C23C14/352

PVD APPARATUS

The PVD apparatus includes a chamber, a plurality of stages, a first target holder, a power supply mechanism, and a shield. The plurality of stages are provided inside the chamber, and each of the plurality of stages is configured to place at least one substrate on an upper surface thereof. The first target holder is configured to hold at least one target provided for one stage, the target being exposed to a space inside the chamber. The power supply mechanism supplies power to the target via the first target holder. The shield is provided inside the chamber and a part of the shield is disposed between a first stage and a second stage in the plurality of stages, and between a first processing space on the first stage and a second processing space on the second stage.

Cathode unit and film forming apparatus

A cathode unit for performing a sputtering film formation includes: a target that emits sputtering particles; a target cooler that includes a cooling plate to which the target is bonded; and a power supply that supplies a power to the target. The target has a high-temperature region that has a higher temperature than other regions of the target during a film formation. The cooling plate includes a coolant flow space through which a coolant flows, and a first wall and a second wall that define the coolant flow space in a thickness direction. In the coolant flow space, a flow path of the coolant is formed by a first partition plate and a second partition plate. The first partition plate does not exist at a portion of the coolant flow space that corresponds to the high-temperature region.

Coating on mold for glass molding and a preparation method and applications thereof

Disclosed is a coating made of an organic material on a mold for glass molding. The coating comprises Cr.sub.xW.sub.yN.sub.(1-x-y), where 0.15<x<0.4, and 0.2≤y≤0.45. The coating has excellent high temperature resistance and anti-adhesion properties, thus being a promising coating material for molds.

Sputtering Target
20230044831 · 2023-02-09 · ·

A multiple sputtering target for magnetron arrangements has a tubular magnetron, for coating substrates in a vacuum chamber. The tubular magnetron is mounted in an end block or some other drive unit. A magnet bar is located in the tubular magnetron. Substrates transported along a circular path through a vacuum chamber can be coated with a selectable multiplicity of materials by magnetron sputtering. At least one polygonal carrier tube having an angular cross section has a plurality of longitudinally extending outer surfaces for receiving targets. A free extends longitudinally through the polygonal carrier tube. A magnet bar for forming plasma clouds outside the polygonal carrier tube is located in a working position in front of a target which can be selected by rotating the polygonal carrier tube. The moving or stationary substrate is located at a predetermined distance in front of the plasma clouds.

System and method to control PVD deposition uniformity
11557473 · 2023-01-17 · ·

A physical vapor deposition chamber comprising a tilting substrate support is described. Methods of processing a substrate are also provided comprising tilting at least one of the substrate and the target to improve the uniformity of the layer on the substrate from the center of the substrate to the edge of the substrate. Process controllers are also described which comprise one or more process configurations causing the physical deposition chamber to perform the operations of rotating a substrate support within the physical deposition chamber and tilting the substrate support at a plurality of angles with respect to a horizontal axis.

MAGNETRON PLASMA APPARATUS
20180012738 · 2018-01-11 ·

A magnetron plasma apparatus boosted by hollow cathode plasma includes at least one electrically connected pair of a first hollow cathode plate and a second hollow cathode plate placed opposite to each other at a separation distance of at least 0.1 mm and having an opening following an outer edge of a sputter erosion zone on a magnetron target so that a magnetron magnetic field forms a perpendicular magnetic component inside a hollow cathode slit between plates and, wherein the plates and are connected to a first electric power generator together with the magnetron target to generate a magnetically enhanced hollow cathode plasma in at least one of a first working gas distributed in the hollow cathode slit and a second working gas admitted outside the slit in contact with a magnetron plasma generated in at least one of the first working gas and the second working gas.

COATINGS OF NON-PLANAR SUBSTRATES AND METHODS FOR THE PRODUCTION THEREOF

A coated article may comprise a substrate and an optical coating. The substrate may have a major surface comprising a first portion and a second portion. A first direction that is normal to the first portion of the major surface may not be equal to a second direction that is normal to the second portion of the major surface. The optical coating may be disposed on at least the first portion and the second portion of the major surface. The coated article may exhibit at the first portion of the substrate and at the second portion of the substrate hardness of about 8 GPa or greater at an indentation depth of about 50 nm or greater as measured on the anti-reflective surface by a Berkovich Indenter Hardness Test.

METHOD OF SPUTTER-COATING SUBSTRATES OR OF MANUFACTURING SPUTTER COATED SUBSTRATES AND APPARATUS

Whenever substrates are rotationally and continuously conveyed in a vacuum recipient around a common axis and past a magnetron sputter source, sputtering of the target, rotating around a central target axis, by the stationary magnetron plasma is adapted to the azimuthal extents radially differently spaced areas of the substrates become exposed to the target thereby improving homogeneity of deposited layer thickness on the substrates and ensuring that the complete sputter surface of the target is net-sputtered.

CUV2O6-BASED PHOTOELECTRIC SENSOR AND APPLICATION THEREOF IN DETECTION OF ARGININE

A CuV.sub.2O.sub.6-based photoelectric sensor is prepared through the following steps: acquiring a CuV.sub.2O.sub.6 thin film through a direct-current reactive magnetron co-sputtering method; and loading an 8-hydroxyquinoline solution on the CuV.sub.2O.sub.6 thin film through a spin-coating method to acquire an 8-hydroxyquinoline-modified CuV.sub.2O.sub.6 photoelectric sensor. The 8-hydroxyquinoline-modified CuV.sub.2O.sub.6 photoelectric sensor has a good anti-interference capability in the detection of arginine; it is easy to realize the low-cost mass production of CuV.sub.2O.sub.6 photoelectrodes through a developed direct-current reactive magnetron sputtering coating method; and a sensor device is low in cost, simple, portable, and easy to use, and has an application value in food safety and health and hygiene detection.

COATED CUTTING TOOL
20230028083 · 2023-01-26 ·

A coated cutting tool includes a substrate with a coating including a (Ti,Al)N layer having an overall composition (Ti.sub.xAl.sub.1-x)N, 0.34≤x≤0.65. The (Ti,Al)N layer contains columnar (Ti,Al)N grains with an average grain size of from 10 to 100 nm. The (Ti,Al)N layer also includes lattice planes of a cubic crystal structure. The (Ti,Al)N layer shows a pattern in electron diffraction analysis, wherein there is a diffraction signal existing, which is shown as a peak (P) in an averaged radial intensity distribution profile having its maximum within a scattering vector range of from 3.2 to 4.0 nm.sup.−1, the full width half maximum (FWHM) of the peak (P) being from 0.8 to 2.0 nm.sup.−1.