Package structure of fingerprint identification chip

Abstract

The present invention provides a package structure of a fingerprint identification chip, including: a metal substrate, having a through opening and two grooves extending from two opposite sides of the through opening; a fingerprint identification chip, disposed in the through opening and having an upper surface and a lower surface, the lower surface having a bonding pad; a cover plate, fixedly disposed on the metal substrate and covering the upper surface of the fingerprint identification chip; a flexible printed circuit (FPC), disposed on the lower surface of the fingerprint identification chip and having a first surface and a second surface, the second surface having a first metal contact; and a metal reinforcing plate, inserted into the two grooves and covering the through opening, where the bonding pad is electrically connected to the first metal contact through a wire.

Claims

1. A package structure of a fingerprint identification chip, comprising: a metal substrate, having a through opening and two grooves extending from two opposite sides of the through opening; a fingerprint identification chip, disposed in the through opening and having an upper surface and a lower surface, the lower surface having at least one bonding pad; a cover plate, fixedly disposed on the metal substrate and covering the upper surface of the fingerprint identification chip; a flexible printed circuit (FPC), disposed on the lower surface of the fingerprint identification chip and having a first surface and a second surface, the second surface having a first metal contact; and a metal reinforcing plate, inserted into the two grooves and covering the through opening; wherein the bonding pad is electrically connected to the first metal contact through a wire.

2. The package structure of a fingerprint identification chip according to claim 1, wherein a colloid is coated on the at least one bonding pad, the wire and the first metal contact, and the colloid is an underfill.

3. The package structure of a fingerprint identification chip according to claim 1, wherein a film layer is formed between the metal substrate and the cover plate and is used for bonding the metal substrate and the cover plate.

4. The package structure of a fingerprint identification chip according to claim 1, wherein the cover plate includes a first mucilage layer that is formed at a position corresponding to the through opening and used for bonding the upper surface of the fingerprint identification chip.

5. The package structure of a fingerprint identification chip according to claim 1, wherein a second mucilage layer is formed between the lower surface of the fingerprint identification chip and the first surface of the FPC and is used for bonding the fingerprint identification chip and the FPC.

6. The package structure of a fingerprint identification chip according to claim 1, wherein a second metal contact is formed at another end, which is opposite to the first metal contact, of the FPC.

7. The package structure of a fingerprint identification chip according to claim 1, wherein the metal reinforcing plate has a circuit opening.

8. The package structure of a fingerprint identification chip according to claim 7, wherein the FPC passes through the circuit opening.

9. The package structure of a fingerprint identification chip according to claim 8, wherein at a position of the circuit opening, a bent portion is formed on the FPC.

10. The package structure of a fingerprint identification chip according to claim 9, wherein a colloid is coated on the circuit opening and the bent portion, and the colloid is an underfill.

11. The package structure of a fingerprint identification chip according to claim 1, wherein a material of the metal substrate is: stainless steel, tungsten steel, aluminum or tin plate.

12. The package structure of a fingerprint identification chip according to claim 1, wherein a material of the cover plate is: ceramic or glass.

13. The package structure of a fingerprint identification chip according to claim 1, wherein a material of the metal reinforcing plate is: stainless steel, tungsten steel, aluminum or tin plate.

14. The package structure of a fingerprint identification chip according to claim 1, wherein the thickness of the metal substrate is between 430 m and 450 m.

15. The package structure of a fingerprint identification chip according to claim 14, wherein the thickness of the metal substrate is 440 m.

16. The package structure of a fingerprint identification chip according to claim 1, wherein the thickness of the cover plate is between 110 m and 130 m.

17. The package structure of a fingerprint identification chip according to claim 16, wherein the thickness of the cover plate is 120 m.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a cross-sectional view of a conventional package structure of a fingerprint identification chip;

(2) FIG. 2 is a three-dimensional exploded view of a package structure of a fingerprint identification chip according to the present invention;

(3) FIG. 3A is a cross-sectional view of a package structure of a fingerprint identification chip according to the present invention;

(4) FIG. 3B is an enlarged view of a region A in FIG. 3A; and

(5) FIG. 3C is an enlarged view of a region B in FIG. 3A.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

(6) Advantages and features of the present invention and methods for achieving the advantages and features will be described in further detail with reference to the exemplary embodiments and accompanying drawings, so as to be easier to understand. However, the present invention may be implemented in different forms, and should not be construed as being limited to the embodiments described herein. On the contrary, for a person of ordinary skill in the art, the provided embodiments make this disclosure more thorough and comprehensive, and convey the scope of the present invention more completely.

(7) First, referring to FIG. 2, FIG. 2 is a three-dimensional exploded view of a package structure of a fingerprint identification chip according to the present invention. In FIG. 2, the package structure 10 of a fingerprint identification chip includes: a fingerprint identification chip 11, a metal substrate 12, a cover plate 13, an FPC 14 and a metal reinforcing plate 15.

(8) Referring to FIG. 2 continuously, the fingerprint identification chip 11 has an upper surface 111 and a lower surface 112. In addition, a bonding pad 112 of the fingerprint identification chip 11 may be arranged on the lower surface 112 of the fingerprint identification chip 11 by using a through silicon via (TSV) process technology and a redistribution layer (RDL) process technology. The metal substrate 12 has a through opening 121 and two grooves 122 extending from two opposite sides of the through opening 121. The through opening 121 is used for accommodating the fingerprint identification chip 11. A material of the metal substrate 12 may be: stainless steel, tungsten steel, aluminum or tin plate.

(9) One side of the cover plate 13 includes a film layer 131 and a first mucilage layer 132. The film layer 131 is used for bonding the cover plate 13 with the metal substrate 12. The first mucilage layer 132 is arranged at a position corresponding to the through opening 121 and is used for bonding the upper surface 111 of the fingerprint identification chip 11. The film layer 131 is a hot-pressing double-sided adhesive. The first mucilage layer 132 is a thermosetting hydrogel. A material of the cover plate 13 may be: ceramic or glass. In a preferred implementation, the cover plate 13 is made of sapphire glass. In addition, although the present invention proposes the implementation of arranging the film layer 131 and the first mucilage layer 132 on one side of the cover plate 13, it is also possible to arrange the film layer 131 on one side of the metal substrate 12 or arrange the first mucilage layer 132 on the upper surface 111 of the fingerprint identification chip 11 during actual application. The arrangement manner is not limited to the implementation proposed in the present invention.

(10) The FPC 14 has a first surface 141, a second surface 142 and a bent portion 143. A second mucilage layer 1411 is arranged on the first surface 141 and is used for bonding the lower surface 112 of the fingerprint identification chip 11. The second surface 142 is provided with a first metal contact 1421 at one end and provided with a second metal contact 1422 at an opposite end. The second mucilage layer 1411 is also a thermosetting hydrogel. In addition, although the present invention proposes the implementation of arranging the second mucilage layer 1411 on the first surface 141 of the FPC 14, it is also possible to arrange the second mucilage layer 1411 on the lower surface 112 of the fingerprint identification chip 11 during actual application. The arrangement manner is not limited to the implementation proposed in the present invention.

(11) The metal reinforcing plate 15 has a circuit opening 151. The metal reinforcing plate 15 may be inserted into and accommodated in the two grooves 122 of the metal substrate 12. The circuit opening 151 allows the FPC 14 to pass through. In addition, a material of the metal reinforcing plate 15 may be: stainless steel, tungsten steel, aluminum or tin plate.

