A method of forming capacitors includes providing first capacitor electrodes within support material. The first capacitor electrodes contain TiN and the support material contains polysilicon. The polysilicon-containing support material is dry isotropically etched selectively relative to the TiN-containing first capacitor electrodes using a sulfur and fluorine-containing etching chemistry. A capacitor dielectric is formed over sidewalls of the first capacitor electrodes and a second capacitor electrode is formed over the capacitor dielectric. Additional methods are disclosed.

A method of forming capacitors includes providing first capacitor electrodes within support material. The first capacitor electrodes contain TiN and the support material contains polysilicon. The polysilicon-containing support material is dry isotropically etched selectively relative to the TiN-containing first capacitor electrodes using a sulfur and fluorine-containing etching chemistry. A capacitor dielectric is formed over sidewalls of the first capacitor electrodes and a second capacitor electrode is formed over the capacitor dielectric. Additional methods are disclosed.

There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745.

A case-mold-type capacitor includes a capacitor element, first and second bus bars connected to the first and second electrodes of the capacitor element, a case accommodating the capacitor element and the first and second bus bars, and a mold resin filling the case therein. The case has a cutaway portion provided therein. A sealing plate joined to the case so as to seal the cutaway portion. The first and second bus bars pass through the sealing plate and are fixed to the sealing plate. The case-mold-type capacitor improves dimensional accuracy between terminal portions of the first and second bus bars without increasing material cost, and has high reliability.

A case-mold-type capacitor includes a capacitor element, first and second bus bars connected to the first and second electrodes of the capacitor element, a case accommodating the capacitor element and the first and second bus bars, and a mold resin filling the case therein. The case has a cutaway portion provided therein. A sealing plate joined to the case so as to seal the cutaway portion. The first and second bus bars pass through the sealing plate and are fixed to the sealing plate. The case-mold-type capacitor improves dimensional accuracy between terminal portions of the first and second bus bars without increasing material cost, and has high reliability.

A multilayer ceramic electronic component may include a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, a length of the ceramic body being 1300 μm or less; a first external electrode; a second external electrode; a third external electrode; a first internal electrode connected to the first and second external electrodes; and a second internal electrode connected to the third external electrode. When a thickness of the first to third external electrodes formed on the first and second main surfaces and the first and second side surfaces is defined as to and an interval between adjacent external electrodes among the first to third external electrodes is defined as G, 5≦G/te is satisfied.

An electrical multilayer component includes a stack composed of functional layers and also a first and a second external contact. The external contacts are arranged on side surfaces of the stack. Internal electrodes of a first type are directly electrically conductively connected to the first external contact and internal electrodes of a second type directly electrically conductively connected to the second external contact. An internal electrode of the first type and an internal electrode of the second type partly overlap. An internal electrode of the first type and an internal electrode of the second type are arranged in a manner spaced apart from one another in an identical plane.

A feedthrough terminal assembly for active implantable medical devices includes an electrically conductive pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. The electrically conductive pad enables direct thermal or ultrasonic bonding of a circuit board or lead wire to the terminal pin.

A feedthrough terminal assembly for active implantable medical devices includes an electrically conductive pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. The electrically conductive pad enables direct thermal or ultrasonic bonding of a circuit board or lead wire to the terminal pin.

A plurality of electrically conductive material layers and a plurality of dielectric layers are alternately stacked on a second substrate. The plurality of electrically conductive material layers comprise first and second patterns. The first pattern comprises at least a first pair of overlaying areas free of the electrically conductive material, and the second pattern comprises at least a second pair of overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. The plurality of electrically conductive material layers are electrically isolated from one another by the dielectric layers.