Modified fluoropolymers, and methods for manufacturing modified fluoropolymers are provided. According to at least one embodiment, chemically modified fluoropolymers, via radical generation and subsequent reaction, produce fluoropolymers having fluorinated moieties and/or non-fluorinated moieties, disrupting highly coherent polar domains, wherein the non-fluorinated moieties include, for example, at least one of carbonyl, hydroxyl, alkoxy, alkyl, and/or aromatic chemical groups.

A film capacitor that includes a dielectric resin film containing a cured product of a first organic material and a second organic material; and a metal layer on at least one surface of the dielectric resin film. The first organic material contains an organic polymer having a hydroxy group and a benzene ring in a repeating unit; the second organic material contains 4,4′-diphenylmethane diisocyanate, a modified product of 4,4′-diphenylmethane diisocyanate, or a mixture thereof; and 400 ppm to 700 ppm of chlorine ions and 300 ppm to 500 ppm of phosphorus ions are present inside the dielectric resin film.

A film capacitor that includes a dielectric resin film containing a cured product of a first organic material and a second organic material; and a metal layer on at least one surface of the dielectric resin film. The first organic material contains an organic polymer having a hydroxy group and a benzene ring in a repeating unit; the second organic material contains 4,4′-diphenylmethane diisocyanate, a modified product of 4,4′-diphenylmethane diisocyanate, or a mixture thereof; and 400 ppm to 700 ppm of chlorine ions and 300 ppm to 500 ppm of phosphorus ions are present inside the dielectric resin film.

A biaxially orientated polypropylene film for capacitor includes protrusions on both surfaces. The biaxially orientated polypropylene film has a thickness (t1) of 1 to 3 μm, has a ten point average roughness (SRz) of 50 nm or more and less than 500 nm on both surfaces, and meets equations (1) and (2) where one surface and the other surface are referred to as a surface A and a surface B, respectively:
150≦Pa≦400  (1)
50≦Pb≦150  (2)
wherein Pa denotes number of protrusions per 0.1 mm.sup.2 on the surface A and Pb denotes number of protrusions per 0.1 mm.sup.2 on the surface B.

A biaxially orientated polypropylene film for capacitor includes protrusions on both surfaces. The biaxially orientated polypropylene film has a thickness (t1) of 1 to 3 μm, has a ten point average roughness (SRz) of 50 nm or more and less than 500 nm on both surfaces, and meets equations (1) and (2) where one surface and the other surface are referred to as a surface A and a surface B, respectively:
150≦Pa≦400  (1)
50≦Pb≦150  (2)
wherein Pa denotes number of protrusions per 0.1 mm.sup.2 on the surface A and Pb denotes number of protrusions per 0.1 mm.sup.2 on the surface B.

A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes disposed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer disposed on a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first insulating coating layer disposed between the first and second electrode layers and having a discontinuous region, and a second insulating coating layer having a discontinuous region to cover at least a portion of a surface of the body. The second insulating coating layer is exposed from the external electrodes.

A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes disposed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer disposed on a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first insulating coating layer disposed between the first and second electrode layers and having a discontinuous region, and a second insulating coating layer having a discontinuous region to cover at least a portion of a surface of the body. The second insulating coating layer is exposed from the external electrodes.

There is provided a resin composition that can greatly improve voltage endurance while ensuring high capacitance and excellent circuit adhesion, when used as the dielectric layer of a capacitor. This resin composition includes a binder component including bisphenol S, an epoxy resin curing agent having a phenolic hydroxyl group, and an epoxy resin; and a dielectric filler.

There is provided a resin composition that can greatly improve voltage endurance while ensuring high capacitance and excellent circuit adhesion, when used as the dielectric layer of a capacitor. This resin composition includes a binder component including bisphenol S, an epoxy resin curing agent having a phenolic hydroxyl group, and an epoxy resin; and a dielectric filler.

A film capacitor includes a stack including at least one dielectric film and a plurality of metal films, the at least one dielectric film including a polyarylate film, wherein each of the at least one of dielectric film and each of the plurality of metal films are alternately stacked in a stacking direction, each of the plurality of metal films deposited on each of the at least one dielectric film by vapor deposition, cover films on two first side surfaces, the two first side surfaces facing each other in a first direction, the first direction orthogonal to the stacking direction, the cover films containing a polyester hot-melt resin, and metal-sprayed electrodes on two second side surfaces, the two second side surfaces facing each other in a second direction, the second direction perpendicular to the first direction and orthogonal to the stacking direction.