A multilayer ceramic capacitor that includes a laminated body of multiple dielectric layers and internal electrodes laminated alternately therewith. The dielectric layers contain Ba, Sr, Ti, Ca, Zr, Mg, and R, where R represents at least one element of Y, La, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and Yb. When Ti is 100 parts by mol, the dielectric layers contain Sr at 0.5 to 3.0 parts by mol; Ca at 3 to 15 parts by mol; Sr at 0.05 to 3.0 parts by mol; Mg at 0.01 to 0.0 9 parts by mol; and R at 2.5 to 8.4 parts by mol.

A composite film having a high dielectric permittivity engineered particles dispersed in a high breakdown strength polymer material to achieve high energy density.

A thin-film capacitor includes: a body in which a plurality of dielectric layers and first and second internal electrodes are alternately disposed on a substrate; and first and second external electrode disposed on an external surface of the body. A plurality of vias are disposed in the body, a first via connects first internal electrodes to each other, and penetrates from the external surface of the body to the lowermost first internal electrode, a second via connects second internal electrodes to each other, and penetrates from the external surface of the body to the lowermost second internal electrode, and the plurality of vias have a multistage shape, and at least one internal electrode has an etched portion of 0.3 to 0.7 layer in relation to one layer of the internal electrode.

A metallized film capacitor includes: a metallized film columnar body including two metallized films that are laminated and wound, the two metalized films each including a vapor-deposited metal film with a plurality of vapor-deposition-free slits and fuse portions each interposed between the vapor-deposition-free slits, and a polyvinylidene fluoride dielectric film, the metallized film columnar body having two electrode extraction surfaces; metal-sprayed parts disposed respectively on the two electrode extraction surfaces: and outgoing terminals joined respectively to the metal-sprayed parts. Each of the two metallized films has a shape with successive sloped ridges and valleys in a cross-section orthogonal to a winding direction, and the two metallized films are laminated such that the ridges and valleys of one of the metallized films are aligned with the ridges and valleys of the other one of the metallized films.

A thin film capacitor includes: a supporting substrate; a capacitance forming member formed on the supporting substrate and made of at least two thin film electrodes and at least one thin film dielectric layer alternately stacked on one another; intermediate electrodes electrically connected to the respective thin film electrodes; a sealing member that seals the capacitance forming member and the intermediate electrodes on the supporting substrate the sealing member leaving portions of the intermediate electrodes exposed; and external electrodes formed on at least side faces of the sealing member and respectively connected to the exposed portions of the intermediate electrodes.

A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.

A capacitor includes a first conductive plate, a second conductive plate, a floating conductive plate and a dielectric material separating the floating conductive plate from the first conductive plate and from the second conductive plate. The floating conductive plate has a first surface closer to the first conductive plate than to the second conductive plate and has a second surface closer to the second conductive plate than to the first conductive plate. In response to an electric field between the first conductive plate and the second conductive plate, charge separation is induced in the floating conductive plate such that a first charge induced on the first surface has a first polarity and a second charge induced on the second surface has a second polarity, where the second polarity different from the first polarity.

Methods for forming a graft copolymer of a poly(vinylidene fluoride)-based polymer and at least one type of electrically conductive polymer, wherein the electrically conductive polymer is grafted on the poly(vinylidene fluoride)-based polymer are provided. The methods comprise a) irradiating a poly(vinylidene fluoride)-based polymer with a stream of electrically charged particles; b) forming a solution comprising the irradiated poly(vinylidene fluoride)-based polymer, an electrically conductive monomer and an acid in a suitable solvent; and c) adding an oxidant to the solution to form the graft copolymer. Graft copolymers of a poly(vinylidene fluoride)-based polymer and at least one type of electrically conductive polymer, wherein the electrically conductive polymer is grafted on the poly(vinylidene fluoride)-based polymer, nanocomposite materials comprising the graft copolymer, and multilayer capacitors comprising the nanocomposite material are also provided.

Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. The upper electrode layer has a connection part connected to the lower electrode layer through the through hole and an electrode part insulated from the connection part by a slit. A surface of the lower electrode layer that contacts the connection part through the through hole includes an annular area positioned along an inner wall surface of the through hole and a center area surrounded by the annular area. The annular area is lower in surface roughness than the center area.

A method for producing a capacitor stack in one portion of a substrate, the method including: forming a cavity along a thickness of the portion of the substrate from an upper face of the substrate, depositing a plurality of layers contributing to the capacitor stack onto the wall of the cavity and onto the surface of the upper face, and removing matter from the layers until the surface of the upper face is reached. The forming of the cavity includes forming at least one trench and, associated with each trench, at least one box. The at least one trench includes a trench outlet that opens into the box. The box includes a box outlet that opens at the surface of the upper face, and the box outlet being shaped to be larger than the trench outlet.