A method for making LNO film, including the steps of identifying a substrate, identifying a deposition target, placing the substrate and deposition target in a deposition environment, evolving target material into the deposition environment, and depositing evolved target material onto the substrate to yield an LNO film. The deposition environment defines a temperature of between 500 degrees Celsius and 750 degrees Celsius and a pressure of about 10.sup.−6 Torr. A seed or buffer layer may be first deposited onto the substrate, wherein the seed layer is about 30 mole percent gold and about 70 LiNbO.sub.3.

A method for making LNO film, including the steps of identifying a substrate, identifying a deposition target, placing the substrate and deposition target in a deposition environment, evolving target material into the deposition environment, and depositing evolved target material onto the substrate to yield an LNO film. The deposition environment defines a temperature of between 500 degrees Celsius and 750 degrees Celsius and a pressure of about 10.sup.−6 Torr. A seed or buffer layer may be first deposited onto the substrate, wherein the seed layer is about 30 mole percent gold and about 70 LiNbO.sub.3.

A method of manufacturing an integrated circuit. This method includes forming an epitaxial material comprising single crystal piezo material overlying a surface region of a substrate to a desired thickness and forming a trench region to form an exposed portion of the surface region through a pattern provided in the epitaxial material. Also, the method includes forming a topside landing pad metal and a first electrode member overlying a portion of the epitaxial material and a second electrode member overlying the topside landing pad metal. Furthermore, the method can include processing the backside of the substrate to form a backside trench region exposing a backside of the epitaxial material and the landing pad metal and forming a backside resonator metal material overlying the backside of the epitaxial material to couple to the second electrode member overlying the topside landing pad metal.

A cobalt-free single crystal composite material, and a preparation method therefor and a use thereof. The cobalt-free single crystal material is of a core-shell structure, the core layer is the cobalt-free single crystal material, and the shell layer is prepared from TiNb.sub.2O.sub.7 and conductive lithium salt. The TiNb.sub.2O.sub.7 and the conductive lithium salt are selected as materials of the shell layer to coat the cobalt-free single crystal material, thereby improving the lithium ion conductivity of the cobalt-free single crystal material, and further improving the capacity and the first effect of the material.

A relaxor-PT based piezoelectric crystal is disclosed, comprising the general formula of (Pb.sub.1-1.5xM.sub.x){[(M.sub.I,M.sub.II).sub.1-z(M.sub.I′,M.sub.II′).sub.z].sub.1-yTi.sub.y}O.sub.3, wherein: M is a rare earth cation; M.sub.I is selected from the group consisting of Mg.sup.2+, Zn.sup.2+, Yb.sup.3+, Sc.sup.3+, and In.sup.3+; M.sub.II is Nb.sup.5+; M.sub.I′ is selected from the group consisting of Mg.sup.2+, Zn.sup.2+, Yb.sup.3+, Sc.sup.3+, In.sup.3+, and Zr.sup.4; M.sub.II′ is Nb.sup.5+ or Zr.sup.4+; 0<x≤0.05; 0.02<y<0.7; and 0≤z≤1, provided that if either M.sub.I′ or M.sub.II′ is Zr.sup.4+, both M.sub.I′ and M.sub.II′ are Zr.sup.4+. A method for forming the relaxor-PT based piezoelectric crystal is disclosed, comprising pre-synthesizing precursor materials by calcining mixed oxides, mixing the precursor materials with single oxides and calcining to form a feeding material, and growing the relaxor-PT based piezoelectric crystal having the general formula of (Pb.sub.1-1.5xM.sub.x){[(M.sub.I,M.sub.II).sub.1-z(M.sub.I′,M.sub.II′).sub.z].sub.1-yTi.sub.y}O.sub.3 from the feeding material by a Bridgman method.

