Patent classifications
H01L29/78675
Thin film transistor and fabrication method thereof, array substrate and fabrication method thereof, and display panel
The present disclosure provides a thin film transistor and a fabrication method thereof, an array substrate and a fabrication method thereof, and a display panel. The method for fabricating a thin film transistor includes: forming an active layer including a first region, a second region and a third region on a substrate; forming a gate insulating layer on a side of the active layer away from the substrate; forming a gate electrode on a side of the gate insulating layer away from the active layer; and ion-implanting the active layer from a side of the gate electrode away from the active layer, so that the first region is formed into a heavily doped region, the second region is formed into a lightly doped region, and the third region is formed into an active region.
Display device
According to one embodiment, a display device includes first semiconductor layers crossing a first scanning line in a non-display area, the first semiconductor layers being a in number, second semiconductor layers crossing a second scanning line in the non-display area, the second semiconductor layers being b in number, and an insulating film disposed between the first and second semiconductor layers and the first and second scanning lines, wherein a and b are integers greater than or equal to 2, and a is different from b, and the first and second semiconductor layers are both entirely covered with the insulating film.
Light emitting display device and manufacturing method thereof
A light emitting display device includes: a light emitting element; a second transistor connected to a scan line; a first transistor which applies a current to the light emitting element; a capacitor connected to a gate electrode of the first transistor; and a third transistor connected to an output electrode of the first transistor and the gate electrode of the first transistor. Channels of the second transistor, the first transistor, and the third transistor are disposed in a polycrystalline semiconductor layer, and a width of a channel of the third transistor is in a range of about 1 μm to about 2 μm, and a length of the channel of the third transistor is in a range of about 1 μm to about 2.5 μm.
1T1R MEMORY WITH A 3D STRUCTURE
A memory structured in lines and columns over several superimposed levels, each level comprising an array of memory elements and gate-all-around access transistors, each transistor including a semiconductor nanowire and each gate being insulated from the gates of the other levels, further comprising: conductive portions, each crossing at least two levels and coupled to first ends of the nanowires of one column of the levels; memory stacks, each crossing the levels and coupled to second ends of the nanowires of said column; first conductive lines, each connected to the conductive portions of the same column; word lines each extending in the same level while coupling together the gates of the same line and located in said level.
THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS
A thin film transistor includes an active layer, first and second electrodes, and a third doped pattern. The active layer has a channel region, and a first electrode region and a second electrode region, the first electrode region has a first ion doping concentration, and the second electrode region has a second ion doping concentration. The first electrode and the second electrode are disposed on a side of the active layer in the thickness direction. The first electrode is coupled to the first electrode region, and the second electrode is coupled to the second electrode region. The third doped pattern is disposed between the first electrode and the first electrode region, and in direct contact with the first electrode and the first electrode region. The third doped pattern has a third ion doping concentration, and the third ion doping concentration is different from the first ion doping concentration.
Manufacturing method for liquid crystal display device
A LCD device having a large pixel holding capacitance includes opposedly facing first and second substrates, and liquid crystal between them. The first substrate includes a video signal line, a pixel electrode, a thin film transistor having a first electrode connected to the video signal line and a second electrode connected to the pixel electrode, a first silicon nitride film formed above the second electrode, an organic insulation film above the first silicon nitride film, a capacitance electrode above the organic insulation film, and a second silicon nitride film above the capacitance electrode and below the pixel electrode. A contact hole etched in both the first and second silicon nitride films connects the second electrode and the pixel electrode to each other. A holding capacitance is formed by the pixel electrode, the second silicon nitride film and the capacitance electrode.
Display device having first transistor, second transistor, and third transistor disposed on different layers
A display device includes an organic light emitting diode, a first transistor driving the organic light emitting diode, a second transistor transmitting a data signal to the first transistor, a third transistor transmitting a first power voltage to the first transistor, wherein a semiconductor pattern of the first transistor is disposed over a semiconductor pattern of the second transistor, a semiconductor pattern of the third transistor is disposed over the semiconductor pattern of the first transistor, a lower transistor insulating film is disposed between the semiconductor pattern of the first transistor and the semiconductor pattern of the second transistor, and an upper transistor insulating film is disposed between the semiconductor pattern of the first transistor and the semiconductor pattern of the third transistor.
Display device
A display device includes a polycrystalline semiconductor including a channel and electrodes of a driving transistor; a gate electrode of the driving transistor on the channel of the driving transistor; a first storage electrode on the gate electrode of the driving transistor; a light blocking layer of a first transistor and a light blocking layer of a second transistor; an oxide semiconductor including a channel and electrodes of the first transistor, and a channel and electrodes of the second transistor; a gate electrode of the first transistor on the channel of the first transistor; and a gate electrode of the second transistor on the channel of the second transistor. The light blocking layer of the first transistor and the first storage electrode are on a same layer, and the light blocking layer of the second transistor and the gate electrode of the driving transistor are on a same layer.
THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS
A thin film transistor includes a substrate and an active layer having a channel region. The active layer includes a first active pattern and at least one second active pattern. The first active pattern includes a bottom surface, a top surface and at least one side surface. The at least one side surface connects the bottom and top surfaces, and is in contact with the at least one second active pattern. A length direction of each side surface is approximately perpendicular to a length direction of the channel region. A material of at least the top surface of the first active pattern includes a first polysilicon material, and a material of the second active pattern includes a second polysilicon material; and in the length direction of the channel region, an average grain size of the first polysilicon material is greater than an average grain size of the second polysilicon material.
Circuit substrate
Provided is a display device including: a capacitor having a first electrode, a first insulating film over the first electrode, and a second electrode over the first insulating film; and a first transistor over the capacitor. The first transistor includes the second electrode a second insulating film over the second electrode, an oxide semiconductor film over the second insulating film, and a first source electrode and a first drain electrode over the oxide semiconductor film. The first source electrode and the first drain electrode are electrically connected to the oxide semiconductor film.