Proposed is an outer cylindrical spring pin including a compression spring (30), and an integrated upper probe (10) integrally provided with an upper probe portion (11) for contacting the outside, and with two upper probe side wall portions (12) which extend from the upper probe portion (11) and which surround two side surfaces facing each other, among four side surfaces of the compression spring (30). The spring pin further includes an integrated lower probe (20) integrally provided with a lower probe portion (21) for contacting the outside, and with two lower probe side wall portions (22) which extend from the lower probe portion (21) and which surround other two side surfaces between the two side surfaces. When an external force is applied, the upper and lower probe side wall portions (12 and 22) are capable of being slid on each other while being in contact with each other.

An optical probe includes a core part and a clad part arranged along an outer circumference of the core part, and has an incident surface having a radius of curvature R through which an optical signal enters. The radius of curvature R and a central half angle ω at an incident point of the optical signal on the incident surface fulfil the following formulae using a radiation angle γ of the optical signal, an effective incident radius Se of the optical signal transmitted in the core part without penetrating into the clad part on the incident surface, a refractive index n(r) of the core part at the incident point, and a refracting angle β at the incident point:

R=Se/sin(ω)

ω=±sin.sup.−1{[K2.sup.2/(K1.sup.2+K2.sup.2)].sup.1/2}

where K1=n(r)×cos(β)−cos(γ/2) and K2=n(r)×sin(β)−sin(γ/2).

A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet.

A testing head for testing a device includes a couple of plate-like supports separated from each other by a suitable gap and provided with respective guide holes to slidably house a plurality of contact probes, each including a rod-like body extending along a preset longitudinal axis between a first and second ends, the first end being a contact tip that abuts a contact pad of the device and the second end being a contact head that abuts a contact pad of a space transformer. At least one of the supports comprises a couple of guides that are parallel to each other and separated by an additional gap and provided with corresponding guide holes. Each contact probe comprises a protruding element or stopper originating from a lateral wall and realized in correspondence of one wall of a guide hole of the guides contacting the lateral wall of the contact probe.

A testing head for functionality testing a device under test comprises a plurality of contact probes, each contact probe having a rod-like body having a preset length less than 5000 μm extending between a first and a second end, the second end being a contact tip and an opening extending all over its length and defining a plurality of arms, parallel to each other, separated by the opening and connected to the end portions of the contact probe, and an auxiliary guide, arranged transverse to the body and provided with suitable guide holes, the contact probes sliding through each of them, the auxiliary guide defining a gap including one end of the opening being a critical portion of the body and a zone more prone to breakings in the body undergoing low or even no bending stresses in the gap with respect to the rest of the body.

Disclosed is a test socket. The test socket includes a first block comprising a first base member of a conductive material and a first insulating member of an insulating material, a second block comprising a second base member of a conductive material and a second insulating member of an insulating material, a gap member of an insulating material, interposed between the first block and the second block, a first probe supported being in contact with the first base member and being not in contact with the second base member, a second probe supported being not in contact with the first base member and being in contact with the second base member, and electronic parts provided in the gap member and placed on a conductive path by which the first base member and the second base member are electrically connected.

A probe head for a testing apparatus integrated on a semiconductor wafer is disclosed having a first plurality of contact probes having a first transversal diameter, a second plurality of micro contact probes having a second transversal diameter, smaller than the first transversal diameter, and a flexible membrane having conductive tracks for connecting a first plurality contact probe with a corresponding second plurality micro contact probe. The second plurality contact probes are arranged between the testing apparatus and the flexible membrane, and the second plurality micro contact probes are arranged between the flexible membrane and a semiconductor wafer. The second plurality micro contact probes are configured to abut onto contact pads of a device under test integrated in the semiconductor wafer, with each first plurality contact probe being in contact with a corresponding second plurality micro contact probe through a conductive track of the flexible membrane to connect the device under test with the testing apparatus.

A contact probe for electronic tests includes an upper part having an end portion for contacting a first electronic component; a lower part having an end for contacting a second electronic component; and an elongated and deformable central body interposed between the upper and lower parts. The lower part has an enlarged head with a lower surface intended to rest at least partially onto a horizontal surface, the lower surface having an inclination angle from the horizontal surface onto which it rests when the probe is unbuckled and, when the probe is buckled, it can assume a position in which the lower surface moves to rest entirely onto the horizontal surface, thereby eliminating the inclination angle.

It is herein described a contact probe of a testing head of an apparatus for testing electronic devices comprising a probe body being essentially extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body and comprising an enlarged portion, projecting only in correspondence of a first side wall of the contact probe. Suitably, the at least one end portion further comprises at least one protrusion projecting from a second side wall, opposite to the first side wall and substantially extending toward the second and opposite wall along a longitudinal axis of the contact probe starting from the enlarged portion.

Provided is a probe head capable of reducing an inductance value of a ground probe. In a probe head 1, a pin plate 40, a pin block 50, and a solder resist film 60 are stacked in this order from a measuring instrument side to be integrally formed, and constitute a support body that supports a signal probe 10 and a first ground probe 20. The pin plate 40 is an insulator. The pin block 50 is a conductor, and is electrically connected to the first ground probe 20 and a measuring instrument-side ground, and is not electrically connected to the signal probe 10. The solder resist film 60 is provided on the surface of the pin block 50 on a side of a device to be inspected, and is interposed between the pin block 50 and the device to be inspected.