A testing system for testing an image sensor, includes a probe card, a pogo block receiving output signals of the probe card, an interface board configured to receive output signals of the pogo block, convert the received output signals of the pogo block, and output the converted signals through a cable, and a testing apparatus connected to the interface board through the cable. The testing apparatus is configured to test the device under test through signals received through the cable. The interface board includes an active interface module configured to amplify the received output signals of the pogo block, convert the amplified signals into signals having a same frequency as the received output signals of the pogo block, and transmit the converted signals to the cable.

A test apparatus (1) for test cards (37), comprising a receiving device (3) for holding at least one test card (37) to be tested, comprising at least one contact device (4) for making electrical touch contact with electrically conductive contact points of the at least one test card (37) in the receiving device (3), wherein the contact device (4) can be arranged vertically above the receiving device for the purpose of making touch contact, and comprising an actuating device (19), which is formed to displace the contact device (4) and the receiving device (3) relative to one another for the purpose of establishing the touch contact. It is provided that the receiving device (3) can be displaced by means of the actuating device (19) from a test position, which is located vertically below the contact device (4), into a loading and unloading position, which is laterally spaced apart from the contact device (4), and the other way round.

A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

A detection apparatus and an anti-bending device thereof are provided. The detection apparatus includes a probe card circuit board, at least one probe, and the anti-bending device. The probe card circuit board has a first board surface and a second board surface on opposite sides thereof The at least one probe is mounted on the first board surface. The anti-bending device includes an anti-bending frame, at least one sensor, a processing circuit, and a transmission part. The anti-bending frame is mounted on the second board surface of the probe card circuit board, and the at least one sensor is disposed on the anti-bending frame or the probe card circuit board. The processing circuit is disposed inside the anti-bending frame. The transmission part is mounted on the anti-bending frame, and is electrically coupled to the processing circuit.

A testing substrate includes a first build-up structure and a ceramic substrate. The ceramic substrate is arranged on the first build-up structure. The first bonding interface between the first build-up structure and the ceramic substrate includes a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface. A manufacturing method of a testing substrate and a probe card are also provided.

A circuit board has: an insulating substrate formed by plural ceramic insulating layers being layered on one another and having a first surface and a second surface on the opposite side to the first surface; a circuit conductor passing through the inside of the insulating substrate and positioned in a region from the first surface to the second surface; and at least one heating wire positioned in the insulating substrate. The heating wire is positioned in, among plural interlayer regions between the ceramic insulating layers, at least one interlayer region between the ceramic insulating layers and has a mesh shape having plural first through holes through which a portion of the circuit conductor passes and having plural second through holes through which the circuit conductor does not pass.

It is possible to make the free length of a contactor uniform even when the contactor is joined to a position that deviates from a joint position in a high-frequency conducting path and make contact with an electrode with stability, which improves measurement quality. A probe unit according to the present disclosure includes: a coaxial connector that is attached to a main body and gives and receives an electrical signal to and from a tester via a coaxial cable; a high-frequency conducting path that is connected to the coaxial connector and transmits an electrical signal; a plurality of contactors, each having a tip portion that makes electrical contact with an electrode of an object to be inspected and giving and receiving an electrical signal to and from the high-frequency conducting path; and a pedestal that is interposed between the contactor and the high-frequency conducting path, and the pedestal is provided in each contactor such that a free length of the contactor is a predetermined length.

A system includes a platform and a contactor. The platform has a side configured to support a frame with a carrier structure and electronic devices each having first and second sides and a terminal, the first side positioned on the carrier structure, and the terminal exposed in a first portion of the second side. The contactor has first and second sides, a contact and a heater. The contact is exposed on the first side of the contactor to contact the terminal in a first portion of the second side of a selected one of the electronic devices, and the heater is exposed on the first side of the contactor to apply heat to a second portion of the second side of the selected one of the electronic devices.

Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.

A probe pin is proposed. The probe pin includes a first plunger configured to come in contact with a testing target contact point of a testing object and a second plunger configured to come in contact with a testing contact point of a testing circuit, in which the first plunge or the second plunger has a stem extending with a predetermined cross-sectional area and a contact portion extending from the stem such that a cross-sectional area decreases, and having first second tips, which are configured to come in contact with the testing target contact point or the testing contact point, at a front end; and the first and second tips are formed in symmetric shapes at positions that are symmetric with a central axis of the stem therebetween.