A printing method for selectively depositing braze powders on a surface comprises extruding a filament from a nozzle moving relative to a surface, where the filament comprises a flowable carrier mixed with a braze powder. As the nozzle moves, the filament is deposited on the surface in a predetermined pattern defined by the motion of the nozzle relative to the surface; thus, the braze powders are deposited at one or more predetermined locations on the surface.

A repair method of a cast steel member having a crack formed on a surface of the cast steel member includes: forming a recess having a wedge-shaped cross section that widens in a depth direction of the cast steel member by cutting the cast steel member from the surface of the cast steel member to a predetermined depth so as to include the crack; pushing and embedding a repair member made of a metal material more flexible than the cast steel member into the recess formed in the recess forming; and diffusion-bonding the repair member to the cast steel member by heating a boundary between an exposed surface.

A method includes applying a bond layer of a first chemical composition to a first surface of a first metal body. The metal body is of a second chemical composition. The method further includes disposing a second metal body of the second chemical composition against the first metal body such that the bond layer is between the first surface of the first metal body and a second surface of the second metal body. The metal bodies are resistant to diffusion bonding. The bond layer facilitates diffusion bonding of the metal bodies. The method further includes heating the first metal body and the second metal body. The method further includes applying pressure to press the second metal body against the first metal body. The method further includes generating a diffusion bond between the metal bodies, responsive to the heating and the applying of pressure for a duration.

A method for selectively adhering braze powders to a surface comprises applying a braze powder to a surface, and then directing a laser beam onto the braze powder while the laser beam moves along a predetermined path relative to the surface. The laser beam selectively heats the braze powder along the predetermined path such that the braze powder is sintered and bonded to the surface. Thus, a braze deposit is formed at one or more predetermined locations on the surface. After forming the braze deposit, excess braze powder, that is, the braze powder not selectively heated by the laser, is removed from the surface.

According to the present invention, there is provided a copper/ceramic bonded body including: a copper member made of copper or a copper alloy; and a ceramic member made of silicon-containing ceramics, the copper member and the ceramic member being bonded to each other, in which a maximum indentation hardness in a region is set to be in a range of 70 mgf/μm.sup.2 or more and 150 mgf/μm.sup.2 or less, the region being from 10 μm to 50 μm with reference to a bonded interface between the copper member and the ceramic member toward the copper member side.

A method for making a bonded metal piece, including (a) obtaining a first piece of stock metal comprising a first surface and a second piece of the stock metal comprising a second surface; (b) smoothing the first surface so as to form a first contact surface and smoothing the second surface so as to form a second contact surface; (c) cleaning the first contact surface and the second contact surface; (d) loading the first piece and the second piece into a furnace; and (e) bonding the first piece to the second piece so as to form a bonded metal piece comprising the first contact surface diffusion bonded to the second contact surface. The bonding includes (i) heating the first piece and the second piece to a temperature below a superplastic forming temperature of the stock metal; and (ii) applying a pressure comprising pressing the first contact surface and the second contact surface together while the first piece and the second piece are at the temperature. In one or more examples, the bonded metal piece is machined (without forging or working into shape) into an aircraft part.

This patent application relates to methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices with heat applied from a bond head of a thermocompression bonding tool. The stack is substantially enclosed within a skirt carried by the bond head to reduce heat loss and contaminants from the stack, and heat may be added from the skirt.

Hydrogen purification devices and their components are disclosed. In some embodiments, the devices may include at least one foil-microscreen assembly disposed between and secured to first and second end frames. The at least one foil-microscreen assembly may include at least one hydrogen-selective membrane and at least one microscreen structure including a non-porous planar sheet having a plurality of apertures forming a plurality of fluid passages. The planar sheet may include generally opposed planar surfaces configured to provide support to the permeate side. The plurality of fluid passages may extend between the opposed surfaces. The at least one hydrogen-selective membrane may be metallurgically bonded to the at least one microscreen structure. In some embodiments, the devices may include a permeate frame having at least one membrane support structure that spans at least a substantial portion of an open region and that is configured to support at least one foil-microscreen assembly.

A method for joining an aluminum material includes, in the following order, arranging a first wrought aluminum alloy material along a first jig in an internal space defined between the first jig and a second jig that is arranged to face the first jig and has a pouring port, pouring molten aluminum toward the first wrought aluminum alloy material through the pouring port under pressure to cause the molten aluminum to collide with a surface of the first wrought aluminum alloy material, thereby digging down the first wrought aluminum alloy material at a collision position between the molten aluminum and the first wrought aluminum alloy material, and flowing the molten aluminum together with a fraction of the first wrought aluminum alloy material removed by digging within the internal space along a surface of the first wrought aluminum alloy material around the collision position.

A method of diffusion bonding utilizing vapor deposition comprises depositing a coating from a vapor comprising a temperature suppressant element onto a surface of a first component comprising a metal alloy, thereby forming a vapor deposited coating comprising the temperature suppressant element; assembling the first component with a second component comprising a mating surface to form an assembly, the vapor deposited coating contacting the mating surface; and exposing the assembly to a bonding temperature and a compressive force, thereby diffusion bonding the first component to the second component and forming a monolithic third component.