One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.

In some embodiments, a semiconductor wafer testing system is provided. The semiconductor wafer testing system includes a semiconductor wafer prober having one or more conductive probes, where the semiconductor wafer prober is configured to position the one or more conductive probes on an integrated chip (IC) that is disposed on a semiconductor wafer. The semiconductor wafer testing system also includes a ferromagnetic wafer chuck, where the ferromagnetic wafer chuck is configured to hold the semiconductor wafer while the wafer prober positions the one or more conductive probes on the IC. An upper magnet is disposed over the ferromagnetic wafer chuck, where the upper magnet is configured to generate an external magnetic field between the upper magnet and the ferromagnetic wafer chuck, and where the ferromagnetic wafer chuck amplifies the external magnetic field such that the external magnetic field passes through the IC with an amplified magnetic field strength.

Examples disclosed herein relate to a on-chip or built-in self-test (BIST) module for an RFIC including means to up-convert a signal from a test frequency to RF at an input to the RFIC and down-convert and output signal.

A probe card includes a sub-board, having a heating layer, connected to a probe pin. A main board is connected to the sub-board and includes a first output terminal configured to output first power received from a first power supply to the heating layer in a first mode. A power converter is configured to lower a first voltage corresponding to residual power received from the first power supply to a second voltage and output the residual power in a second mode. A second output terminal is configured to receive the residual power from the power converter and second power from a second power supply and output third power including the residual power and the second power to a device under test in the second mode. A first switch unit is connected to the first power supply, the first output terminal, and the power converter.

A stage on which an inspection object having an electronic device against which a contact terminal of a probe card of an inspection apparatus is pressed by a load applied thereto is placed, includes a first cooling plate including a first coolant flow path formed therein, a heating source mounted on the first cooling plate and including a plurality of light emitting elements so as to heat the inspection object, a transparent member provided on the heating source and transmitting light output from the heating source, a second cooling plate provided on the transparent member so as to hold the inspection object and including a second coolant flow path formed therein, and a transparent resin layer filled between the first cooling plate and the transparent member so as to cover the heating source.

A test apparatus for devices having fine pitches, includes a loading picker provided on one side of a loading part so as to sequentially adsorb devices to be tested, thereby putting the adsorbed devices on the upper surface of a vacuum chuck, a device alignment part, which is provided at an upper portion of a loading zone for aligning the devices, tester for testing a performance of the devices for a set time as the vacuum chuck positioned in the test position moves and comes into electrical contact with bumps of respective devices, and an unloading picker, which is provided at one side of an unloading zone so as to adsorb tested devices from the vacuum chuck, sorts the tested devices into good products and bad products, and unloads the tested devices as sorted on a tray of an unloading part.

An inspection apparatus includes a load port area in which a carrier accommodation chamber for accommodating a carrier that receives an inspection object is disposed; an inspection area in which a plurality of probe cards are respectively disposed under a plurality of inspection devices, and in which the probe card is pressed against an electronic device of the inspection object on a chuck top to inspect the electronic device; a transfer area in which a transfer mechanism transfers the inspection object onto the chuck top; and a plurality of probe card accommodation devices disposed in at least one of the load port area or the inspection area, each probe card accommodation device being capable of accommodating the probe card, and a number of the probe card accommodation devices being equal to or greater than a number of the probe cards.

An over-the-air (OTA) measurement system is described. The OTA measurement system includes a plurality of measurement antennas, a DUT positioner, and a controller (e.g., control circuit). The DUT positioner is configured to position a device under test at a test location. At least two measurement antennas of the plurality of measurement antennas are arranged at different distances from the test location. The at least two measurement antennas are arranged at different elevation angles and/or at different azimuth angles with respect to the test location. The controller is configured to control the DUT positioner to rotate the device under test at the test location in azimuth and/or elevation. The controller is configured to control the DUT positioner to rotate the device under test into a first orientation for a first OTA power measurement by a first one of the at least two measurement antennas. The controller is configured to control the DUT positioner to rotate the device under test into a second orientation for a second OTA power measurement by a second one of the at least two measurement antennas. A relative orientation between the device under test in the first orientation and the first one of the at least two measurement antennas is the same as a relative orientation between the device under test in the second orientation and the second one of the at least two measurement antennas. Further, an OTA measurement method for performing OTA measurements on a device under test by an OTA measurement system is described.

A probe card includes a sub-board, having a heating layer, connected to a probe pin. A main board is connected to the sub-board and includes a first output terminal configured to output first power received from a first power supply to the heating layer in a first mode. A power converter is configured to lower a first voltage corresponding to residual power received from the first power supply to a second voltage and output the residual power in a second mode. A second output terminal is configured to receive the residual power from the power converter and second power from a second power supply and output third power including the residual power and the second power to a device under test in the second mode. A first switch unit is connected to the first power supply, the first output terminal, and the power converter.

The present invention relates to a method for open-loop or closed-loop control of the temperature of a chuck for a wafer, comprising the steps of: detecting the position of a test means for testing a wafer; determining the spatial distances between the test means and a plurality of temperature measurement means for measuring the temperature of the chuck or of a wafer supported or clamped by the chuck; selecting at least one temperature measurement means from the plurality of temperature measurement means as a reference temperature measurement means; controlling the temperature of the chuck by means of open-loop or closed-loop control on the basis of the temperature(s) of the chuck or wafer as measured by the selected one or more reference temperature measurement means.