parallel according to an embodiment of the present disclosure. The memory device 100 includes an array (two-dimensional or three dimensional) of memory cells 10, a control circuitry 20, read/write circuits 30A and 30B, row decoders 40A and 40B, column decoders 50A and 50B, and a controller 60. In one embodiment, access to the memory array 10 by the various peripheral circuits is implemented in a symmetric fashion, on opposite sides of the array, so that the densities of access lines and circuitry on each side are reduced by half. The read/write circuits 30A and 30B include multiple sense blocks SB which allow a page of memory cells to be read or programmed in parallel. The array of memory cells 10 is addressable by word lines via the row decoders 40A and 40B and by bit lines via the column decoders 50A and 50B. In a typical embodiment, the memory cells 10, the control circuitry 20, the read/write circuits 30A and 30B, the row decoders 40A and 40B, and the column decoders 50A and 50B may be fabricated on a memory chip 70. Commands and data are transferred between a host and the controller 60 via a signal line 82 and between the controller 60 and the memory chip 70 via a signal line 84. A plurality of dummy cells, dummy word lines and dummy bit lines (not shown) may be laid in dummy storage areas DMX and DMY typically located along the sides of the memory array 10 for running read/write tests after the completion of the memory device 100.

(13) The control circuitry 20 is configured to cooperate with the read/write circuits 30A and 30B for performing memory operations on the array of memory cells 10. The control circuitry 20 includes a state machine 22, an on-chip address decoder 24 and a power control module 26. The state machine 22 is configured to provide chip-level control of memory operations. The on-chip address decoder 24 is configured to provide an address interface between that used by the host or a memory controller to the hardware address used by the row decoders 40A, 40B and the column decoders 50A, 50B. The power control module 26 is configured to control the power and voltages supplied to the word lines and bit lines during each memory operation.

(14) FIG. 4 is a diagram illustrating an exemplary structure of the array of memory cells 10 according to an embodiment of the present disclosure. The array of memory cells 10 is divided into multiple blocks of memory cells denoted by BLOCK.sub.1˜BLOCK.sub.1, wherein I is a positive integer and typically equal to a large number. A block contains a set of NAND strings which are accessed via bit lines BL.sub.1-BL.sub.M and a common set of word lines WL.sub.1˜WL.sub.N, wherein M and N are integers larger than 1. One terminal of the NAND string is connected to a corresponding bit line via the top select gate (connected to the select gate line SGTL), and another terminal is connected to the source line via the bottom select gate (connected to select gate line SGBL). Each block is typically divided into a number of pages. In one embodiment, a block is the unit of conventional erase and a page is the unit of conventional programming. However, other units of erase/program can also be used.

(15) In an embodiment, the array of memory cells 10 includes a triple well comprising a p-type substrate, an n-well within the p-type substrate, and a p-well within the n-well. The channel regions, source regions and drain regions are typically positioned in the p-well. The p-well and n-well are considered part of the p-type substrate, wherein the entire array of memory cells 10 is within one p-well, with trenches in the p-well providing electrical isolation between NAND strings. In another embodiment, the array of memory cells 01 includes a triple well comprising an n-type substrate, a p-well within the n-type substrate, and an n-well within the p-well. The p-well and n-well are considered part of the n-type substrate, wherein the channel regions, the source regions and the drain regions are typically positioned in the n-well. However, the implementation of the memory cells in a NAND string does not limit the scope of the present disclosure.

(16) In the present disclosure, the memory device 100 may be a NAND memory device wherein the array of memory cells 10 are laid in a 3D QLC structure. However, the type of the memory device 100 does not limit the scope of the present disclosure.

(17) FIG. 5 is a flowchart illustrating a method of programming the array of memory cells 10 in the memory device 100 according to an embodiment of the present disclosure. For illustrative purpose, the memory cells controlled by a bit line BL.sub.m among the plurality of bit lines BL.sub.1-BL.sub.M and two adjacent word lines WL.sub.n and WL.sub.n+1 among the common set of word lines WL.sub.1˜WL.sub.N are addressed, wherein m is a positive integer smaller than M, and n is a positive integer smaller than N. The flowchart in FIG. 5 includes the following steps:

(18) Step 510: perform coarse programming on the word line WL.sub.n.

(19) Step 520: perform coarse programming on the word line WL.sub.n+1.

(20) Step 530: pre-charge the unselected bit line BL.sub.m during a first period.

(21) Step 540: turn on the channel between the unselected bit line BL.sub.m and the unselected word line WL.sub.n+1 at the start of the first period and turn off the channel between the unselected bit line BL.sub.m and the unselected word line WL.sub.n+1 prior to the end of the first period.

(22) Step 550: perform fine programming on the selected word line WL.sub.n during a second period subsequent to the first period.

(23) In one embodiment, one or any combination of the control circuitry 20, the read/write circuits 30A and 30B, the row decoders 40A and 40B, the column decoders 50A and 50B, and/or the controller 60 may be referred to as a control unit capable of performing the processes of programming as depicted in FIG. 5.

