A wafer test device and methods of assembling a wafer test device involve a first laminate structure, and a second laminate structure arranged to interface with a microcircuit of the wafer. The wafer test device includes a compliant layer between the first laminate structure and the second laminate structure. The compliant layer includes an elastomer that exhibits compliance within a limited range of movement.

A probe head for a testing apparatus integrated on a semiconductor wafer is disclosed having a first plurality of contact probes having a first transversal diameter, a second plurality of micro contact probes having a second transversal diameter, smaller than the first transversal diameter, and a flexible membrane having conductive tracks for connecting a first plurality contact probe with a corresponding second plurality micro contact probe. The second plurality contact probes are arranged between the testing apparatus and the flexible membrane, and the second plurality micro contact probes are arranged between the flexible membrane and a semiconductor wafer. The second plurality micro contact probes are configured to abut onto contact pads of a device under test integrated in the semiconductor wafer, with each first plurality contact probe being in contact with a corresponding second plurality micro contact probe through a conductive track of the flexible membrane to connect the device under test with the testing apparatus.

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

An anisotropic conductive sheet according to the present invention comprises an insulating layer and a plurality of conductive layers. The insulating layer is elastic, and has a first surface that is positioned on one side in the thickness direction, a second surface that is positioned on the other side in the thickness direction, and a plurality of through holes that penetrate the layer from the first surface to the second surface. The conductive layers are respectively arranged on the inner wall surfaces of the plurality of through holes. The insulating layer comprises an elastic layer that is formed of a crosslinked product of an elastomer composition, and a heat-resistant resin layer that is formed of a heat-resistant resin composition that has a higher glass transition temperature than the crosslinked product of an elastomer composition.

A sheet connector according to the present invention has: a first insulating layer having a first surface positioned on one side in the thickness direction, a second surface positioned on the other side, and a plurality of first through-holes passing through between the first surface and the second surface; and a plurality of first conductive layers arranged on the inner wall surfaces of the first through-holes. First ends of the first conductive layers on the first surface side project from the first surface.

A jig (30) includes a first block portion (100) at which a probe head (300) is installed, and a first suction port (112) formed on the first block portion (100). Air present on a side where one end of a probe (330) provided in the probe head (300) is located is sucked from the first suction port (112).

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped concave surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

A probe card device and a disposable adjustment film thereof are provided. The disposable adjustment film is integrally formed as a single one-piece structure, and includes a probe hole and a plurality of first slots that are parallel to each other. The disposable adjustment film defines two predetermined lines respectively extending from two opposite lateral edges thereof to the probe hole. The two predetermined lines respectively extend across the first slots. In a plane that the disposable adjustment film is located thereon, when the disposable adjustment film is applied with forces that act in opposite directions and that are parallel to any one of the first slots, the disposable adjustment film is broken into two abandoned films along the two predetermined lines.

An inspection jig includes: film-shaped wiring substrates each having one surface provided with an electrode; a pedestal that supports the wiring substrates which are laminated such that electrode regions are exposed, the electrode region being a region where the electrode is provided in each of the wiring substrates; and a plurality of probes which have base end portions in contact with the electrode regions and extend in a direction away from the electrode regions.

A probe installation circuit board includes an insulating layer provided on upper and lower surfaces thereof with a trace structure including two grounding traces and a signal trace located therebetween, and a grounding layer. Each grounding trace is connected with the grounding layer by at least one conductive via including a through hole penetrating through the grounding trace and the insulating layer, and a conductive layer disposed therein to electrically connect the grounding trace and layer. The signal trace and the conductive layers are made of a metal material. The grounding layer and traces are made of another metal material. A probe device includes the circuit board and three probes disposed on the traces respectively. The present invention is capable of thin copper traces and lowered trace surface roughness, easy in control of trace distance, width and thickness, and beneficial to achieve the fine pitch requirement.