A remote control device testing environment evaluates operational performance of physical implementations of remote control devices. This operational performance of the physical implementations of the remote control devices allows the integrated circuits of the remote control devices as well as integrated circuit interfaces electrically coupling these integrated circuits to each other to be evaluated. Additionally, the interconnection, such as electrical coupling to provide an example, between these integrated circuits and/or the integrated circuit interfaces can be evaluated which otherwise would not be evaluated by software simulation alone. Moreover, the evaluating of this operational performance of the physical implementations of the remote control devices allows these remote control devices to be in evaluated in a real world environment with exposure to various environmental factors, such as temperature, humidity, and/or electromagnetic interference to provide some examples. Furthermore, the evaluating of this operational performance of the physical implementations of the remote control devices allows interactions between these remote control devices and other electronic devices to be evaluated.

A testing apparatus for testing electrical components and/or conductor track structures. The testing apparatus includes: a multiplicity of testing locations, each receiving an electrical component and/or a conductor track structure; a selection device for selecting one of the testing locations; electrical lines disposed in rows and electrical lines disposed in columns for the supply of an alternating voltage to the component or structure, situated at the selected testing location; Z diodes for the electrical connection of the respective component and/or structure at the respective testing location via one of the Z diodes to one of the rows of electrical lines; a signal generator developed to generate a test signal that has a voltage signal as the sum of a square wave signal and a wave-shaped signal; and an electromigration device for applying a direct voltage signal to the components and/or structures to bring about electromigration in the components and/or structures.

There is provided fiber-coaxial amplifier device (10) comprising at least one output (14) and a test point (26) associated with the at least one output (14), wherein alternative first and second electrical paths (36, 38) are connectable to the at least one output (14), the first path (36) connectable to the at least one output (14) whilst bypassing the test point, the second path (38) connectable to both the at least one output (14) and the test point (26), and a relay (30) operable to connect one of the first path or the second path to the at least one output (14). The fiber-coaxial amplifier device (10) is configured for signals complying with Extended Spectrum DOCSIS.

A method is provided for transmission rate adaptation of one or more data units, the method including: receiving, by an adapter, the adapter including an adaptation circuitry, a plurality of data units according to a first transmission rate and at least one delay character separating two consecutive data units; and transmitting, by the adapter, each of the plurality of data units received according to a second transmission rate, wherein the second transmission rate is determined based on the at least one delay character received.

A test card and a test display adapter are disclosed. The test card includes an assembling plate and an electrical heat source. The electrical heat source is provided on the assembling plate. The electrical heat source includes a first heat transfer plate, a second heat transfer plate and at least one heat source element. The first heat transfer plate is stacked on the assembling plate, and the second heat transfer plate is laminated over the first heat transfer plate, with the heat source element being sandwiched between the first and second heat transfer plates. The test card and the test display adapter have a wide variety of advantages including very low cost, easy material availability, a short wait time, easy manufacturability, a long service life, easy modifiability and good interoperability.

A testing apparatus for Data Storage Devices (DSDs) includes a chassis and at least one interface module configured to be removably inserted into the chassis and house a plurality of interface boards. Each interface board includes a DSD connector for connecting a DSD to the interface board and a backplane connector for connecting to a backplane for communicating with a respective computing unit. In one aspect, the at least one interface module includes a housing and a plurality of openings in a side of the housing with each opening configured to receive a respective interface board. A plurality of guide member pairs is positioned to guide respective interface boards when inserted into respective openings such that the backplane connector is located at a respective predetermined location for connecting to the backplane. In another aspect, the interface boards are removable from the interface module.

A self-test system for PCIe and a method thereof are disclosed. In the system, a first circuit interconnect card and a second circuit interconnect card are inserted into CEM slots, respectively, and the first circuit interconnect card and the second circuit interconnect card are electrically connected to each other through a FFC, the central processing unit generates and provides differential signals to the first circuit interconnect card and the second circuit interconnect card; the first circuit interconnect card or the second circuit interconnect card provide differential signals to the second circuit interconnect card or the first circuit interconnect card through the first FFC interface and the second FFC interface, respectively, and the second circuit interconnect card or the first circuit interconnect card provides the differential signals to a central processing unit, so as to implement self-check for PCIe.

A system and method are disclosed for formulating a sequential equivalency problem for fault (non)propagation with minimal circuit logic duplication by leveraging information about the location and nature of a fault. The system and method further apply formal checking to safety diagnoses and efficiently models simple and complex transient faults.

A system and method for formulating a sequential equivalency problem for fault (non)propagation with minimal circuit logic duplication by leveraging information about the location and nature of a fault. The system and method further apply formal checking to safety diagnoses and efficiently models simple and complex transient faults.

The present application discloses a testing device of array substrates and a testing method. The testing device of array substrates includes: a machine and testing interfaces, the testing interfaces being disposed on the machine; and testers disposed above the machine. There are at least two sets of testers, and the testers synchronously operate according to a preset scheme.