The present application discloses an array substrate, a display panel and a display device. The array substrate comprises: a plurality of data lines and a plurality of gate lines, a plurality of pixel units defined by the plurality of data lines and the plurality of gate lines, each pixel unit comprising a first pixel electrode, a second pixel electrode, and at least three thin film transistors, the pixel unit further comprising: a charge-discharge element, the charge-discharge element and a third thin film transistor in the at least three thin film transistors charging and discharging the pixel unit such that the pixel unit forms a first voltage region and a second voltage region with different voltages.

A liquid crystal display includes: a gate line connected to a gate electrode; a semiconductor layer disposed on the gate line and including silicon; an ohmic contact layer disposed on the semiconductor layer; and a data conductor disposed on the ohmic contact layer. The semiconductor layer includes a source region, a drain region, and a channel region disposed between the source region and the drain region. The data conductor includes a data line transmitting a data signal, a source electrode corresponding to the source region, and a drain electrode corresponding to the drain region. A channel step of the semiconductor layer is a height difference between an upper surface in the source region or the drain region and an upper surface in the channel region. The upper surface in the source region or the drain region has a maximum height of the semiconductor layer.

A thin-film transistor includes a gate electrode, a gate dielectric on the gate electrode, a first layer including a source region, a drain region, and a semiconductor region above and in direct contact with the gate dielectric and physically connecting the source and drain regions, and a second layer including an insulator material on the semiconductor region. The semiconductor region has less vertical thickness than the source and drain regions. In an embodiment, the thickness of the semiconductor region is no more than half that of the source and drain regions. In another embodiment, the second layer physically connects and electrically separates the source and drain regions. In yet another embodiment, a memory cell includes this transistor and a capacitor electrically connected to the drain region, the gate electrode being electrically connected to a wordline and the source region being electrically connected to a bitline.

A thin film transistor 101 includes: a gate electrode 2; a gate insulating layer 3; a semiconductor layer 4 including an amorphous semiconductor layer 4a and a crystalline semiconductor layer 4c that is disposed on a portion of the amorphous semiconductor layer 4a, the semiconductor layer 4 including an active region Rc that includes the crystalline semiconductor layer 4c and a portion of the amorphous semiconductor layer 4a, and the semiconductor layer 4 including first and second semiconductor regions Rs and Rd which respectively include first and second amorphous portions A1 and A2 that are located on opposite sides of the active region Rc; a protective insulating layer 5; first and second contact layers Cs and Cd disposed on the semiconductor layer 4 and the protective insulating layer 5; a source electrode 8s; and a drain electrode 8d. The first contact layer Cs includes a first amorphous contact layer 7s that is directly in contact with the first semiconductor region Rs and a portion of a side surface of the crystalline semiconductor layer 4c. The second contact layer Cd includes a second amorphous contact layer 7d that is directly in contact with the second semiconductor region Rd and another portion of the side surface of the crystalline semiconductor layer 4c.

In some embodiments, the present disclosure relates to an integrated chip that includes a gate electrode over a substrate, and a gate dielectric layer arranged over the gate electrode. The gate dielectric layer includes a ferroelectric material. An active structure is arranged over the gate dielectric layer and includes a semiconductor material. A source contact and a drain contact are arranged over the active structure. A capping structure is arranged between the source and drain contacts and over the active structure. The capping structure includes a first metal material.

A liquid crystal display device according to FFS technology is provided, which sufficiently provides a common electrode with common electric potential and improves an aperture ratio of pixels. A pixel electrode is formed of a first layer transparent electrode. A common electrode made of a second layer transparent electrode is formed above the pixel electrode interposing an insulation film between them. The common electrode in an upper layer is provided with a plurality of slits. The common electrode extends over all the pixels in a display region. An end of the common electrode is disposed on a periphery of the display region and connected with a peripheral common electric potential line that provides a common electric potential Vcom. There is provided neither an auxiliary common electrode line nor a pad electrode, both of which are provided in a liquid crystal display device according to a conventional art.

To provide a display device in which parasitic capacitance between wirings can be reduced while preventing increase in wiring resistance. To provide a display device with improved display quality. To provide a display device with low power consumption. A pixel of the liquid crystal display device includes a signal line, a scan line intersecting with the signal line, a first electrode projected from the signal line, a second electrode facing the first electrode, and a pixel electrode connected to the second electrode. Part of the scan line has a loop shape, and part of the first electrode is located in a region overlapped with an opening of the scan line. In other words, part of the first electrode is not overlapped with the scan line.

An oxide semiconductor layer which is intrinsic or substantially intrinsic and includes a crystalline region in a surface portion of the oxide semiconductor layer is used for the transistors. An intrinsic or substantially intrinsic semiconductor from which an impurity which is to be an electron donor (donor) is removed from an oxide semiconductor and which has a larger energy gap than a silicon semiconductor is used. Electrical characteristics of the transistors can be controlled by controlling the potential of a pair of conductive films which are provided on opposite sides from each other with respect to the oxide semiconductor layer, each with an insulating film arranged therebetween, so that the position of a channel formed in the oxide semiconductor layer is determined.

A thin-film transistor includes a gate electrode formed on a non-conducting substrate. A top surface of the gate electrode has an RMS roughness less than 2 nm. A gate insulator having a thickness less than 25 nm is formed on the gate electrode. A semiconductor material having a thickness less than 50 nm is formed on the gate insulator. The smooth top surface of the gate insulator promotes smooth surfaces of the semiconductor material.

A thin film transistor includes a gate, a gate insulating layer, an active layer, an ionized amorphous silicon layer, a source and a drain. The gate insulating layer covers the gate. The active layer is disposed on a side of the gate insulating layer away from the gate. The ionized amorphous silicon layer is disposed on a side of the active layer away from the gate, and the ionized amorphous silicon layer is in contact with the gate insulating layer. The source and the drain are disposed on a side of the ionized amorphous silicon layer away from the gate insulating layer, and the source and the drain are coupled to the active layer through the ionized amorphous silicon layer.