A capacitor structure and a method of manufacturing the same, and a memory are provided. The method includes the following operations. A substrate is provided. A first conductive structure with a shape of column is formed on the substrate. A second conductive structure is formed on the substrate. The second conductive structure surrounds the first conductive structure and is spaced with the first conductive structure. The first conductive structure and the second conductive structure together form a bottom electrode. A capacitor dielectric layer is formed. The capacitor dielectric layer covers the surface of the substrate and the surface of the bottom electrode. A top electrode covering the surface of the capacitor dielectric layer is formed.

A thin film capacitor includes a body including a lower electrode formed on a substrate, a plurality of first electrode layers, and a plurality of second electrode layers stacked alternately with the plurality of first electrode layers, with one of the dielectric layers interposed therebetween. The lower electrode and the first electrode layer have the same polarity as each other, and surface roughness of the first and second electrode layers is less than that of the dielectric layers, thereby securing capacitance and characteristics of the dielectric layers.

A thin film capacitor includes a body including a lower electrode formed on a substrate, a plurality of first electrode layers, and a plurality of second electrode layers stacked alternately with the plurality of first electrode layers, with one of the dielectric layers interposed therebetween. The lower electrode and the first electrode layer have the same polarity as each other, and surface roughness of the first and second electrode layers is less than that of the dielectric layers, thereby securing capacitance and characteristics of the dielectric layers.

A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes a ceramic body including internal electrodes having lead-out portions formed on ends thereof, and external electrodes disposed on portions of end surfaces of the ceramic body to be connected to the lead-out portions, and terminal electrodes coupled to both end portions of the ceramic body and including horizontal portions disposed below the ceramic body and vertical portions spaced apart from the end surfaces of the ceramic body, connected to the external electrodes, and having groove portions, and conductive adhesion layers disposed on the vertical portions of the terminal electrodes to contact the external electrodes through the groove portions.

An electronic device is provided. The electronic device includes a housing, an antenna radiating body including a conductive metal, a first member disposed within the housing and electrically connected to the antenna radiating body, a printed circuit board (PCB) disposed within the housing, a flexible connecting member disposed between at least a portion of the first member and at least a portion of a second member and including a conductive material, and a capacitor including a first conductive plate that contacts the second member or formed by a portion of the second member, a second conductive plate, separated from the first conductive plate and electrically connected to the PCB, and a dielectric layer inserted between the first conductive plate and the second conductive plate.

An electronic device is provided. The electronic device includes a housing, an antenna radiating body including a conductive metal, a first member disposed within the housing and electrically connected to the antenna radiating body, a printed circuit board (PCB) disposed within the housing, a flexible connecting member disposed between at least a portion of the first member and at least a portion of a second member and including a conductive material, and a capacitor including a first conductive plate that contacts the second member or formed by a portion of the second member, a second conductive plate, separated from the first conductive plate and electrically connected to the PCB, and a dielectric layer inserted between the first conductive plate and the second conductive plate.

A capacitor includes a dielectric layer, a first conductive layer, a second conductive layer, first inner electrodes, second inner electrodes, a first external power electrode layer, a second external power electrode layer, a first outer electrode, and a second outer electrode. The first and second inner electrodes and first and second second outer electrodes are a conductive material. The dielectric layer has through-holes connecting with a first main surface and a second main surface. The first inner electrodes are in a first set of the through-holes and connected to the first conductive layer. The second inner electrodes are in a second set of the through-holes and connected to the second conductive layer. The first outer electrode is on the first external power electrode layer and some side-faces of the dielectric layer. The second outer electrode is on the second external power electrode layer and some side-faces of the dielectric layer.

A capacitor includes a dielectric layer, a first conductive layer, a second conductive layer, first inner electrodes, second inner electrodes, a first external power electrode layer, a second external power electrode layer, a first outer electrode, and a second outer electrode. The first and second inner electrodes and first and second second outer electrodes are a conductive material. The dielectric layer has through-holes connecting with a first main surface and a second main surface. The first inner electrodes are in a first set of the through-holes and connected to the first conductive layer. The second inner electrodes are in a second set of the through-holes and connected to the second conductive layer. The first outer electrode is on the first external power electrode layer and some side-faces of the dielectric layer. The second outer electrode is on the second external power electrode layer and some side-faces of the dielectric layer.

A multilayer ceramic electronic component may include a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on the active part, and a lower cover part disposed below the active part, a buffer layer disposed in at least one of the upper and lower cover parts, and external electrodes disposed on end surfaces of the ceramic body. The buffer layer may contain a conductive metal in a content of 1 to 40 vol %.

A thin film capacitor comprises a base material, a dielectric layer provided on the base material, and an upper electrode layer provided on the dielectric layer. The dielectric layer includes a plurality of columnar crystals that extend along a normal direction with respect to a surface of the upper electrode layer, the columnar crystal has a perovskite crystal structure represented by A.sub.yBO.sub.3, an element A is at least one of Ba, Ca, Sr, and Pb, an element B is at least one of Ti, Zr, Sn, and Hf, y≤0.995 is satisfied, and the dielectric layer contains 0.05 to 2.5 mol of Al per 100 mol of A.sub.yBO.sub.3.