(24) In step 510, coarse programming may be performed on the word line WL.sub.n by ramping the word line WL.sub.n to a first voltage V.sub.PGM1. If more than one page on the word line WL.sub.n are to be programmed, all of the pages to be programmed are coarse-programmed prior to proceeding to the next word line WL.sub.n+1.

(25) In step 520, coarse programming may be performed on the word line WL.sub.n+1 by ramping the word line WL.sub.n+1 to the first voltage V.sub.PGM1. If more than one page on the word line WL.sub.n+1 are to be programmed, all of the pages to be programmed are coarse-programmed prior to proceeding to the next word line.

(26) FIG. 6 is a diagram illustrating an embodiment of executing steps 530 and 540 in the method depicted in FIG. 5. FIG. 6 depicts the levels of related signal lines which will be explained along with the flowchart in FIG. 5.

(27) In step 530, the unselected bit line BL.sub.m may be pre-charged by applying a pre-pulse voltage V.sub.PP1 having a first width W1 to the unselected bit line BL.sub.m during the first period. In step 540, the channel between the unselected bit line BL.sub.m and the unselected word line WL.sub.n+1 may be turned on by applying a second pre-pulse voltage V.sub.PP2 having a second width W2 to the unselected word line WL.sub.n+1 at the start of the first period, wherein the second width W2 is smaller than the first width W1. Also, the rising edges of the pre-pulse voltages V.sub.PP1 and V.sub.PP2 are aligned so that the channel between the unselected bit line BL.sub.m and the unselected word line WL.sub.n+1 may be turned off prior to the end of the first period. Therefore, residual electrons on the selected word line WL.sub.n generated in step 510 may be drained via the channel between the unselected bit line BL.sub.m and the unselected word line WL.sub.n+1.

(28) In the present disclosure, the method of programming the array of memory cells 10 in the memory device 100 may further include pre-charging the unselected select gate lines SGTL and SGBL by applying a pre-pulse voltage V.sub.CC, biasing the dummy storage region DMY at the pre-pulse voltage V.sub.PP1, and biasing all word lines except the word line WL.sub.n+1 at a ground voltage during the first period.

(29) In step 550, fine programming may be performed on the selected word line WL.sub.n during the second period by biasing the unselected bit line BL.sub.m and the unselected select gate lines SGTL and SGBL at the ground voltage, ramping the dummy storage region DMY to a pass voltage V.sub.PASS, ramping the selected word line WL.sub.n to the pass voltage V.sub.PASS and then to a second voltage V.sub.PGM2 which is larger than the first voltage V.sub.PGM1 and the pass voltage V.sub.PASS, and ramping all word lines except the word line WL.sub.n to the pass voltage V.sub.PASS during the second period. If more than one page on the word line WL.sub.n are to be programmed, all of the pages to be programmed are fine-programmed prior to proceeding to the next word line WL.sub.n+1.

(30) FIG. 7 is a flowchart illustrating a method of programming the array of memory cells 10 in the memory device 100 according to another embodiment of the present disclosure. For illustrative purpose, the memory cells controlled by a bit line BL.sub.m among the plurality of bit lines BL.sub.1-BL.sub.M and two adjacent word lines WL.sub.n and WL.sub.n+1 among the common set of word lines WL.sub.1˜WL.sub.N are addressed, wherein m is a positive integer smaller than M, and n is a positive integer smaller than N. The flowchart in FIG. 7 includes the following steps:

(31) Step 710: perform coarse programming on the word line WL.sub.n.

(32) Step 720: perform coarse programming on the word line WL.sub.n+1.

(33) Step 730: pre-charge the unselected bit line BL.sub.m during a first period.

(34) Step 740: reduce the channel voltage of the selected word line WL.sub.n during the first period.

(35) Step 750: perform fine programming on the selected word line WL.sub.n during a second period subsequent to the first period.

(36) The implementation of step 710-730 and 750 are the similar to the implementation of step 510-530 and 550 as previously stated.

(37) FIG. 8 is a diagram illustrating an embodiment of executing steps 730 and 740 in the method depicted in FIG. 7. FIG. 8 depicts the levels of related signal lines which will be explained along with the flowchart in FIG. 7.

(38) In step 740, the channel voltage of the selected word line WL.sub.n may be reduced by applying a negative pre-pulse voltage V.sub.PP3 to the selected word line WL.sub.n during the first period. Therefore, residual electrons on the selected word line WL.sub.n generated in step 710 may be expelled from the selected word line WL.sub.n.

(39) In the present disclosure, coarse and fine programming may be adopted to improve overall programming speed. After coarse-programming a selected word line and before fine-programming the selected word line, the channel between a corresponding unselected bit line and an adjacent unselected word line may be turned on in order to drain residual electrons on the selected word line which are generated during coarse-programming. Alternatively, the channel voltage of the selected word line may be reduced in order to expel residual electrons on the selected word line which are generated during coarse-programming. Therefore, the present method can reduce program disturb when programming the memory cells in a memory device.

(40) Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the present disclosure. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.