A liquid crystal display device is provided with a thin film transistor which includes a gate electrode film that is provided in a first electrode layer located over a first insulating layer, a semiconductor film that is disposed over the gate electrode film via a second insulating layer, a drain electrode and a source electrode that are provided in a second electrode layer located over the semiconductor film and are in contact with an upper surface of the semiconductor film, and a light blocking film that is disposed under the first insulating layer. At least a part thereof overlaps the semiconductor film and the gate electrode film in a plan view. One of the drain electrode and the source electrode is connected to a gate line, and the light blocking film is electrically connected to the source electrode.

A manufacturing method of a TFT array substrate is provided, comprising: depositing and forming a gate and a gate scanning line; depositing sequentially a gate insulating layer, an active layer and a second metal layer; depositing and forming a first photoresist layer and a second photoresist layer on the second metal layer; first photoresist layer comprising a first-stage photoresist layer, second-stage photoresist layer and third-stage photoresist layer with increasing thickness, the first-stage photoresist layer being in the middle of the first photoresist layer and a channel being formed; ashing to remove first-stage photoresist layer, forming a source and a drain by etching; and ashing to remove the second-stage photoresist layer, and then depositing a passivation layer as a whole; stripping third-stage photoresist layer and second photoresist layer, depositing and forming a pixel electrode and a common electrode.

A display panel includes a substrate and active switches disposed on the substrate. A light-obstructing layer is disposed between the active switches and the substrate. Each of the active switches includes a semiconductor layer. The light-obstructing layer entirely covers the semiconductor layer.

Substrates, assemblies, and techniques for an apparatus, where the apparatus includes a gate, where the gate includes a first gate side and a second gate side opposite to the first gate side, a gate dielectric on the gate, where the gate dielectric includes a first gate dielectric side and a second gate dielectric side opposite to the first gate dielectric side, a first dielectric, where the first dielectric abuts the first gate side, the first gate dielectric side, the second gate side, and the second gate dielectric side, a channel, where the gate dielectric is between the channel and the gate, a source coupled with the channel, and a drain coupled with the channel, where the first dielectric abuts the source and the drain. In an example, the first dielectric and the gate dielectric help insulate the gate from the channel, the source, and the drain.

The present disclosure provides a thin film transistor, a thin film transistor array, and a method for detecting an object to be detected, wherein the thin film transistor is configured to detect a parameter of an object to be detected bound with a metal ion and includes an active layer, wherein: a carrier of the active layer without a metal element contained in the metal ion bound is of a first mobility, and a carrier of the active layer with the metal element bound is of a second mobility different from the first mobility.

The present disclosure relates to a thin-film transistor, an array substrate, a display panel and a display device and fabrication methods thereof. The thin-film transistor includes a gate insulation layer, an active layer having a source region, a drain region, and a channel region, a first doping layer on the source region, a second doping layer on the drain region, and at least one third doping layer arranged between the first doping layer and the second doping layer, wherein the first, the second, and the third doping layers have same conductivity type, and wherein the third doping layer is positioned in the channel region and contacts the gate insulation layer, and the third doping layer does not contact the first doping layer and the second doping layer simultaneously, or the third doping layer is positioned on the channel region and only contacts the first or the second doping layer.

In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.

A thin film transistor includes: a bottom gate electrode; a bottom gate electrode insulating layer, a semiconducting active layer and a first insulating layer which are disposed on the bottom gate electrode in sequence; a source electrode and a drain electrode which are disposed at a side of the first insulating layer away from the bottom gate electrode; vias disposed in the first insulating layer at positions which correspond to the source electrode and the drain electrode respectively; and ohmic contact layers disposed on and covering the semiconducting active layer at positions corresponding to the vias respectively. Each of the source electrode and the drain electrode is in contact with a corresponding one of the ohmic contact layers through a corresponding one of the vias.

Provided are a thin film transistor structure, a manufacturing method thereof, and a display device. The method comprises: providing a substrate (10), and sequentially forming a gate (20), a gate insulating layer (30), an active layer (40), a doped layer (50), a source (610), a drain (620) and a channel region (70) on the substrate (10); placing the channel region (70) in a preset gas atmosphere for heating treatment; wherein, the channel region (70) is placed in a nitrogen atmosphere to heat for a first preset time, in a mixed atmosphere of nitrogen and ammonia to heat for a second preset time, in an ammonia atmosphere to heat for a third preset time; or first heating the channel region (70) for a fourth preset time, finally placing in the ammonia atmosphere to heat for a fifth preset time.

This application discloses a display substrate, a method of manufacturing the display substrate, and a display device. The method of manufacturing the display substrate includes a step of: sequentially forming a first structural layer, a second structural layer, a third structural layer, a fourth structural layer, and a fifth structural layer stacked on a substrate, and after the second structural layer is formed and before the third structural layer is formed, further includes the following step: performing plasma cleaning on a surface of the second structural layer.