A power control integrated circuit (IC) chip can include a direct current (DC)-DC converter that outputs a switching voltage in response to a switching output enable signal. The power control IC chip can also include an inductor detect circuit that detects whether an inductor is conductively coupled to the DC-DC converter and a powered circuit component in response to an inductor detect signal. The power control IC chip can further include control logic that (i) controls the inductor detect signal based on an enable DC-DC signal and (ii) controls the switching output enable signal provided to the DC-DC converter and a linear output disable signal provided to a linear regulator based on a signal from the inductor detect circuit indicating whether the inductor is conductively coupled to the DC-DC converter and the powered circuit component.

A method for obtaining board parameters of a printed circuit board, including the following steps: obtaining parameter information of a stripline on the printed circuit board; obtaining physical parameters of the stripline based on the parameter information of the stripline and a predetermined electromagnetic simulation application; calculating required board parameters of the printed circuit board based on the parameter information and the physical parameters of the stripline. In the present disclosure, the physical parameters of the stripline are obtained based on the physical nature of the stripline on the printed circuit board, and there is no need for fitting or adopting a hypothetical model in order to obtain board parameters corresponding to each frequency point of the stripline; the present disclosure is simple and straightforward during operation, and the obtained board parameters of the printed circuit board are highly accurate.

An electronic device and a method for operating an electronic device are provided. The electronic device includes a first circuit board, a second circuit board, a signal line connecting the first circuit board and the second circuit board, a processor disposed on the first circuit board and outputting a pulse signal through the signal line, a parasitic capacitance pattern disposed around the signal line and generating a parasitic capacitance by the pulse signal, and an amplifier disposed on the second circuit board and amplifying a signal generated by the parasitic capacitance, wherein the processor identifies whether the signal line is abnormal, based on the amplified signal obtained from the amplifier.

In a general aspect, a wire bonding apparatus can include a supply of bond wire, a wire bonding head, and an electrical continuity tester. The wire bonding head can including a wire cutter. The wire cutter can be electrically conductive. The electrical continuity tester can be coupled between the supply of bond wire and the wire cutter.

A method of debugging a printed circuit board with at least one boundary-scan compliant device is presented. The method uses an electronic processing unit and includes the steps of: retrieving boundary-scan properties of the at least one boundary-scan compliant device, the properties including a listing of boundary-scan compliant circuit terminals of the at least one boundary-scan compliant device; retrieving connectivity properties; selecting and displaying a circuit graph of at least a part of the devices mounted on the printed circuit board, the circuit graph including at least one of the devices mounted on the printed circuit board and a least one further device from the devices which has a circuit terminal interconnected to a circuit terminal of the device for visualizing at least the device, the further device and interconnects between the circuit terminals of the devices.

Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

A method and system of compensating for component mismatch are disclosed. An example system comprises an amplifier including a current ratio measurement engine (CRME) and a modulator (DSM). The CRME is configured to obtain measurements for each possible configuration of an amplifier circuit and to pass these measurements to a processor for analysis. In the example system, the measurements are obtained by driving a bias current through two or more circuit elements and measuring the ratio in current between the two or more circuit elements, which is representative of the relative mismatch between the two or more components. The DSM is configured to receive adjustment parameters from the processor and to tune the amplifier circuit according to the adjustment parameters to thereby improve the performance of the amplifier.

An apparatus is provided for testing a PCIe interface on a printed circuit assembly. The apparatus can include a plurality of electrical contacts to couple to a PCIe interface of the printed circuit assembly, wherein a respective electrical contact corresponds to a pin of the PCIe interface. The apparatus can also include a plurality of resistors. Each resistor is coupled between two adjacent electrical contacts. At least one electrical contact corresponds to a ground, power, or not connected (NC) pin of the PCIe interface, thereby allowing a loopback test to determine connectivity between the pins of the PCIe interface and the printed circuit assembly.

A charging pile, and a device, system and method for testing a charging pile are provided. An inner side of a port of one of the gun bases is connected to an inner side of the same port of the other of the gun bases. An outer side of each port of each gun base connected to a port of a charging gun connected to the gun base, so that the two charging guns are connected. In addition, one of the two charging guns operates in the forward output state and serves as tested gun to be tested. The other of the two charging guns operates in the reverse conversion state and serves as a testing gun to test the tested gun. The gun base controller saves and exports the communication data on the communication bus between the two charging guns.

The present disclosure describes a method for analyzing signal waveforms produced by integrated circuits. The method includes determining characteristic points of a control signal, and each characteristic point includes a corresponding time value and represents an edge change of the control signal. The method also includes determining sets of data sampling points. Each set of data sampling points is located between adjacent characteristic points of the characteristic points. The method further includes obtaining data values of a signal waveform, and a data value of the signal waveform is obtained at a data sampling point of the sets of data sampling points. The method further includes obtaining data values of a reference waveform, and a data value of the reference waveform is obtained at the data sampling point and determining a difference between the data value of the signal waveform and the data value of the reference waveform.