(12) Next, referring to FIG. 3A, FIG. 3A is a cross-sectional view of a package structure of a fingerprint identification chip according to the present invention. In FIG. 3A, the cover plate 13 can be fixedly disposed on one side of the metal substrate 12 by means of bonding of the film layer 131. On the other hand, the cover plate 13 may also cover the upper surface 111 of the fingerprint identification chip 11 and be bonded with the upper surface 111 of the fingerprint identification chip 11 by means of the first mucilage layer 132, thereby fixing the fingerprint identification chip 11. In this way, the fingerprint identification chip 11 can be disposed in the through opening 121 of the metal substrate 12. The FPC 14 is disposed on the lower surface 112 of the fingerprint identification chip 11 and is bonded with the lower surface 112 of the fingerprint identification chip 11 by means of the second mucilage layer 1411. In addition, the depth of the through opening 121 is greater than a sum of the thickness of the fingerprint identification chip 11 and the thickness of the FPC 14, so that the through opening 121 can completely accommodate the fingerprint identification chip 11 and the FPC 14. The bonding pad 1121 arranged on the lower surface 112 of the fingerprint identification chip 11 is electrically connected to the first metal contact 1421 of the second surface 142 of the FPC 14 through a wire W. Subsequently, the metal reinforcing plate 15 can be inserted into the two grooves 122 of the metal substrate 12 and can completely cover the through opening 121 of the metal substrate 12. On the other hand, the metal reinforcing plate 15 may be first bonded with the second surface 142 of the FPC 14 by using a thermosetting adhesive (not shown in the figure), so as to improve mechanical strength of the FPC 14. Then, the metal reinforcing plate 15 is fixed in the two grooves 122 of the metal substrate 12 by means of laser welding or colloid bonding.

(13) Referring to FIG. 3A continuously, a part of the FPC 14 that is not bonded with the lower surface 112 of the fingerprint identification chip 11 passes through the circuit opening 151 of the metal reinforcing plate 15 and the bent portion 143 of the FPC 14 is provided at a position corresponding to the circuit opening 151. The second metal contact 1422 of the FPC 14 is disposed outside the package structure 10 of the fingerprint identification chip and is used for being electrically connected to a metal contact of a main circuit board of an electronic device (not shown in the figure), such that fingerprint data detected by the fingerprint identification chip 11 is output to the electronic device for subsequent processing of the fingerprint data.

(14) Referring to FIG. 3A continuously, in FIG. 3A, the thickness of the cover plate 13 is between 110 m and 130 m; the thickness of the film layer 131 is approximately 20 m; the thickness of the metal substrate 12 is between 430 m and 450 m; the thickness of the metal reinforcing plate 15 is between 110 m and 130 m. Because the metal reinforcing plate 15 can be inserted into and accommodated in the two grooves 122 of the metal substrate 12 with affecting the overall thickness of the package structure 10 of the fingerprint identification chip, the overall thickness of the package structure 10 of the fingerprint identification chip may be between 560 m and 600 m. In a preferred implementation, the thickness of the cover plate 13 is 120 m; the thickness of the film layer 131 is approximately 20 m; the thickness of the metal substrate 12 is 440 m; the thickness of the metal reinforcing plate 15 is 120 m. The overall thickness of the package structure 10 of the fingerprint identification chip is 580 m.

(15) Referring to FIG. 3B, FIG. 3B is an enlarged view of a region A in FIG. 3A. In FIG. 3B, a colloid G may be coated on the bonding pad 1121, the wire W and the first metal contact 1421, to protect the wire W and thereby improve the mechanical strength and impact resistance of the wire W. The colloid G is an underfill.

(16) Next, referring to FIG. 3C, FIG. 3C is an enlarged view of a region B in FIG. 3A. In FIG. 3C, a colloid G is coated on the circuit opening 151 of the metal reinforcing plate 15 and the bent portion 143 of the FPC 14, so as to seal the package structure 10 of the fingerprint identification chip. In this way, moisture or suspended particles in an external environment can be prevented from entering the package structure 10 of the fingerprint identification chip through the circuit opening 151 and affecting operation of the package structure 10. The colloid G is also an underfill.

(17) Compared with the prior art, the present invention provides a thin package structure of a fingerprint identification chip, so as to reduce space required when the fingerprint identification chip is configured in an electronic device. In this way, the flexibility and degree of freedom of electronic circuit configuration inside the electronic device can be effectively improved. On the other hand, the package structure of the fingerprint identification chip, which uses a metal substrate as a main body, can also become thin while maintaining desirable mechanical strength, without causing warping of the appearance. Therefore, the present invention is a creation with great industrial value.

(18) Various modifications may be made to the present invention by a person skilled in the art without departing from the protection scope of the appended claims.