A self-healing capacitor comprises a first electrode, a second electrode, and a dielectric layer disposed between said first and second electrodes and having first surface faced the first electrode and second surface faced the second electrode. At least one of the electrodes can include metal foam. The dielectric layer can have electrically conductive channels that each has an exit point located on the first surface of the dielectric layer and another exit point located on the second surface of the dielectric layer. The electrodes can include local contact breakers each of which is located within the electrode at an interface between the dielectric layer and the electrode and opposite at least one exit point of each electrically conductive channel in the dielectric layer. The local contact breakers can prevent electric current through the conductive channels in dielectric layer.

An atomic layer deposition-inhibiting material composed of a fluorine-containing resin that has a fluorine content of 30 at % or greater, has at least one tertiary carbon atom and quaternary carbon atom, and lacks ester groups, hydroxyl groups, carboxyl groups, and imide groups.

A method for producing a film capacitor, the method including a sealing material supplying step of supplying a curable sealing material 30a to an element accommodating space 20a in which a film capacitor element 10 having a rolled body 12 is accommodated; and a curing step of curing the sealing material 30a in a state in which the rolled body 12 is embedded in the sealing material 30a, in which at the time of initiating the sealing material supplying step, the rolled body 12 is not fixed by the sealing material 30a, and in the sealing material supplying step, the sealing material 30a is supplied to the element accommodating space 20a without curing the sealing material 30a, from the beginning of the supply of the sealing material 30a to the element accommodating space 20a until the rolled body 12 is embedded in the sealing material 30a.

There are provided a dielectric film which is excellent in heat resistance and is capable of improvement in breakdown field, a film capacitor and a combination type capacitor using the dielectric film, an inverter, and an electric vehicle. A film capacitor having excellent heat resistance and high breakdown field is obtained by producing a film capacitor that uses a dielectric film comprising an organic resin and a plurality of fine particles containing a metal element, an average of diameters of the fine particles falling in a range of 0.5 nm to 50 nm. Such a film capacitor and a combination type capacitor connected thereto via a bus bar are preferably used in an inverter and an electric vehicle.

There are provided a dielectric film which is excellent in heat resistance and is capable of improvement in breakdown field, a film capacitor and a combination type capacitor using the dielectric film, an inverter, and an electric vehicle. A film capacitor having excellent heat resistance and high breakdown field is obtained by producing a film capacitor that uses a dielectric film comprising an organic resin and a plurality of fine particles containing a metal element, an average of diameters of the fine particles falling in a range of 0.5 nm to 50 nm. Such a film capacitor and a combination type capacitor connected thereto via a bus bar are preferably used in an inverter and an electric vehicle.

A composite film having a high dielectric permittivity engineered particles dispersed in a high breakdown strength polymer material to achieve high energy density.

A multi-layered capacitor device is provided in which the multi-layered capacitor device includes a metal or metal-oxide ground electrode, a capacitor dielectric layer, a metal or metal-oxide top electrode, a hole blocking layer and an electron blocking layer. The hole blocking layer is located at the interface of the metal or metal-oxide ground electrode and the capacitor dielectric layer to increases the effective barrier height at the interface. The electron blocking layer is located at the interface of the metal or metal-oxide top electrode and the capacitor dielectric layer to increases the effective barrier height at the interface.

A thin film high polymer laminated capacitor includes: a laminated chip including dielectric layers, and internal electrode layers including first metal layers including a first metal vapor-deposited on the dielectric layers, and second metal layers including a second metal vapor-deposited on the first metal layers. The dielectric layers and the internal electrode layers being laminated and bonded alternately, and external electrodes formed on one end and the other end of the laminated chip. The laminated chip having a first region having the first metal layers formed on the dielectric layers, which are laminated alternately, and edge regions having the second metal layers formed on layers connected to the one end and layers connected to the other end in the first metal layers, which are laminated alternately, the first region having a capacitor function region, and the edge region having a heavy edge.

A capacitor insulation system is disclosed in the present application. The insulation system includes a dielectric fluid containing a first voltage stabilizing additive of a first concentration. The insulation system further includes a dielectric film containing the first voltage stabilizing additive of a second concentration and impregnated in the dielectric fluid. The first concentration is greater than the second concentration. The insulation system prepared according to the present disclosure can provide an increased and quite stable dielectric strength.

A capacitor insulation system is disclosed in the present application. The insulation system includes a dielectric fluid containing a first voltage stabilizing additive of a first concentration. The insulation system further includes a dielectric film containing the first voltage stabilizing additive of a second concentration and impregnated in the dielectric fluid. The first concentration is greater than the second concentration. The insulation system prepared according to the present disclosure can provide an increased and quite stable dielectric strength.