A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT.

According to the present invention, a semiconductor inspection device includes a control section that outputs a signal to inspect a semiconductor wafer, a contact section comprising contact terminals connected to the control section, a probe card that can simultaneously contact a plurality of semiconductor chips formed on the semiconductor wafer and a drive section, wherein the contact terminals can contact some of electrode pads provided for the probe card and the drive section drives the contact section so as to switch electrode pads in contact with the contact terminals.

A fluid pressure actuated device for establishing electrical contact includes a first side and a second side each defining a respective cavity. A respective flexible membrane is positioned across each cavity. Each membrane has an outer side that carries an electrically conducting contactor. The contactors are electrically connected to a conducting connector that extends at least partially through the device. Each flexible membrane extends and withdraws moving the associated electrically conducting contactor in opposing directions when fluid pressure is increased and decreased in the associated cavity. Each membrane may have an undulating shape by including concentric frustum portions that narrow in opposite directions. The contacts may have neutral positions that are internal relative to outer surfaces of the device until fluid pressure is increased in the respective cavities causing extension by movement of the membranes.

A contact terminal has a support section that holds an elastically deformable axle so as to rotate about the axle with an elastic deformation of the axle, and a contact section extending from the support section. The contact section has, at a distal end thereof, a contact portion configured to make a contact with a testing element. The contact section deforms elastically while rotating with the support section by the contact of the contact portion with the testing element.

An object of the present disclosure is to make it possible to improve electrical inspection of an object to be inspected by making the conduction characteristics of the electrical signal flowing through an electrical contactor better. An electrical contactor according to the present disclosure includes: a pedestal portion having, at a lower end thereof, a contact portion that comes into contact with a first contact target of an object to be inspected; a base end portion extending continuously toward an installing portion that comes into contact with a second contact target of a substrate electrically connected to an inspection device side; and at least three or more arm portions provided between the base end portion and the pedestal portion, each of the at least three or more arm portions having one end supported by the base end portion and another end coupled to the pedestal portion to elastically support the contact portion.

A probe for a vertical probe card includes an unsupported base portion that extends from the vertical probe card, a cantilevered portion that extends substantially perpendicular to the unsupported base portion and a contact portion that includes a tip. The cantilevered portion has a first thickness at an end adjacent the unsupported base portion and a second thickness at an end adjacent the contact portion, the second thickness being less than the first thickness.

A probe for testing a semiconductor device includes a post having a plate shape and connected to a test substrate. A beam has a first end connected to the post. A tip structure is connected to a second end of the beam. The post includes a front surface having a normal line extending in a first direction. A back surface is located opposite to the front surface. Bumps are disposed on the front surface and are spaced apart from each other. The beam extends in a second direction intersecting the first direction. Each of the bumps protrudes from the front surface in the first direction by a first length.

An electrical Kelvin contact assembly for testing IC testing apparatus that uses an assembly design that reduces the tolerance to a near negligible range. The assembly does not use any screws, dowel pins, adhesives or welding to fasten the electrical contacts to the housing. The design of the assembly uses rows of contacts with specially designed protrusions that sit snugly in openings located on three plate-like layers. These layers contain the contacts in the horizontal plane by securing the protrusions in the opening, as well as in the vertical plane by means of a sandwich between three separate layers. A second contact is slid into back slits formed by the three layers.

A probe unit includes a probe pin and a support unit supporting the probe pin. The support unit includes first and second arms disposed at a distance along a direction in which the probe pin probes a probed object; a holding unit holding base ends of the arms; and a linking unit attached to the probe pin and linking front ends of the arms. The support unit constructs a four-bar linkage that permits linear or approximately linear movement of the probe pin in an opposite direction to the probing direction. The first and second arms have through-holes at positions slightly closer to the front ends than the base ends and positions slightly closer to the base ends than the front ends, center parts between the through-holes function as bars in the four-bar linkage, and formation positions of the through-holes function as joints in the four-bar linkage.

A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate.