A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

A contact socket module for use in an automated test equipment (ATE) for testing electronic components (DUTs) being carried by a carrier comprises: a plurality of groups of spring contacts, wherein each spring contact comprises a DUT sided contact tip, a retracting plate being moveable, and a controller controlling the movement of the retracting plate, wherein the retracting plate and the spring contacts act mechanically on each other. In a first position the DUT sided contact tips are adapted to contact to contact portions of the electronic components, and in a second position, the DUT sided contact tips are adapted to release the contact to the contact portions of the electronic components.

The present disclosure discloses an assembly for carrying a chip, and a device and a method for testing a chip. The assembly for carrying a chip is configured to fasten chips of different sizes, and includes a rotatable vertical rod, a cross beam, a first sidewall, and a second sidewall. The rotatable vertical rod is provided with a gear that surrounds the rotatable vertical rod with gear teeth. The cross beam is internally provided with a first through hole and a first chute. A top of the first sidewall is connected to a first connecting rod located in the first chute. A top of the second sidewall is connected to a second connecting rod located in the first chute. A side surface of the first connecting rod is provided with a plurality of first tooth grooves arranged linearly.

The present invention is related to a clipped testing device, comprising a first clamping member, a second clamping member, a shaft, and a conducting member. The first clamping member has a first pin joint member and a first substrate, the second clamping member has a second pin joint member and a second substrate. The shaft detachably pivoted to a first pin joint member and a second pin joint member. The conducting member is disposed on the first clamping member and is located between the first substrate and the second substrate. The conducting member has an upper surface and a lower surface. The lower surface of the conducting member faces toward the first substrate, and at least a part of the conducting member is wavy-shaped and has a first scraping structure on the upper surface thereof.

Provided is a semiconductor chip test socket configured to be coupled to a test circuit board for testing a semiconductor chip and provided with an integrated circuit (IC) chip having unique information and an algorithm for counting the number of times the semiconductor chip test socket is used, such that the number of times the semiconductor chip test socket is used may be exactly counted, and the IC chip may be easily installed and removed and securely protected from external impacts.

A semiconductor package testing apparatus comprises a package holder for holding a semiconductor package and which is positionable together with the semiconductor package at a test contactor station. There are probe pins located at the test contactor station for contacting a bottom surface of the semiconductor package and which are configured to apply an upwards force on the semiconductor package during testing of the semiconductor package. A restraining mechanism that is movable from a first position remote from the package holder and a second position over the package holder is configured to restrict lifting of the semiconductor package by the probe pins during testing of the semiconductor package when the restraining mechanism is at its second position.

A reconfigurable load board clamp is disclosed. The reconfigurable load board clamp includes first and second slotted ends; first and second opposing sides laterally coupled to the first and second slotted ends; and a MCPCB pin board removably coupled to the first and second slotted ends. The pin board includes a card edge connector plugged into an end of the pin board and multiple spring-loaded pin connectors. In implementations, multiple pin boards may be removed and added to the reconfigurable load board clamp to form a pin array suitable for a particular load board.

A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

In some embodiments, apparatuses and methods are provided herein useful for testing a touchscreen electronic device. In some embodiments, an attachment for an end effector for use with testing a touchscreen electronic device comprises a body, wherein the body includes a connection portion configured to secure the attachment to the end effector, a first end, an opening, wherein the opening is located adjacent to the first end, and a conductive contact member, wherein the conductive contact member is wrapped about the first end, and wherein the conductive contact member is configured to contact the touchscreen during testing and simulate a touch of a human finger.