Embodiments disclosed herein include lithographic patterning systems for non-orthogonal patterning and devices formed with such patterning. In an embodiment, a lithographic patterning system comprises an actinic radiation source, where the actinic radiation source is configured to propagate light along an optical axis. In an embodiment, the lithographic patterning system further comprises a mask mount, where the mask mount is configurable to orient a surface of a mask at a first angle with respect to the optical axis. In an embodiment, the lithographic patterning system further comprises a lens module, and a substrate mount, where the substrate mount is configurable to orient a surface of a substrate at a second angle with respect to the optical axis.

Provided is an inexpensive microneedle array with little dimensional error that can control, with high precision, the amount of a predetermined component to be introduced to the inner part of the skin, and a production method for this microneedle array. A foundation that is insoluble or sparingly soluble in inner part of the skin is overlaid on a mold. A plurality of frustum-shaped protrusions, which are insoluble or sparingly soluble in the raw material liquid, provided on a first main surface of the foundation are fit into a plurality of cone-shaped recesses. The raw material liquid in the plurality of cone-shaped recesses dries and, as a result, a plurality of microneedles, which are dissolvable in the inner part of the skin, are fixed to tip surfaces of the plurality of frustum-shaped protrusions.

A method of operating a mechanical switching device is disclosed. The switching device includes a housing, an assembly disposed in the housing, and a body. The assembly is thermally deformable and comprises a beam held in two different places by two arms secured to edges of the housing. The beam is remote from the body in a first configuration and in contact with and immobilized by the body in a second configuration. The assembly has the first configuration at a first temperature and the second configuration when one of the arms has a second temperature different from the first temperature. The method includes exposing an arm of the assembly to the second temperature, and releasing the beam using a release mechanism. The release mechanism includes a pointed element comprising a pointed region directed towards the body. The pointed element limits an open crater in a concave part of a projection.

Disclosed herein are novel 3D microelectrode arrays (3D MEA) that include a substrate body (e.g. chip), microneedles, traces, and a well, wherein the 3D MEA provides for transfer of electrical signals on one side of the substrate body to the other side of the substrate body. Methods for using 3D MEAs to grow electrogenic cells and obtain electrophysiological signals are disclosed as well. Fabrication techniques for producing the 3D MEAs are also disclosed.

A method for manufacturing a MEMS structure is provided. The method includes providing a MEMS substrate having a first surface, forming a first buffer layer on the first surface of the MEMS substrate, and forming a first roughening layer on the first buffer layer. Also, a MEMS structure is provided. The MEMS structure includes a MEMS substrate, a first buffer layer, a first roughening layer, and a CMOS substrate. The MEMS substrate has a first surface and a pillar is on the first surface. The first buffer layer is on the first surface. The first roughening layer is on the first buffer layer. The CMOS substrate has a second surface and is bonded to the MEMS substrate via the pillar. Moreover, an air gap is between the first roughening layer and the second surface of the CMOS substrate.

The present disclosure discloses a silicon nanowire chip and silicon nanowire chip-based mass spectrometry detection method. The detection method includes the following steps: step 1 of manufacturing a silicon nanowire chip, comprising: subjecting a monocrystalline silicon wafer to a surface washing pretreatment, a metal-assisted etching and a post-alkali etching to obtain a silicon nanowire chip with a tip, and performing a surface chemical modification or a nanomaterial modification on the silicon nanowire chip; step 2 of evaluating mass spectrometry performance of the silicon nanowire chip; and step 3 of performing a tip-contact sampling and in-situ ionization mass spectrometry detection.

A method for fabricating a fluidic device includes depositing a sacrificial material on a pillar array arranged on a substrate. The method also includes removing a portion of the sacrificial material. The method further includes depositing a sealing layer on the pillar array to form a sealed fluidic cavity.

A method for detecting orientation of an integrated circuit is disclosed. The method includes moving, in response to a gravitational force, a mobile metallic piece in an evolution zone of a housing. The housing is formed in an interconnect region of the integrated circuit. The housing includes walls defining the evolution zone. The walls are formed within multiple metallization levels of the interconnect region. The walls include a floor wall and a ceiling wall. At least one of the floor wall and ceiling wall incorporate a pointed element directing its pointed region towards the mobile metallic piece. The pointed element delimits an open crater in a concave part of a projection. The method further includes creating an electrical signal by movement of the mobile metallic piece at a plurality of electrically conducting elements positioned at boundary points of the evolution zone and detecting the electrical signal by a detector.

A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.

Provided is a method for growing a nanowire, including: providing a substrate with a base portion having a first surface and at least one support structure extending above or below the first surface; forming a dielectric coating on the at least one support structure; forming a photoresist coating over the substrate; forming a metal coating over at least a portion of the dielectric coating; removing a portion of the dielectric coating to expose a surface of the at least one support structure; removing a portion of the at least one support structure to form a nanowire growth surface; growing at least one nanowire on the nanowire growth surface of a corresponding one of the at least one support structure, wherein the nanowire comprises a root end attached to the growth surface and an opposing, free end extending from the root end; and elastically bending the at least one nanowire.