H01C17/0658

GRAPHENE/CARBON NANOSTRUCTURE HEATING ELEMENT

An article includes a substrate and a resistance heating element bonded to the substrate. The resistance heating element is comprised of, by weight, 10 to 45% of graphene, 0.25 to 45% of carbon nanostructure (CNS) material different than the graphene, and a remainder of glass frit. The graphene and the CNS material include a coupling agent that bonds the graphene and the CNS material with at least the glass frit.

Device for Voltage Equalisation in Square Wave Voltages for an Electric Motor

Various embodiments of the teachings herein include an apparatus for voltage equalization in square-wave voltages of electric motors. The apparatus may include: a terminal board circuit wherein phases U, V, and W each comprises input and output cabled conductors summing to at least 6 cables; and a bridge between two of the at least six cables connecting two or more of the at least 6 cable inputs and outputs. The bridge is partially conductive such that its electrical resistance markedly reduces above a threshold value. The partial conductivity results from filler particles in an embedding matrix determining a reduction of the resistance in the bridge above the threshold value.

Graphene/polymer heterostructure-based flexible and biocompatible pressure/strain sensor

Pressure/strain piezoresistive are described that include a poled piezoelectric polymer such as PVDF or P(VDF-TrFE) and graphene. The poled piezoelectric polymer and the graphene are electronically coupled to form a heterojunction and provide an ultra-high sensitivity pressure/strain sensor. The sensors can be carried on a flexible supporting substrate such as PDMS or PET to exhibit high flexibility. The materials of formation can be biocompatible and the sensors can be wearable or implantable.

Graphene/Polymer Heterostructure-Based Flexible and Biocompatible Pressure/Strain Sensor
20200400514 · 2020-12-24 ·

Pressure/strain piezoresistive are described that include a poled piezoelectric polymer such as PVDF or P(VDF-TrFE) and graphene. The poled piezoelectric polymer and the graphene are electronically coupled to form a heterojunction and provide an ultra-high sensitivity pressure/strain sensor. The sensors can be carried on a flexible supporting substrate such as PDMS or PET to exhibit high flexibility. The materials of formation can be biocompatible and the sensors can be wearable or implantable.

Circuit protection assembly

A circuit protection assembly has a protection element having a positive temperature coefficient of resistance and consisting of a polymer-based conductive composite material layer tightly clamped and fixed between two metal electrodes and a copper clad laminate having a through hole in a middle thereof, wherein the protection element is provided in the through hole, the copper clad laminate serves as a substrate for the circuit protection assembly and has an adhesive layer on an upper surface and a lower surface thereof, so as to cover the protection element in a space formed by the copper clad laminate and the upper and the lower adhesive layers. The protection element having a positive temperature coefficient of resistance is electrically connected to a protected circuit via a conductive part.

Dielectric material

Provided are a novel dielectric material and a novel electrostrictive material. The dielectric material or electrostrictive material comprises a charge-separation type non-coulombic ionic solid in which complex cations each composed of a metal element and a ligand are aggregated to form cation clusters, the cation clusters are arranged in a closest packed structure, and anions are aggregated to form anion clusters in interstices of the closest packed structure.

Circuit protection assembly
20190306970 · 2019-10-03 ·

A circuit protection assembly has a protection element having a positive temperature coefficient of resistance and consisting of a polymer-based conductive composite material layer tightly clamped and fixed between two metal electrodes and a copper clad laminate having a through hole in a middle thereof, wherein the protection element is provided in the through hole, the copper clad laminate serves as a substrate for the circuit protection assembly and has an adhesive layer on an upper surface and a lower surface thereof, so as to cover the protection element in a space formed by the copper clad laminate and the upper and the lower adhesive layers. The protection element having a positive temperature coefficient of resistance is electrically connected to a protected circuit via a conductive part.

NOVEL DIELECTRIC MATERIAL

Provided are a novel dielectric material and a novel electrostrictive material. The dielectric material or electrostrictive material comprises a charge-separation type non-coulombic ionic solid in which complex cations each composed of a metal element and a ligand are aggregated to form cation clusters, the cation clusters are arranged in a closest packed structure, and anions are aggregated to form anion clusters in interstices of the closest packed structure.