A relaxor-PT based piezoelectric crystal is disclosed, comprising the general formula of (Pb.sub.1-1.5xM.sub.x){[(M.sub.I,M.sub.II).sub.1-z(M.sub.I′,M.sub.II′).sub.z].sub.1-yTi.sub.y}O.sub.3, wherein: M is a rare earth cation; M.sub.I is selected from the group consisting of Mg.sup.2+, Zn.sup.2+, Yb.sup.3+, Sc.sup.3+, and In.sup.3+; M.sub.II is Nb.sup.5+; M.sub.I′ is selected from the group consisting of Mg.sup.2+, Zn.sup.2+, Yb.sup.3+, Sc.sup.3+, In.sup.3+, and Zr.sup.4; M.sub.II′ is Nb.sup.5+ or Zr.sup.4+; 0<x≤0.05; 0.02<y<0.7; and 0≤z≤1, provided that if either M.sub.I′ or M.sub.II′ is Zr.sup.4+, both M.sub.I′ and M.sub.II′ are Zr.sup.4+. A method for forming the relaxor-PT based piezoelectric crystal is disclosed, comprising pre-synthesizing precursor materials by calcining mixed oxides, mixing the precursor materials with single oxides and calcining to form a feeding material, and growing the relaxor-PT based piezoelectric crystal having the general formula of (Pb.sub.1-1.5xM.sub.x){[(M.sub.I,M.sub.II).sub.1-z(M.sub.I′,M.sub.II′).sub.z].sub.1-yTi.sub.y}O.sub.3 from the feeding material by a Bridgman method.

A substrate for a surface acoustic wave device is constituted of a piezoelectric material and includes a first surface on which a surface acoustic wave propagates, and a second surface located opposite to the first surface. The second surface has an arithmetic mean roughness (Ra) of 0.2 μm to 0.4 μm, and there is satisfied either of the relationship between the arithmetic mean roughness (Ra) and mean spacing (S) of local peaks of Ra/S≥11, and the relationship between the arithmetic mean roughness (Ra) and mean spacing (Sm) of irregularities of Ra/Sm≥6.7. Further, the second surface has a maximum height (Rmax) of 2.5 μm to 4.5 μm, and there is satisfied either of the relationship between the maximum height (Rmax) and mean spacing (S) of local peaks of Rmax/S≥130, and the relationship between the maximum height (Rmax) and mean spacing (Sm) of irregularities of Rmax/Sm≥80.

A substrate for a surface acoustic wave device is constituted of a piezoelectric material and includes a first surface on which a surface acoustic wave propagates, and a second surface located opposite to the first surface. The second surface has an arithmetic mean roughness (Ra) of 0.2 μm to 0.4 μm, and there is satisfied either of the relationship between the arithmetic mean roughness (Ra) and mean spacing (S) of local peaks of Ra/S≥11, and the relationship between the arithmetic mean roughness (Ra) and mean spacing (Sm) of irregularities of Ra/Sm≥6.7. Further, the second surface has a maximum height (Rmax) of 2.5 μm to 4.5 μm, and there is satisfied either of the relationship between the maximum height (Rmax) and mean spacing (S) of local peaks of Rmax/S≥130, and the relationship between the maximum height (Rmax) and mean spacing (Sm) of irregularities of Rmax/Sm≥80.

A method for manufacturing a monocrystalline piezoelectric material layer includes providing a donor substrate made of the piezoelectric material, providing a receiving substrate, transferring a so-called “seed layer” of the donor substrate onto the receiving substrate, and using epitaxy of the piezoelectric material on the seed layer until the desired thickness for the monocrystalline piezoelectric layer is obtained.

A composite substrate (100) for a photonic crystal element includes: an electro-optical crystal substrate (10) having an electro-optical effect; an optical loss-suppressing and cavity-processing layer (20) arranged on one surface of the electro-optical crystal substrate (10); and a support substrate (30) integrated with the electro-optical crystal substrate (10) through the optical loss-suppressing and cavity-processing layer (20).