An inspection socket includes: a pin block that is configured to support a contact probe in a manner of exposing a tip end of the contact probe from an exposed surface and inclining the contact probe in a predetermined direction relative to a direction perpendicular to the exposed surface; and a pressing portion that is configured to press an inspection target IC package that is to come into contact with the contact probe.

A semiconductor device for testing a semiconductor wafer includes a circuit board, a probe disposed below the circuit board and facing the semiconductor wafer, an integrated substrate disposed between the circuit board and the probe, and signal-transmitting module disposed on the circuit board and next to the integrated substrate. The probe is electrically coupled to the circuit board through the integrated substrate, and the signal-transmitting module transmits a test signal to the probe through the integrated substrate and the circuit board to perform a test to the semiconductor wafer. Another semiconductor device including the integrated substrate and a manufacturing method thereof are provided.

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped concave surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

An automated test equipment for testing one or more DUTs comprises a test head and a DUT interface. The DUT interface comprises a plurality of blocks of spring-loaded pins, for example groups or fields of spring-loaded pins. For example, the DUT interface is configured for establishing an electronic signal path between the test head and a DUT board or load board, which holds the DUT or which provides a connection to the DUT. The automated test equipment is configured to allow for a variation of a distance between at least two blocks of spring-loaded pins.

A verification probe system is configured to verify an automated test platform and includes: an integrated circuit test probe assembly; and a moveable platform configured to position the integrated circuit test probe assembly proximate one of more conductive pins included within a test socket assembly of the automated test platform.

A contact probe includes a first plunger, a contact terminal, and a conductive member. The first plunger is contactable with one of an electrode of a semiconductor device and a pad of a test jig. The contact terminal is contactable with the other of the electrode of the semiconductor device and the pad of the test jig. The conductive member covers a part of the first plunger. The conductive member and the first plunger are provided to bring an end portion of the first plunger and the contact terminal into a conduction state when the end portion of the first plunger is pressed by a force smaller than a predetermined force, and bring the end portion of the first plunger and the contact terminal into a nonconduction state when the end portion of the first plunger is pressed by a force equal to or larger than the predetermined force.

An automated test equipment for testing one or more DUTs comprises a test head and a DUT interface. The DUT interface comprises a plurality of blocks of spring-loaded pins, for example groups or fields of spring-loaded pins. For example, the DUT interface is configured for establishing an electronic signal path between the test head and a DUT board or load board, which holds the DUT or which provides a connection to the DUT. The automated test equipment is configured to allow for a variation of a distance between at least two blocks of spring-loaded pins.

The invention relates to a contact device (1) for contacting an electrical contact point of a test object, comprising a contact plunger (3), which has a plunger shaft (4) for mounting in a guide sleeve (2) in an axially displaceable manner as well as a contact head (5) which is assignable to the test object and arranged on a free end of the plunger shaft (4), and comprising at least one contact element (13), which is movably mounted on and/or in the contact head (5), whereby at least one spring element (6), which is elastically deformable against its spring force by means of the contact element (13) under a load resulting from a contact, is assigned to the contact element (13). is provided that several of the contact elements (13), which in each case have a contact area (14) for contacting, are arranged next to one another on the contact head (5) in such a way that the contact areas (14) form an at least essentially continuous contact surface (15) of the contact head (5) for the contact point in the unloaded state.

A probe head that contains a coining surface and a plurality of probe tips integrated on a same side of the probe head is provided. The probe head has a first portion and a laterally adjacent second portion, wherein the first portion of the probe head contains the coining surface, and the second portion of the probe head contains the plurality of the probe tips. Each probe tip may, in some embodiments, extend outwards from a probe pedestal that is in contact with the second portion of the probe head. The probe head is traversed across the surface of a semiconductor wafer containing a plurality of solder bump arrays such that the coining surface contacts a specific array of solder bumps prior to contacting of the same specific array of solder bumps with the probe tips.