A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

The present disclosure provides a probe cable assembly comprising a probe interface configured to couple to a measurement interface and to receive a differential signal, a measurement output interface configured to output the differential signal, and a cable arrangement electrically arranged between the probe interface and the measurement output interface and configured to conduct the differential signal between the probe interface and the measurement output interface, the cable arrangement comprising a cable, a plurality of magnetic elements arranged around at least a section of the length of the cable, wherein each magnetic element is separated by a gap from adjacent magnetic elements, and a plastically deformable guiding element configured to fix the cable arrangement with a predetermined relative position between the probe interface and the measurement output interface.

A contact probe for electronic tests includes an upper part having an end portion for contacting a first electronic component; a lower part having an end for contacting a second electronic component; and an elongated and deformable central body interposed between the upper and lower parts. The lower part has an enlarged head with a lower surface intended to rest at least partially onto a horizontal surface, the lower surface having an inclination angle from the horizontal surface onto which it rests when the probe is unbuckled and, when the probe is buckled, it can assume a position in which the lower surface moves to rest entirely onto the horizontal surface, thereby eliminating the inclination angle.

The cylindrical member includes a cylindrical base material 40 made of beryllium copper, a first coating layer that is formed on the base material 40 and made of a Ni-based material and serves as a reinforcing material for the base material 40, and a second coating layer 42 that is formed on the first coating layers and made of a metal-based material different from the base material 40, wherein the first coating layer 41 has higher hardness than the base material 40, when the thickness of the base material 40 is represented by T.sub.B and the layer thickness of the first coating layer 41 formed on the outer surface is represented by T1.sub.OUT, the base material 40 is formed so as to satisfy 13 μm≤T.sub.B≤25 μm, and the first coating layer 41 is formed so as to satisfy T1.sub.OUT≥T.sub.B×4%.

Proposed is a wafer inspection apparatus and a wafer inspection method, which can increase inspection accuracy while reducing the amount of dry air used. The wafer inspection apparatus includes a chamber providing a space for an electrical test of a wafer, a support unit positioned inside the chamber to support the wafer, a temperature control unit for controlling a test temperature of the wafer, a dry air supply unit for supplying dry air to the chamber, and a flow control unit for controlling the dry air supply unit to adjust flow rate of the dry air based on the test temperature. The wafer inspection apparatus and the wafer inspection method of the present disclosure may increase the accuracy of the wafer inspection while preventing the drying air from being wasted by variably adjusting the flow rate of dry air supplied based on the test temperature of the wafer.

A probe adapter includes an adapter body including a probe aperture and a slot. The probe adapter further includes a driver slidably mounted within the slot and slidable between a first position and a second position. The driver includes a first end and a second end opposite the first end. The first end includes a ramped recess extending in a direction from the first end toward the second end. The probe adapter further includes a threaded fastener configured to contact the second end of the driver so as to retain the driver in the first position.

Disclosed herein are apparatuses and methods for mitigating sticking of units-under-test (UUTs). For example, in some embodiments, a probe card may include a probe landing pad, a guide plate having a hole therein, and a pushing mechanism. The pushing mechanism may include a pusher needle and a pusher needle support, the pusher needle support may be between the probe landing pad and the guide plate, and the pusher needle support may be controllable to cause the pusher needle to extend and retract through the hole in the guide plate.

To guarantee positioning of an elastic pin during manufacturing without using a guide member, and to prevent contamination from a guide member in a final product. An electronic device inspection socket having a plurality of elastic pins each having the center portion embedded in, and having respective ends projecting from, an insulator which changes, through solidification, from a fluid state to a solid but deformable state, wherein the leading ends of the elastic pins are portions received by a plurality of recesses provided to a device for manufacturing the electronic device inspection socket, and the insulator is a portion formed after being injected in a fluid state between said respective ends in a state where said respective ends are received in the recesses and being solidified.

Disclosed is a test device for testing a high-frequency and high-speed semiconductor. The test device includes a probe supporting block formed with a tube accommodating portion along a test direction; a conductive shield tube accommodated in the tube accommodating portion; and a probe accommodated and supported in the shield tube without contact, the tube accommodating portion including a conductive contact portion for transmitting a ground signal to the shield tube. When a high-frequency and high-speed semiconductor or the like subject is tested, the test device easily and inexpensively prevents crosstalk between the adjacent signal probes and improves impedance characteristic.

The probe assembly operates with a circuit board test apparatus and includes a main test probe and a secondary test probes. The probe assembly is capable of moving in X, Y and Z directions relative to a circuit board being tested (UUT). The two test probes are movable linearly relative to each other and rotatable together so as to accurately locate the two probes on selected pins on the UUT, for receiving signals from the selected pins. The received signals are transmitted to a display apparatus.