A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is α.sub.P and a thermal expansion coefficient of the metal layer is α.sub.M, a value of α.sub.P/α.sub.M is 5.1 or less.

A method for preparing a modified polypropylene film, the modified polypropylene film comprising a polypropylene film; and, an oxide layer and/or nitride layer, each of which has a thickness of 20-500 nm, on a surface of the polypropylene film; the method comprising: depositing the oxide layer or nitride layer on a surface of the polypropylene film by an Atomic Layer Deposition (ALD) process to obtain the modified polypropylene film; wherein the step of depositing the oxide layer or nitride layer comprises: placing the polypropylene film in an ALD reaction chamber; vacuumizing; heating up; introducing a carrier gas; and, passing at least two precursors into the reaction chamber alternately for reaction, resulting in the modified polypropylene film; wherein the precursors comprise a precursor for providing a metal element or Si, and a precursor for providing an oxygen or nitrogen element.

A polypropylene film which is capable of suppressing blocking in a rolled polypropylene film. The polypropylene film has a first surface and a second surface, contains a polypropylene resin as a main component, and is configured such that: the Svk value (SvkA) of the first surface is 0.005 μm or more and 0.030 μm or less; the Spk value (SpkA) of the first surface is more than 0.035 μm and 0.080 μm or less; the Svk value (SvkB) of the second surface is 0.005 μm or more and 0.030 μm or less; and the Spk value (SpkB) of the second surface is 0.015 μm or more and 0.035 μm or less.

A polypropylene film which is capable of suppressing blocking in a rolled polypropylene film. The polypropylene film has a first surface and a second surface, contains a polypropylene resin as a main component, and is configured such that: the Svk value (SvkA) of the first surface is 0.005 μm or more and 0.030 μm or less; the Spk value (SpkA) of the first surface is more than 0.035 μm and 0.080 μm or less; the Svk value (SvkB) of the second surface is 0.005 μm or more and 0.030 μm or less; and the Spk value (SpkB) of the second surface is 0.015 μm or more and 0.035 μm or less.

A substrate-type multi-layer polymer capacitor (MLPC), including a casing, a core, a first electroplated terminal and a second electroplated terminal. The core is arranged in an inner cavity of the casing. The casing is formed by joining two first packaging plates with two second packaging plates. The first and second electroplated terminals are formed by electroplating. The first electroplated terminal is configured to cover one end of the casing to form an anode electrically led out from the core, and the second electroplated terminal is configured to the other end of the casing to form a cathode electrically led out from the core. The first packaging plate includes a substrate, an electrode plate and two metal plates. The first and second electroplated terminals are integrally sealed with the casing.

A method for manufacturing a high-profile capacitor with high capacity includes providing a substrate, forming a first mold layer, a first supporter layer, a second mold layer, and a second supporter layer on the substrate, where at least one of the first mold layer and the second mold layer are made of a dielectric material having a low or super low dielectric constant, defining at least one contact hole, where the now-surrounding first and second supporter layers reinforce the at least one contact hole and form first and second supporter patterns respectively, forming a lower electrode on an inner surface of the at least one contact hole, and removing the first mold layer and/or the second mold layer being made of the dielectric material by ashing.

A method for manufacturing a high-profile capacitor with high capacity includes providing a substrate, forming a first mold layer, a first supporter layer, a second mold layer, and a second supporter layer on the substrate, where at least one of the first mold layer and the second mold layer are made of a dielectric material having a low or super low dielectric constant, defining at least one contact hole, where the now-surrounding first and second supporter layers reinforce the at least one contact hole and form first and second supporter patterns respectively, forming a lower electrode on an inner surface of the at least one contact hole, and removing the first mold layer and/or the second mold layer being made of the dielectric material by ashing.

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed outside of the ceramic body and connected to the first and second internal electrodes, respectively. The ceramic body includes an active portion including of the first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween to form capacitance, and a cover portion disposed in upper and lower portions of the active portion. The cover portion has a larger number of pores than the dielectric layer of the active portion, and the cover portion includes a ceramic-polymer composite filled with a polymer in the pores of the cover portion.

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed outside of the ceramic body and connected to the first and second internal electrodes, respectively. The ceramic body includes an active portion including of the first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween to form capacitance, and a cover portion disposed in upper and lower portions of the active portion. The cover portion has a larger number of pores than the dielectric layer of the active portion, and the cover portion includes a ceramic-polymer composite filled with a polymer in the pores of the cover portion.

A capacitor is provided with a case having a receptacle with an expandable section that allows the receptacle to extend axially when internal pressure builds within the case as a result of a fault. Terminals are mounted on the cover and electrically connected to the electrodes of a capacitor element through an interrupter plate, via leads. The plate is attached to the section of the case that extends under pressure, whereby the plate is drawn away from the cover, thereby breaking the electrical connections to the terminal. The plate may also work in conjunction with a cover that expands outward in response to internal pressure, to provide a second pressure interrupter mechanism.