The present invention discloses a color filter substrate and a manufacturing method thereof and a touch screen. The color filter substrate comprises a substrate and a black matrix arranged thereon, the black matrix defines a plurality of pixel units, in each of which a color filter is arranged; the color filter substrate further comprises light sensing units as well as touch scan lines and touch sensing lines insulated from each other, the light sensing units are positioned in the pixel units; the light sensing units, the touch scan lines and the touch sensing lines are arranged in areas corresponding to the black matrix; and each light sensing unit is connected with one touch scan line and one touch sensing line and is positioned on one side of the black matrix that can receive external light.

A gas flow sensing device, and related method of manufacturing, comprising a conductive layer encapsulated in dielectric film, suspended over a cavity to form a diaphragm. The conductive layer functions as both a heating a sensing element and is patterned to provide uniform heat distribution across the diaphragm. The device is designed to sense flow from any direction relative to the device and the design of the dielectric film and diaphragm reduces sensor drift during prolonged operation.

Block components having a conductive property are mounted on lands for connection to a harness so as to increase the height of the lands on a circuit board which is to be connected to windings.

A multilayer ceramic substrate includes stacked ceramic layers, and external electrodes including first conductive layers penetrating through one region of an outermost layer of the stacked ceramic layers to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layers. Each of the first and second conductive layers is formed of a ceramic powder and a metal powder.

An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

A method for manufacturing a circuit carrier for electronic components includes making available a carrier material layer made of an electrically insulating material and having at least one connecting layer which is applied at least to a first and/or second surface of the carrier material layer and has in each case a predefined layer thickness. Each connecting layer has a number of electrically conductive connections with a predefined conductor track width. At least some of the connections are strengthened by plasma spraying, at least in certain sections, with additional electrically conductive material. As a result, a greater layer thickness than the predefined layer thickness and/or a larger conductor track width than the predefined conductor track width is obtained. Furthermore, a circuit carrier for electronic components is specified.

A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion.

An implant apparatus comprising a plurality of photo sensors, a plurality of micro electrodes, a plurality of guard rings surrounding the micro electrodes and circuitry coupled to the photo sensors and the micro electrodes are described. The photo sensors may receive incoming light. The circuit may drive the micro electrodes to stimulate neuron cells for enabling perception of a vision of the light captured by the photo sensors. The guard rings may confine electric flows from the micro electrodes to the targeted neuron cells. The apparatus may be implemented in a flexible material to conform to a shape of a human eyeball to allow the micro electrodes aligned with the neuron cells for the stimulation.

A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.

A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.