The invention generally relates to polymer nanocomposite films that possess shape memory properties at elevated temperatures. Such films can absorb microwaves, are thermally conductive, are electrically conductive and have increased mechanical strength. In addition, the present invention relates to methods of fabricating such films into 3D objects. Due to the improved properties of such films more advanced sensors and microwave shields can be constructed.

Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.

A resin film according to one aspect of the present invention contains polyimide, and satisfies the condition “the electric charge change in film after irradiation with a light having a wavelength of 470 nm and an intensity of 4.0 μW/cm.sup.2 for 30 minutes relative to before irradiation with the light is 1.0×10.sup.16 cm.sup.−3 or less.” Such a resin film can be used as a substrate for a semiconductor element to form an electronic device including the resin film, and a semiconductor element formed on the resin film.

Phthalonitrile adhesive formulations are provided. Such an adhesive formulation may comprise an etherimide-phthalonitrile oligomer having formula

##STR00001## wherein R.sub.1 is an unsubstituted or substituted aryl group or an unsubstituted or substituted cycloalkyl group; R.sub.2 is an unsubstituted or substituted aryl group and n has a value of from 1 to 30. Also provided are methods of making and using the adhesive formulations.

Polymer resins for the vat photopolymerization of thermoplastics are provided, in particular for the vat photopolymerization of thermoplastics with exception thermal stability and mechanical properties. In some aspects, the polymer resins are prepared by ring opening of an aromatic dianhydride with an alcohol containing an acrylate or methacrylate to produce a photocrosslinkable diacid monomer; conversion of the photocrosslinkable diacid monomer to a photocrosslinkable diacyl chloride; and polymerization of the photocrosslinkable diacyl chloride with an aromatic diamine to produce a photocrosslinkable precursor polymer. Upon crosslinking and drying, a thermal imidization can yield aromatic polyimide polymers with high yield and with micron-scale structural resolution.

A hybrid thermoplastic-thermosettable resin composition may include a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic. A method of forming a hybrid thermoplastic-thermosettable resin composition may include reacting a thermoplastic to introduce a cross-linkable group to form the thermoplastic-thermosettable resin composition. A method of forming a hybrid thermoplastic-thermoset resin may include providing a hybrid thermoplastic-thermosettable resin composition comprising a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic; and curing the hybrid thermoplastic-thermosettable resin composition by an external stimulus to form the hybrid thermoplastic-thermoset resin.

A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): ##STR00001##
wherein δ represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R.sup.11 and R.sup.12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (—CONH—).

The present invention relates to a modified polyimide including a terminal group represented by Formula 1:

##STR00001## wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater. The modified polyimide undergoes less reduction in transmittance and is protected from discoloration when cured. Due to these advantages, the modified polyimide can provide a highly transparent colorless polyimide film. Particularly, the modified polyimide is suitable for use in display substrates, interlayer insulating films of semiconductor devices, passivation films, buffer coat films, insulating films for multilayer printed circuit boards, insulating films of OLEDs, and protective films of thin film transistors of liquid crystal display devices. The present invention also relates to a curable composition including the modified polyimide.

A photoalignment agent includes a polyimide and a capping terminal connected to a main chain end terminal of the polyimide. The capping terminal includes an alkylene group (—C.sub.mH.sub.2m—, m is a natural number) and a core stereo unit in a dendrimer format. A liquid crystal display includes a first substrate, a thin film transistor disposed on the first substrate, a first electrode connected to the thin film transistor, and a first alignment layer disposed on the first electrode. The first alignment layer includes a polyimide and a capping terminal connected to a main chain end terminal of the polyimide. The capping terminal includes an alkylene group (—CmH2m-, m is a natural number) and a core stereo unit in a dendrimer format.