In order to provide a feature for processing an image of an object being photographed using photographic data having better quality, an image analyzer 1 is provided with a selection unit 104 and a bandwidth control request unit 105. The selection unit 104 selects a second photographing device associated with a first photographing device from among a plurality of photographing devices. The bandwidth control request unit 105 transmits, to a network control device, a request for change of the transmission data amount transmittable by the second photographing device.

A hybrid switch apparatus includes a gate drive circuit producing a gate drive signal, a GaN high electron mobility transistor (HEMT) having a first gate, a first drain, and a first source. A silicon (Si) MOSFET has a second gate, a second drain, and a second source. The GaN HEMT and the Si MOSFET are connected in a parallel arrangement so that (i) the first drain and the second drain are electrically connected and (ii) the first source and the second source are electrically connected. The second gate is connected to the gate drive circuit output to receive the gate drive signal. A delay block has an input connected to the gate drive circuit output and an delay block output is configured to produce a delayed gate drive signal for driving the GaN HEMT.

A metal-oxide-semiconductor field-effect transistor (MOSFET) power device includes an active region formed on a bulk semiconductor substrate, the active region having a first conductivity type formed on at least a portion of the bulk semiconductor substrate. A first terminal is formed on an upper surface of the structure and electrically connects with at least one other region having the first conductivity type formed in the active region. A buried well having a second conductivity type is formed in the active region and is coupled with a second terminal formed on the upper surface of the structure. The buried well and the active region form a clamping diode which positions a breakdown avalanche region between the buried well and the first terminal. A breakdown voltage of at least one of the power devices is a function of characteristics of the buried well.

A device includes a field effect transistor (FET) integrated with at least a portion of a bipolar junction transistor (BJT), in which a back gate of the FET shares an electrical connection with a base of the BJT, and in which a reverse voltage can be applied to the back gate of the FET.

The present invention is directed to a semiconductor chip comprising a high voltage device and a low voltage device disposed thereon. The chip may be formed in several different configurations. For example, the semiconductor chip may include a NPN bipolar transistor, PNP bipolar transistor, a diode, an N channel DMOS transistor and the like. the first doped well being configured as a base of the DMOS transistor, a P channel DMOS transistor and the like. These and other embodiments are described in further detail below.

A semiconductor device includes a middle field stop layer having a first conductivity type impurity concentration higher than a drift layer and arranged at a position in the drift layer. A ratio of a depth of the position of the middle field stop layer from a front surface of a semiconductor substrate to a thickness of the semiconductor substrate is equal to or greater than fifteen percent and equal to or less than thirty-five percent. When an IGBT is arranged in the semiconductor device, vibration of a collector voltage waveform in a switching off of the IGBT is restricted. When a diode is arranged in the semiconductor device, vibration of a recovery waveform in a recovery operation of the diode is restricted. Accordingly, at least one of the vibrations of the recovery waveform and the collector voltage waveform in the switching is restricted.

A hybrid semiconductor bipolar switch in which a normally-on high-voltage wide-bandgap semiconductor bipolar switch and a normally-off field effect transistor are connected in a cascode (Baliga-pair) configuration. The switch may be constructed as a stacked hybrid device where a discrete transistor is bonded on top of a bipolar switch. Power systems may use plural switches paired with anti-parallel diodes.

An igniter semiconductor device and an igniter system can prevent the influence of a voltage drop of an ON signal voltage input to an input terminal and the influence of a surge voltage, allow a switching element to operate reliably, and prevent an ignition failure. The igniter semiconductor device includes an external terminal including at least an input terminal, an output terminal electrically connected to an ignition coil, a ground terminal, and a power supply terminal electrically connected to a regulated power supply wire outside the igniter semiconductor device. The ignited semiconductor device further includes a switching element for controlling current flowing in the ignition coil, and a driving circuit that receives power through the power supply terminal and drives the switching element based on a signal input from the input terminal.

A MOS transistor includes a p-type semiconductor substrate, a p-type epitaxial layer, and an n-type buried layer provided in a boundary between the semiconductor substrate and the epitaxial layer. In a p-type body layer provided in a surface portion of the epitaxial layer, an n-type source layer is provided to define a double diffusion structure together with the p-type body layer. An n-type drift layer is provided in a surface portion of the epitaxial layer in spaced relation from the body layer. An n-type drain layer is provided in a surface portion of the epitaxial layer in contact with the n-type drift layer. A p-type buried layer having a lower impurity concentration than the n-type buried layer is buried in the epitaxial layer between the drift layer and the n-type buried layer in contact with an upper surface of the n-type buried layer.

A semiconductor device, including a semiconductor layer of a first conductivity type, having a main surface with a diode trench formed therein, an inner wall insulating film, including a side wall insulating film, formed along side walls of the diode trench, and a bottom wall insulating film, formed along a bottom wall of the diode trench and having a thickness greater than a thickness of the side wall insulating film, and a bidirectional Zener diode, formed on the bottom wall insulating film inside the diode trench and having a pair of first conductivity type portions and at least one second conductivity type portion formed between the pair of first conductivity type portions.