A film capacitor includes a stack including at least one dielectric film and a plurality of metal films, the at least one dielectric film including a polyarylate film, wherein each of the at least one of dielectric film and each of the plurality of metal films are alternately stacked in a stacking direction, each of the plurality of metal films deposited on each of the at least one dielectric film by vapor deposition, cover films on two first side surfaces, the two first side surfaces facing each other in a first direction, the first direction orthogonal to the stacking direction, the cover films containing a polyester hot-melt resin, and metal-sprayed electrodes on two second side surfaces, the two second side surfaces facing each other in a second direction, the second direction perpendicular to the first direction and orthogonal to the stacking direction.

A polypropylene film which has a crystallite size of not more than 12.2 nm, the crystallite size being determined using Scherrer's equation from a full width at half maximum of the reflection peak from (040) plane of α crystal measured by a wide-angle X-ray diffraction method, and a volume resistivity of not lower than 6×10.sup.14 Ω.Math.cm, the volume resistivity being calculated in accordance with equation I from a current value that is measured 1 minute after applying a voltage at a potential gradient of 200 V/μm in an environment at 100° C. Equation I: volume resistivity=[(effective electrode area)×(applied voltage)]/[(polypropylene film thickness)×(current value)].

A polypropylene film which has a crystallite size of not more than 12.2 nm, the crystallite size being determined using Scherrer's equation from a full width at half maximum of the reflection peak from (040) plane of α crystal measured by a wide-angle X-ray diffraction method, and a volume resistivity of not lower than 6×10.sup.14 Ω.Math.cm, the volume resistivity being calculated in accordance with equation I from a current value that is measured 1 minute after applying a voltage at a potential gradient of 200 V/μm in an environment at 100° C. Equation I: volume resistivity=[(effective electrode area)×(applied voltage)]/[(polypropylene film thickness)×(current value)].

A film capacitor that includes a dielectric resin film having a first surface and a second surface opposite to the first surface, the second surface having a silicone resin-containing layer; a first metal layer opposite to the first surface of the dielectric resin film; and a second metal layer opposed to the second surface of the dielectric resin film.

A stacked capacitor includes a body having opposing faces, first side faces in a first direction, and second side faces in a second direction. The body includes a first insulation margin without a first metal film and a second insulation margin without a second metal film. The first metal film includes a metal film edge overlapping the second insulation margin. The second metal film includes a metal film edge overlapping the first insulation margin. The first and second metal films each include multiple sub-films separated by multiple first slits. A first slit includes a first portion extending from the first or second insulation margin along the first side faces and a second portion located in the metal film edge and extending at an angle with the first side faces. The second portion has a length in the first direction greater than or equal to an interval between adjacent first slits.

A stacked capacitor includes a body having opposing faces, first side faces in a first direction, and second side faces in a second direction. The body includes a first insulation margin without a first metal film and a second insulation margin without a second metal film. The first metal film includes a metal film edge overlapping the second insulation margin. The second metal film includes a metal film edge overlapping the first insulation margin. The first and second metal films each include multiple sub-films separated by multiple first slits. A first slit includes a first portion extending from the first or second insulation margin along the first side faces and a second portion located in the metal film edge and extending at an angle with the first side faces. The second portion has a length in the first direction greater than or equal to an interval between adjacent first slits.

A film capacitor that includes a wound body having a dielectric film and a metal layer. When a film face positioned at an average height in the thickness direction is defined in an area range of 100 μm by 140 μm of the first main surface of the dielectric film, an area ratio of a region having a height higher than the film face by 0.05 μm or more and less than 0.20 μm is 6.04% or less, an area ratio of a region having a height higher than the film face by 0.20 μm or more and less than 2.50 μm is 0.0998% to 1.13%, and an area ratio of a region having a height higher than the film face by 2.50 μm or more is 0.100% or less.

A film capacitor that includes a wound body having a dielectric film and a metal layer. When a film face positioned at an average height in the thickness direction is defined in an area range of 100 μm by 140 μm of the first main surface of the dielectric film, an area ratio of a region having a height higher than the film face by 0.05 μm or more and less than 0.20 μm is 6.04% or less, an area ratio of a region having a height higher than the film face by 0.20 μm or more and less than 2.50 μm is 0.0998% to 1.13%, and an area ratio of a region having a height higher than the film face by 2.50 μm or more is 0.100% or less.

A film capacitor that includes: a wound body in which a dielectric film and a metal layer are wound, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the dielectric film including a first main surface and a second main surface opposed to each other in a thickness direction, the metal layer being disposed at least on the first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 .Math.m by 140 .Math.m of the first main surface of the dielectric film, a skewness of the first main surface of the dielectric film is 0.782 to 14.3.

A film capacitor that includes: a wound body in which a dielectric film and a metal layer are wound, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the dielectric film including a first main surface and a second main surface opposed to each other in a thickness direction, the metal layer being disposed at least on the first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 .Math.m by 140 .Math.m of the first main surface of the dielectric film, a skewness of the first main surface of the dielectric film is 0.782 to 14.3.