A system for object reconstruction includes an illuminating unit, comprising a coherent light source and a generator of a non-periodic pattern. A diffractive optical element (DOE) is disposed in an optical path of illuminating light propagating from the illuminating unit toward an object, thereby projecting the non-periodic pattern onto an object. An imaging unit detects a light response of an illuminated region and generating image data indicative of the object within the projected pattern. A processor reconstructs a three-dimensional (3D) map of the object responsively to a shift of the pattern in the image data relative to a reference image of the pattern.

A structure with which the zero current of a field effect transistor using a conductor-semiconductor junction can be reduced is provided. A floating electrode (102) including a conductor or a semiconductor and being enclosed by an insulator (104) is formed between a semiconductor layer (101) and a gate (105) so as to cross the semiconductor layer (101) and the floating electrode (102) is charged, whereby carriers are prevented from flowing from a source electrode (103a) or a drain electrode (103b). Accordingly, a sufficiently low carrier concentration can be kept in the semiconductor layer (101) and thus the zero current can be reduced.

A flash memory cell structure includes a semiconductor substrate, a pad dielectric layer, a floating gate, a control gate, and a blocking layer. The pad dielectric layer is disposed on the semiconductor substrate. The floating gate is disposed over the pad dielectric layer, in which the floating gate has a top surface opposite to the pad dielectric layer, and the top surface includes at least one recess formed thereon. The control gate is disposed over the top surface of the floating gate. The blocking layer is disposed between the floating gate and the control gate.

A method comprises doping a lower portion of a nanowire to form a first drain/source region, wherein the nanowire is formed over a substrate, doping an upper portion of the nanowire to form a second drain/source region, doping a middle portion of the nanowire to form a channel region, wherein the channel region is between the first drain/source region and the second drain/source region, forming a ring-shaped gate structure surrounding a lower portion of the channel region, wherein the ring-shaped gate structure comprises a vertical portion of a first work-function metal layer and depositing a low-resistivity gate metal layer over a horizontal portion of the first work-function metal layer, wherein the low-resistivity gate metal layer is electrically coupled to the vertical portion of the first work-function metal layer through the horizontal portion of the first work-function metal layer.

A CMOS type semiconductor image sensor module wherein a pixel aperture ratio is improved, chip use efficiency is improved and furthermore, simultaneous shutter operation by all the pixels is made possible, and a method for manufacturing such semiconductor image sensor module are provided. The semiconductor image sensor module is provided by stacking a first semiconductor chip, which has an image sensor wherein a plurality of pixels composed of a photoelectric conversion element and a transistor are arranged, and a second semiconductor chip, which has an A/D converter array. Preferably, the semiconductor image sensor module is provided by stacking a third semiconductor chip having a memory element array. Furthermore, the semiconductor image sensor module is provided by stacking the first semiconductor chip having the image sensor and a fourth semiconductor chip having an analog nonvolatile memory array.

A nitride semiconductor transistor device is disclosed to provide a normally-off nitride semiconductor transistor device which is excellent in switching properties with less dispersion of the properties. The nitride semiconductor transistor device has a buffer layer, a GaN layer, and an AlGaN layer in turn grown on a substrate. A first insulating film, a charge storage layer, a second insulating film, and a control electrode are in turn grown on the AlGaN layer. A source electrode and a drain electrode are formed to sandwich the charge storage layer over the AlGaN layer. A threshold voltage to shut off an electric current flowing between the source and drain electrodes through a conductive channel induced at an interface of the AlGaN layer and the GaN layer is made positive by adjusting charge stored in the charge storage layer.

It is made possible to provide a method for manufacturing a semiconductor device that has a high-quality insulating film in which defects are not easily formed, and experiences less leakage current. A method for manufacturing a semiconductor device, includes: forming an amorphous silicon layer on an insulating layer; introducing oxygen into the amorphous silicon layer; and forming a silicon oxynitride layer by nitriding the amorphous silicon layer having oxygen introduced thereinto.

A CMOS type semiconductor image sensor module wherein a pixel aperture ratio is improved, chip use efficiency is improved and furthermore, simultaneous shutter operation by all the pixels is made possible, and a method for manufacturing such semiconductor image sensor module are provided. The semiconductor image sensor module is provided by stacking a first semiconductor chip, which has an image sensor wherein a plurality of pixels composed of a photoelectric conversion element and a transistor are arranged, and a second semiconductor chip, which has an A/D converter array. Preferably, the semiconductor image sensor module is provided by stacking a third semiconductor chip having a memory element array. Furthermore, the semiconductor image sensor module is provided by stacking the first semiconductor chip having the image sensor and a fourth semiconductor chip having an analog nonvolatile memory array.

A semiconductor memory device includes a semiconductor substrate, a first insulating film disposed on the semiconductor substrate, a first conductive film disposed on the first insulating film, a second insulating film disposed on the first conductive film, a second conductive film disposed on the second insulating film, a first electrode disposed on the first conductive film through an opening formed in the second conductive film and the second insulating film, and having a first width, a second electrode that is formed on the first electrode and having a second width, and a wiring layer that is formed on the second electrode. A first width of the first electrode is wider than a second width of the second electrode.

The present disclosure relates to a memory cell, a memory array, and methods for writing a memory cell. In an example embodiment, a memory cell comprises a first transistor, a second transistor, and a differential sense amplifier. The first transistor is a Vt-modifiable n-channel transistor and the second transistor is a Vt-modifiable p-channel transistor, each transistor having first and second main electrodes. The first main electrodes of the first and second transistors are connected together. The differential sense amplifier is connected to the second main electrodes of the first and the second transistor. The differential sense amplifier is adapted for sensing the current difference between the first transistor and the second transistor.