A computer-implemented method for assessing at least one printed circuit board includes receiving input data based on testing data of a printed circuit board, wherein the testing data represent in-circuit test testing data and include measurement data of a plurality of electronic components of the printed circuit board, applying a trained classification function to the input data, and generating and providing output data. The output data include an assignment of at least one of the electronic components to one of at least two different classes.

A core partition circuit comprises a first decompression circuit, a second decompression circuit, a first switching circuit, an wrapper scanning circuit, a first compression circuit, a second compression circuit and a second switching circuit. The first and second decompression circuits decompress an input signal. The first switching circuit outputs the output signal of the first decompression circuit or the second decompression circuit according to a first control signal. The wrapper scanning circuit receives the output signal of the first decompression circuit or the second decompression circuit to scan the internal or the port of the core partition circuit. The first and second compression circuits respectively compress the internal logic and the port logic of the core partition circuit. The second switching circuit outputs the compressed internal logic or port logic of the core partition circuit according to the first control signal.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

The invention is a test system for testing silicon wafers or packaged devices. The system includes a tester having multiple testing stacks that each hold a vertical stack of test engines, data buffers, pin drivers, and other resources, which are electrically connected on one side to a wafer or DUT and on the other side to a test host computer via fast data links. Each testing stack is disposed on a top side of a wafer contactor electrically connected to a wafer or a load board electrically connected to a DUT. The system includes a cooling system to remove heat during operation. The system minimizes the data signal path between the pads of the devices being tested and the pin drivers of the tester, the test engines, and the test host computer. High performance is possible by the connection of bottom of each testing stack directly to the wafer contactor.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

In various examples, a test system is provided for executing built-in-self-test (BIST) according to JTAG and IEEE 1500 on chips deployed in-field. Hardware and software selectively connect onto the IEEE 1500 serial interface for running BIST while the chip is being used in deployment—such as in an autonomous vehicle. In addition to providing a mechanism to connect onto the serial interface, the hardware and software may reduce memory requirements and runtime associated with running the test sequences, thereby making BIST possible in deployment. Furthermore, some embodiments include components configured to store functional states of clocks, power, and input/output prior to running BIST, which permits restoration of the functional states after the BIST.

In various examples, a test system is provided for executing built-in-self-test (BIST) according to JTAG and IEEE 1500 on chips deployed in-field. Hardware and software selectively connect onto the IEEE 1500 serial interface for running BIST while the chip is being used in deployment—such as in an autonomous vehicle. In addition to providing a mechanism to connect onto the serial interface, the hardware and software may reduce memory requirements and runtime associated with running the test sequences, thereby making BIST possible in deployment. Furthermore, some embodiments include components configured to store functional states of clocks, power, and input/output prior to running BIST, which permits restoration of the functional states after the BIST.

In various examples, a test system is provided for executing built-in-self-test (BIST) according to JTAG and IEEE 1500 on chips deployed in-field. Hardware and software selectively connect onto the IEEE 1500 serial interface for running BIST while the chip is being used in deployment—such as in an autonomous vehicle. In addition to providing a mechanism to connect onto the serial interface, the hardware and software may reduce memory requirements and runtime associated with running the test sequences, thereby making BIST possible in deployment. Furthermore, some embodiments include components configured to store functional states of clocks, power, and input/output prior to running BIST, which permits restoration of the functional states after the BIST.