A semiconductor integrated circuit (IC) comprising a signal path combiner, comprising a plurality of input paths and an output path. The IC comprises a delay circuit having an input electrically connected to the output path, the delay circuit delaying an input signal by a variable delay time to output a delayed signal path. The IC may comprise a first storage circuit electrically connected to the output path and a second storage circuit electrically connected to the delayed signal path. The IC comprises a comparison circuit that compares outputs of the signal path combiner and the delayed signal, wherein the comparison circuit comprises a comparison output provided in a comparison data signal to at least one mitigation circuit.

An error rate measuring apparatus includes a data transmission unit that transmits a test signal of a known pattern and a parameter value defined by a communication standard to a device under test, and a bit error measurement unit that measures a bit error of a signal transmitted from the device under test. The data transmission unit sequentially changes the parameter value and transmits the parameter value to the device under test. The bit error measurement unit measures a bit error of a signal transmitted from the device under test corresponding to the parameter value. The error rate measuring apparatus further includes a discrimination unit that discriminates a parameter value at which the number of bit errors is the least in a measurement result of the bit error measurement unit, as an optimum value of emphasis of an output waveform of the device under test.

An error rate measuring apparatus includes a data transmission unit that transmits a test signal of a known pattern and a parameter value defined by a communication standard to a device under test, and a bit error measurement unit that measures a bit error of a signal transmitted from the device under test. The data transmission unit sequentially changes the parameter value and transmits the parameter value to the device under test. The bit error measurement unit measures a bit error of a signal transmitted from the device under test corresponding to the parameter value. The error rate measuring apparatus further includes a discrimination unit that discriminates a parameter value at which the number of bit errors is the least in a measurement result of the bit error measurement unit, as an optimum value of emphasis of an output waveform of the device under test.

A ground fault detection circuit can include a band-pass filter that can have a first node and a second node that can be coupled to an earth ground. The first node can be coupled to a local ground of an automatic test equipment (ATE) system for an electrical device that can be coupled via at least one wire to the ATE. The band-pass filter can be configured to pass and amplify a test current signal established at the first node in response to a coupling of one of a conductor of the at least one wire carrying the test current signal to the local ground, and a conductive element of the electrical device carrying the test current signal to the local ground. A fault alert signal can be provided to provide an indication of ground fault based on a comparison of the amplified test current signal.

A wafer test system includes a probe apparatus, a data server, an automation subsystem, and a probe mark assessment subsystem. The probe apparatus includes a probe card, a tester, and a camera. The probe card includes probe pins for contacting test pads in the wafer, and the camera captures an image of the test pads. The automation subsystem obtains an image specification from the probe apparatus and triggers an automated assessment of a probe mark in the image of the test pads. The probe mark assessment subsystem performs the automated assessment of the probe mark in the image of the test pads. The probe mark assessment subsystem performs an image-processing operation to obtain a probe mark assessment result, and the automation subsystem stops the probe apparatus if the probe mark assessment result indicates a probe test failure.

An integrated circuit die includes a core fabric configurable to include an aging measurement circuit and a device manager coupled to the core fabric to operate the aging measurement circuit for a select period of time. The aging measurement circuit includes a counter to count transitions of a signal propagating through the aging measurement circuit during the select period of time when the aging measurement circuit is operating. The transitions of the signal counted by the counter during the select period of time are a measure of an aging characteristic of the integrated circuit die.

A self-test mechanism within an integrated circuit to test for faulty operation of a clock monitor unit implemented within the integrated circuit for monitoring a clock signal. The mechanism intentionally injects faults into the clock monitor unit to evaluate if the clock monitor unit is operating in accordance with its specified operating parameters. The injected faults are intended to cause the clock monitor unit to determine that the clock signal is operating outside of an artificially generated, imaginary specified frequency range. If the injected faults do not cause the clock monitor unit to determine that the clock signal is operating both above and below the artificially generated, imaginary specified frequency range, then the clock monitor unit is not functioning according to specified operating parameters.

A testing system for monitoring a machine under test is disclosed and includes one or more high frequency sensors configured to generate a sensor signal that is representative of an operating parameter of the machine. The high frequency sensors have a required high frequency sampling rate. The testing system also includes a notification device configured to generate a notification indicating the operating parameter monitored by the high frequency sensors has exceeded a predefined threshold value and a data acquisition control module configured to monitor the high frequency sensors at a first sampling rate. The testing system also includes a monitoring control module in electronic communication with the notification device. The monitoring control module is configured to monitor the high frequency sensors at a second sampling rate that is greater than the first sampling rate and at least equal to the required high frequency sampling rate.

A method includes mapping an aging measurement circuit (AMC) into the core fabric of an FPGA and operating the AMC for a select time period. During the select period of time, the AMC counts transition of a signal propagating through the AMC. Timing information based on the counted transitions is stored in a timing model in a memory. The timing information represents an aging characteristic of the core fabric at a time that the AMC is operated. An EDA toolchain uses the timing information in the timing model to generate a timing guard-band for the configurable IC die. The AMC is removed from the core fabric and another circuit device is mapped and fitted into the core fabric using the generated timing guard-band models. The circuit device is operated in the configurable IC die based on the timing guard-band models.

A control system, that includes a primary controller and various auxiliary controllers, is configured to facilitate a built-in self-test (BIST) of a system-on-chip (SoC). The primary controller is configured to initiate a BIST sequence associated with the SoC. Based on the BIST sequence initiation, each auxiliary controller is configured to schedule execution of various self-test operations on various functional circuits, various memories, and various logic circuits of the SoC by various functional BIST controllers, various memory BIST controllers, and various logic BIST controllers of the SoC, respectively. Based on the execution of the self-test operations, each auxiliary controller further generates various status bits with each status bit indicating whether at least one functional circuit, at least one memory, or at least one logic circuit is faulty. Based on the status bits generated by each auxiliary controller, a fault diagnosis of the SoC is initiated.