C08G73/101

Method for fabricating multiphenylethynyl-containing and lightly crosslinked polyimides capable of memorizing shapes and augmenting thermomechanical stability

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

DINADIC PHENYL AMINE REACTIVE ENDCAPS
20180009949 · 2018-01-11 ·

Dinadic phenyl amine reactive endcap monomers for application in high-temperature polymeric composites are described. The amine group of the endcap is directly reacted with a desired chemical backbone to provide the preferred rigidity and chemical resistance. The ability of the amine group to react with a wide variety of chemical backbones allows the tailoring of formulations for various application temperatures, mechanical properties, processes and resistances while retaining the high degree of crosslinking that yields excellent temperature stability, ease of processing and the necessary toughness. Polyimide oligomers comprising the reaction product of at least one dinadic phenyl amine endcap monomer and a chemical backbone, preferably with a molecular weight not exceeding about 1000-3000, suitable for high temperature composites are described. The dinadic phenyl amine endcaps may be reacted with an acid anhydride capped precursor to form polyimide resins suitable for high-temperature composites.

COMPOSITIONS AND METHODS OF ADDITIVE MANUFACTURING OF AROMATIC THERMOPLASTICS AND ARTICLES MADE THEREFROM

Polymer resins for the vat photopolymerization of thermoplastics are provided, in particular for the vat photopolymerization of thermoplastics with exception thermal stability and mechanical properties. In some aspects, the polymer resins are prepared by ring opening of an aromatic dianhydride with an alcohol containing an acrylate or methacrylate to produce a photocrosslinkable diacid monomer; conversion of the photocrosslinkable diacid monomer to a photocrosslinkable diacyl chloride; and polymerization of the photocrosslinkable diacyl chloride with an aromatic diamine to produce a photocrosslinkable precursor polymer. Upon crosslinking and drying, a thermal imidization can yield aromatic polyimide polymers with high yield and with micron-scale structural resolution.

Electrochromic polyamic acid material, preparation method thereof, and display device

The present invention provides an electrochromic polyamic acid material, a preparation method thereof and a display device, wherein the molecular structure of the electrochromic polyamic acid material includes oligoaniline and carbazolyl triphenylamine. The oligoaniline serves as an electrochemically sensitive group, and the carbazolyl triphenylamine serves as a fluorescence emitting group. The electrochromic polyamic acid material is an electrically controlled fluorescent polymer. Fluorescence intensity of the electrochromic polyamic acid material undergoes reversible fluorescence conversion with a change of an applied voltage, due to a redox reaction of the oligoaniline at different voltages, resulting in an interchange between a benzene ring and an anthracene ring in a molecular structure, and an electron/energy transfer path with the fluorescence emitting group are generated or eliminated, thereby realizing the electrically controlled fluorescent properties of the electrochromic polyamic acid material.

Reactive end group containing polyimides and polyamic acids and photosensitive compositions thereof

Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Multiphenylethynyl-Containing and Lightly Crosslinked Polyimides Capable of Memorizing Shapes and Augmenting Thermomechanical Stability
20220388222 · 2022-12-08 ·

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

Hybrid Crosslinked Polymer Membrane And Process For Fabricating The Same

A hybrid crosslinked polymeric membrane and a process for fabricating the same are provided. Specifically, the hybrid crosslinked polymer membrane comprises a glassy polymer and a ladder-structured polysilsesquioxane and has a crosslinked structure. The hybrid crosslinked polymer membrane can have an excellent permeability of carbon dioxide by virtue of an increase in the free volume and enhanced plasticization resistance, chemical resistance, and durability.

Method for fabricating lightly crosslinked polyimides with phenylethynyl pendants for shape-memory effect and programmed enhancement in Tg and modulus

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

HYDROPHOBIC POLYIMIDE AEROGELS

Aerogels comprising a hydrophobic polyimide moiety, including hydrophobic polyimide aerogels, as well as methods of manufacture and applications thereof, are generally described.

##STR00001##

Polyetherimide from metal free ionomers

A polyimide oligomer of formula (1a), (1b), a copolymer thereof, or a combination thereof ##STR00001##
wherein each G.sup.1 is independently the same or different, and is a cation group; each G.sup.2 is independently the same or different, and is an anion group; each D is independently the same or different, and is a single bond or C.sub.1-20 divalent hydrocarbon group; each V is independently the same or different, and is a tetravalent C.sub.4-40 hydrocarbon group; each R is independently the same or different, and is a C.sub.1-20 divalent hydrocarbon group; each n is independently the same or different, and is 1 to 1000, provided that the total of all values of n is greater than 4; and t is 2 to 1000.