A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.

A header for an electronic component including a base body, a thermoelectric cooler, a carrier and first and second conductor track arrangements. The thermoelectric cooler is thermally attached to the base body. The carrier is coupled to the thermoelectric cooler and is cooled thereby. The first and second conductor track arrangements each have a signal conductor, at least one grounding conductor and an end. The second conductor track arrangement is on the carrier and connected to the electronic component. The first and second conductor track arrangements are separated by a gap that is bridged by bonding wire connections electrically connecting the first and second signal conductors and electrically connecting the two grounding conductors, the ends facing each other across the gap, at least one of the ends having a capacitive structural feature that increases the capacitance of the first and/or the second conductor track arrangement.

An electronic component mounting package and an electronic device provide improved reliability. An electronic component mounting package includes a heat sink having a mount area in its middle, on which an electronic component is mountable, a frame installed on the heat sink to surround the mount area, a bond joining the heat sink and the frame together, and lead terminals installed on the upper surface of the frame to extend outward from the frame. The heat sink includes a metal, and includes a first portion having the mount area and a second portion thinner than the first portion. The second portion has a metallic crystal with a crystal grain size smaller than a crystal grain size of a metallic crystal of the first portion in a heat-sink thickness direction.

An electronic component mounting package and an electronic device provide improved reliability. An electronic component mounting package includes a heat sink having a mount area in its middle, on which an electronic component is mountable, a frame installed on the heat sink to surround the mount area, a bond joining the heat sink and the frame together, and lead terminals installed on the upper surface of the frame to extend outward from the frame. The heat sink includes a metal, and includes a first portion having the mount area and a second portion thinner than the first portion. The second portion has a metallic crystal with a crystal grain size smaller than a crystal grain size of a metallic crystal of the first portion in a heat-sink thickness direction.

A multi-wavelength integrated device (5) including plural semiconductor lasers (6) and plural modulators (7) modulating output beams of the plural semiconductor lasers (6) respectively is mounted on the stem (1). Plural leads (10) penetrates through the stem (1) and are connected to the plural semiconductor lasers (6) and the plural modulators (7) respectively. Each lead (10) is a coaxial line in which plural layers are concentrically overlapped with one another. The coaxial line includes a high frequency signal line (12) transmitting a high frequency signal to the modulator (7), a GND line (14), and a feed line (16) feeding a DC current to the semiconductor laser (6). The high frequency signal line (12) is arranged at a center of the coaxial line. The GND line (14) and the feed line (16) are arranged outside the high frequency signal line (12).

A first portion of an element-side terminal of a semiconductor element includes a projection. A second portion of the case-side terminal of a case includes a recess which comes into contact with a projection. The projection includes a first end surface and a second end surface continuous with the top surface. The recess includes a first lateral surface which is in continuous with a bottom surface and is in contact with the first end surface, and a second lateral surface which is in contact with the bottom surface and is in contact with the second end surface. As viewed from a lateral wall side, the first end surface and the first lateral surface are inclined in a first direction, and the second end surface and the second lateral surface are inclined in a second direction intersecting the first direction.

A first portion of an element-side terminal of a semiconductor element includes a projection. A second portion of the case-side terminal of a case includes a recess which comes into contact with a projection. The projection includes a first end surface and a second end surface continuous with the top surface. The recess includes a first lateral surface which is in continuous with a bottom surface and is in contact with the first end surface, and a second lateral surface which is in contact with the bottom surface and is in contact with the second end surface. As viewed from a lateral wall side, the first end surface and the first lateral surface are inclined in a first direction, and the second end surface and the second lateral surface are inclined in a second direction intersecting the first direction.

A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.

The invention relates to a component comprising a first part, a second part, a housing body, and a first electrode, wherein the housing body encloses the first electrode in lateral directions at least in some regions. The first electrode has a front face and a rear face facing away from the front face, and the front and rear faces are free of a cover produced by a material of the housing body at least in some regions. The first part is arranged on the front face, and the second part is arranged on the rear face, and both the first and second parts are connected to the first electrode in an electrically conductive manner. The first electrode is designed to be continuous and is arranged between the first part and the second part in the vertical direction. Also described is a method for producing the component.

A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.